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MEMS integrated pressure sensor devices and methods of forming same

  • US 10,508,029 B2
  • Filed: 06/29/2018
  • Issued: 12/17/2019
  • Est. Priority Date: 03/14/2013
  • Status: Active Grant
First Claim
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1. A micro-electromechanical (MEMS) device comprising:

  • a device substrate comprising;

    a membrane for a pressure sensor, wherein a first surface of the membrane is exposed to a sealed pressure level of a first cavity and a second surface of the membrane is exposed to an ambient pressure level; and

    a first MEMS structure over and aligned with the membrane for the pressure sensor;

    a cap over first MEMS structure and bonded to the device substrate by a plurality of eutectic bonds, wherein the first cavity is at least partially defined by the plurality of eutectic bonds bonding the cap to the device substrate; and

    a carrier bonded to an opposing side of the device substrate as the cap.

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