Method and apparatus for processing a substrate
First Claim
1. A method of processing a surface of a substrate while holding the substrate with a substrate holder including a first holding member and a second holding member, the second holding member having an opening, said method comprising:
- holding the substrate with the substrate holder by sandwiching the substrate between the first holding member and the second holding member, with the surface of the substrate being exposed through the opening of the second holding member, and pressing a sealing ridge of the substrate holder against a peripheral portion of the substrate to form an internal space in the substrate holder;
pressing a sealing block against the substrate holder to cover the sealing ridge, to form an external space defined by the substrate holder, the exposed surface of the substrate, and the sealing block;
forming a vacuum in the external space to create a pressure difference between the internal space and the external space;
performing a seal inspection to check a sealed state provided by the sealing ridge based on a change in pressure in the external space; and
performing a pre-wetting treatment by supplying a pre-wetting liquid to the external space while evacuating air from the external space to bring the pre-wetting liquid into contact with the exposed surface of the substrate.
1 Assignment
0 Petitions
Accused Products
Abstract
A method which can perform a soft pre-wetting treatment of a substrate, such as a wafer, with use of a pre-wetting liquid in a smaller amount. This method includes: holding a substrate between a first holding member and a second holding member, with the surface of the substrate being exposed through an opening of the second holding member, and pressing a sealing ridge of the substrate holder against a peripheral portion of the substrate; pressing a sealing block against the substrate holder; forming a vacuum in an external space; performing a seal inspection to check a sealed state provided by the sealing ridge based on a change in pressure in the external space; and performing a pre-wetting treatment by supplying a pre-wetting liquid to the external space while evacuating air from the external space to bring the pre-wetting liquid into contact with the exposed surface of the substrate.
2 Citations
7 Claims
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1. A method of processing a surface of a substrate while holding the substrate with a substrate holder including a first holding member and a second holding member, the second holding member having an opening, said method comprising:
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holding the substrate with the substrate holder by sandwiching the substrate between the first holding member and the second holding member, with the surface of the substrate being exposed through the opening of the second holding member, and pressing a sealing ridge of the substrate holder against a peripheral portion of the substrate to form an internal space in the substrate holder; pressing a sealing block against the substrate holder to cover the sealing ridge, to form an external space defined by the substrate holder, the exposed surface of the substrate, and the sealing block; forming a vacuum in the external space to create a pressure difference between the internal space and the external space; performing a seal inspection to check a sealed state provided by the sealing ridge based on a change in pressure in the external space; and performing a pre-wetting treatment by supplying a pre-wetting liquid to the external space while evacuating air from the external space to bring the pre-wetting liquid into contact with the exposed surface of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification