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Semiconductor devices and methods for forming the same

  • US 10,510,878 B1
  • Filed: 06/13/2018
  • Issued: 12/17/2019
  • Est. Priority Date: 06/13/2018
  • Status: Active Grant
First Claim
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1. A semiconductor device, comprising:

  • a substrate, comprising trenches;

    an isolation oxide layer, disposed in the trenches;

    a shield polysilicon, disposed in the trenches and partially surrounded by the isolation oxide layer; and

    an inter-poly oxide layer, disposed on the isolation oxide layer and on the shield polysilicon;

    wherein the inter-poly oxide layer has a concave top surface; and

    a first top surface portion of the isolation oxide layer adjacent to the sidewall of the shield polysilicon has a first curvature, and a second top surface portion of the isolation oxide layer adjacent to a sidewall of one of the trenches has a second curvature, wherein the first curvature is greater than the second curvature.

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