MEMS integrated pressure sensor devices and methods of forming same
First Claim
1. A micro-electromechanical (MEMS) device comprising:
- a device substrate comprising;
a membrane for a pressure sensor, wherein a first surface of the membrane is exposed to a sealed pressure level of a first cavity and a second surface of the membrane is exposed to an ambient pressure level; and
a first MEMS structure over and aligned with the membrane for the pressure sensor;
a cap over first MEMS structure and bonded to the device substrate by a plurality of eutectic bonds, wherein the first cavity is at least partially defined by the plurality of eutectic bonds bonding the cap to the device substrate; and
a carrier bonded to an opposing side of the device substrate as the cap.
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Abstract
A method embodiment includes providing a micro-electromechanical (MEMS) wafer including a polysilicon layer having a first and a second portion. A carrier wafer is bonded to a first surface of the MEMS wafer. Bonding the carrier wafer creates a first cavity. A first surface of the first portion of the polysilicon layer is exposed to a pressure level of the first cavity. A cap wafer is bonded to a second surface of the MEMS wafer opposite the first surface of the MEMS wafer. The bonding the cap wafer creates a second cavity comprising the second portion of the polysilicon layer and a third cavity. A second surface of the first portion of the polysilicon layer is exposed to a pressure level of the third cavity. The first cavity or the third cavity is exposed to an ambient environment.
42 Citations
19 Claims
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1. A micro-electromechanical (MEMS) device comprising:
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a device substrate comprising; a membrane for a pressure sensor, wherein a first surface of the membrane is exposed to a sealed pressure level of a first cavity and a second surface of the membrane is exposed to an ambient pressure level; and a first MEMS structure over and aligned with the membrane for the pressure sensor; a cap over first MEMS structure and bonded to the device substrate by a plurality of eutectic bonds, wherein the first cavity is at least partially defined by the plurality of eutectic bonds bonding the cap to the device substrate; and a carrier bonded to an opposing side of the device substrate as the cap. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A micro-electromechanical (MEMS) device comprising:
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a device portion comprising; a polysilicon layer having a first portion providing a membrane 128 for a pressure sensor; and a first MEMS structure over and aligned with the membrane; a cap over bonded to a first side of the device portion, the device portion and the cap defining a first sealed cavity, a first surface of the membrane is disposed in the first sealed cavity, the cap comprising; a region extending laterally past the device portion; and an input/output contact in the region of the cap; and a carrier bonded to an opposing side of the device portion as the cap, an opening through the carrier exposing a second surface of the membrane to ambient. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A micro-electromechanical (MEMS) device comprising:
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a device substrate comprising; a membrane for a pressure sensor; and a first MEMS structure over and aligned with the membrane for the pressure sensor; a cap over the first MEMS structure and bonded to the device substrate by a plurality of eutectic bonds, wherein a first surface of the membrane is exposed to a sealed pressure level of a first cavity, the first cavity extends into the cap; and a carrier bonded to an opposing side of the device substrate as the cap, and a second surface of the membrane is exposed to an ambient pressure level through an opening in the carrier. - View Dependent Claims (16, 17, 18, 19)
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Specification