Method for producing nitride semiconductor device

• US 10,510,927 B2
• Filed: 11/14/2018
• Issued: 12/17/2019
• Est. Priority Date: 11/18/2014
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: Michiue, Atsuo
• Primary Examiner(s): Ngo, Ngan V
• Application Number:
  US16/190,529
• Publication Number:
  US 20190081209A1
• Time in Patent Office: 398 Days
• CPC Class Codes: H01L 21/0242 Crystalline insulating materials
• CPC Class Codes: H01L 21/0243 Surface structure
• CPC Class Codes: H01L 21/02433 Crystal orientation
• CPC Class Codes: H01L 21/02458 Nitrides
• CPC Class Codes: H01L 21/02505 consisting of more than two layers
• CPC Class Codes: H01L 21/02516 Crystal orientation
• CPC Class Codes: H01L 21/0254 Nitrides
• CPC Class Codes: H01L 21/02609 Crystal orientation
• CPC Class Codes: H01L 21/0262 Reduction or decomposition of gaseous compounds, e.g. CVD
• CPC Class Codes: H01L 21/02639 Preparation of substrate for selective deposition
• CPC Class Codes: H01L 21/02647 Lateral overgrowth
• CPC Class Codes: H01L 33/007 comprising nitride compounds
• CPC Class Codes: H01L 33/0075 comprising nitride compounds
• CPC Class Codes: H01L 33/12 with a stress relaxation structure, e.g. buffer layer
• CPC Class Codes: H01L 33/16 with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
• CPC Class Codes: H01L 33/18 within the light emitting region
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/24 of the light emitting region, e.g. non-planar junction
• CPC Class Codes: H01L 33/32 containing nitrogen

Abstract

A method for producing a nitride semiconductor device. The method comprises providing a substrate made of a material other than a nitride semiconductor. The material has a hexagonal crystal structure. An upper face of the substrate has at least one flat section. The method further comprises growing a first nitride semiconductor layer on the upper face of the substrate. The first nitride semiconductor layer is made of monocrystalline AlN. The first nitride semiconductor layer has an upper face that is a +c plane. The first nitride semiconductor layer has a thickness in a range of 10 nm to 100 nm. The method further comprises growing a second nitride semiconductor layer on the upper face of the first nitride semiconductor layer. The second nitride semiconductor layer is made of In_XAl_YGa_1−X−YN (0≤X, 0≤Y, X+Y<1). In an initial stage of growing the second nitride semiconductor layer, micronuclei are formed in multiple locations on the upper face of the first nitride semiconductor layer such that a plurality of upside-down hexagonal pyramid-shaped or upside-down hexagonal frustum-shaped recesses separate the micronuclei above the at least one flat section of the upper face of the substrate. After the initial stage of growing, further growth is performed to reduce a size of the recesses until the recesses are substantially eliminated. The further growth is performed such that the recesses are substantially eliminated before a thickness of the second nitride semiconductor layer grows to 800 nm. The second nitride semiconductor layer is grown to have an upper face with at least one flat section.

Claims

1. A method for producing a nitride semiconductor device, the method comprising:

providing a substrate made of a material other than a nitride semiconductor,

wherein the material has a hexagonal crystal structure;

wherein an upper face of the substrate has at least one flat section;

growing a first nitride semiconductor layer on the upper face of the substrate,

wherein the first nitride semiconductor layer is made of monocrystalline AlN;

wherein the first nitride semiconductor layer has an upper face that is a +c plane;

wherein the first nitride semiconductor layer has a thickness in a range of 10 nm to 100 nm;

growing a second nitride semiconductor layer on the upper face of the first nitride semiconductor layer,

wherein the second nitride semiconductor layer is made of In_XAl_YGa_1-X-YN (0≤

X, 0≤

Y, X+Y<

1);

wherein the second nitride semiconductor layer is grown to have an upper face with at least one flat section after a plurality of upside-down hexagonal pyramid-shaped or upside-down hexagonal frustum-shaped recesses are created in the second nitride semiconductor layer above the at least one flat section of the upper face of the substrate;

wherein the recesses are substantially eliminated before a thickness of the second nitride semiconductor layer grows to 800 nm.

2. The method for producing a nitride semiconductor device according to claim 1, wherein the substrate is made of sapphire, and the flat section is a +c plane.

3. The method for producing a nitride semiconductor device according to claim 1, wherein the crystallinity of the AlN forming the first nitride semiconductor layer is such that a full width at half maximum of an X-ray rocking curve for a plane having a Miller index of (002) is less than or equal to 1000 arcsec.

4. The method for producing a nitride semiconductor device according to claim 1, wherein the first nitride semiconductor layer is grown by metalorganic chemical vapor deposition.

5. The method for producing a nitride semiconductor device according to claim 4, wherein the first nitride semiconductor layer is grown while supplying oxygen at least until the entirety of the upper face of the substrate is covered by the first nitride semiconductor layer.

6. The method for producing a nitride semiconductor device according to claim 1, wherein the second nitride semiconductor layer is grown by metalorganic chemical vapor deposition, and a molar ratio of the volume of a group V gas, which is a group V element supply source, to a group III gas, which is a group III element supply source, is in a range of 30 to 30000.

7. The method for producing a nitride semiconductor device according to claim 6, wherein the second nitride semiconductor layer is grown at a temperature in a range of 800°

C. to 1100°

C.

8. The method for producing a nitride semiconductor device according to claim 1, wherein the first nitride semiconductor layer is grown at a temperature of at least 900°

C.

9. The method for producing a nitride semiconductor device according to claim 1,

wherein a plurality of protrusions are disposed on the upper face of the substrate, and the at least one flat section of the upper face of the substrate is positioned between at least two of the protrusions;

wherein at least part of the first nitride semiconductor layer is grown above the at least one flat section of the upper face of the substrate;

wherein at least part of the second nitride semiconductor layer is grown on the at least part of the first nitride semiconductor layer above the at least one flat section of the upper face of the substrate, and the at least part of the second nitride semiconductor layer;

wherein an upper face of the at least part of the second nitride semiconductor layer is grown to have at least one flat section before the at least part of the second nitride semiconductor layer grows to a height equal to or greater than at least two upper ends of the at least two protrusions.

10. The method for producing a nitride semiconductor device according to claim 9, wherein a plurality of crystal defects extend upwardly in the second nitride semiconductor layer from the first nitride semiconductor layer above the at least one flat section of the upper face of the first nitride semiconductor layer, and at least some of the plurality of crystal defects are terminated below the at least two upper ends of the at least two protrusions.

11. The method for producing a nitride semiconductor device according to claim 1 further comprising forming a light emitting device structure by stacking at least an n-type nitride semiconductor layer and a p-type nitride semiconductor layer on the second nitride semiconductor layer, and forming an n-side electrode electrically connected to the n-type nitride semiconductor layer and a p-side electrode electrically connected to the p-type nitride semiconductor layer.

12. The method for producing a nitride semiconductor device according to claim 1, wherein the diameters of the recesses in a plan view at some time during the initial stage of growing the second nitride semiconductor layer are in a range of 100 nm to 200 nm.