Highly conductive transparent glass-based circuit board

• US 10,512,170 B2
• Filed: 12/29/2016
• Issued: 12/17/2019
• Est. Priority Date: 02/03/2016
• Status: Active Grant

• Current Assignee: Wuhan Huashang Green Technology Co., Ltd.
• Original Assignee: Wuhan Huashang Green Technology Co., Ltd.
• Inventors: Liu, Lianjia, Guo, Qingliang, You, Xiaojiang
• Primary Examiner(s): Norris, Jeremy C
• Application Number:
  US16/073,459
• Publication Number:
  US 20190327839A1
• Time in Patent Office: 1,083 Days
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 2201/0108 Transparent
• CPC Class Codes: H05K 2201/0175 Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
• CPC Class Codes: H05K 2201/0323 Carbon
• CPC Class Codes: H05K 2203/0511 Diffusion patterning
• CPC Class Codes: H05K 2203/1126 Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents
• CPC Class Codes: H05K 2203/1194 Thermal treatment leading to a different chemical state of a material, e.g. annealing for stress-relief, aging
• CPC Class Codes: H05K 3/1291 Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
• CPC Class Codes: H05K 3/381 by special treatment of the substrate
• CPC Class Codes: H05K 3/4664 Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders H05K3/4647 takes precedence

Abstract

A highly conductive transparent glass-based circuit board includes a glass substrate. The glass substrate is a glass-tempered substrate. A surface of the glass-tempered substrate faces air. A conductive paste, printed on the surface of the glass-tempered substrate, is baked, heated, and cooled to form a conductive circuit fused with the surface of the glass-tempered substrate. The surface of the glass-tempered substrate and an upper surface of the conductive circuit are at the same level. A surface of the conductive circuit, except a region reserved for a solder pad used for welding a component, is covered with a printed-circuit-board (PCB) organic solder-resistant layer. The conductive circuit is tightly fused with the glass substrate. It is a fusional relation between the conductive circuit and the glass substrate. A surface of the glass substrate and an upper surface of the conductive circuit are at the same level. Because a surface of the highly conductive transparent glass-based circuit board is smooth, the conductive circuit is not easily damaged. The highly conductive transparent glass-based circuit board has the characteristics of high conductivity and high transmittance.

Claims

1. A highly conductive transparent glass-based circuit board, comprising:

a glass substrate, being a glass-tempered substrate,

wherein a surface of the glass-tempered substrate faces air, and a conductive paste, printed on the surface of the glass-tempered substrate, is baked, heated, and cooled to form a conductive circuit fused with the surface of the glass substrate;

wherein the conductive circuit is made essentially of a graphene layer or a conductive layer having a graphene upper portion and a metal lower portion fused with the glass substrate, and a surface of the graphene upper portion is fused with a surface of the metal lower portion;

wherein a surface of the conductive circuit, except a region reserved for a solder pad used for welding a component, is covered with a printed-circuit-board (PCB) organic solder-resistant layer;

wherein the conductive paste includes conductive powder, low temperature glass powder, ethyl cellulose, terpineol, and dibutyl maleate at a mass ratio of 65 to 75;

3;

5 to 10;

10 to 20;

1 to 3, and the conductive powder is graphene powder or a mixture of metal powder and graphene powder; and

wherein, when the conductive powder is the mixture of metal powder and graphene powder, the graphene powder accounts for 2% to 5% by mass of the conductive paste.

2. The highly conductive transparent glass-based circuit board of claim 1, wherein the surface of the glass-tempered substrate and an upper surface of the conductive circuit are at the same level.

3. The highly conductive transparent glass-based circuit board of claim 1, wherein the surface of the glass-tempered substrate faces air, and the conductive paste, printed on the surface of the glass-tempered substrate, is baked at a temperature between 120 and 150°

C. for 100 to 200 seconds, placed at a temperature between 550 and 600°

C. for 300 to 360 seconds, then placed at a temperature between 710 and 730°

C. for 120 to 220 seconds, and finally cooled to form the conductive circuit fused with the surface of the glass-tempered substrate.