Wafer alignment mark scheme

• US 10,514,247 B2
• Filed: 01/08/2018
• Issued: 12/24/2019
• Est. Priority Date: 03/28/2012
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Tseng, Wei-Hsiang, Lin, Chin-Hsiang, Liu, Heng-Hsin, Peng, Jui-Chun, Chen, Ho-Ping
• Primary Examiner(s): Ahmed, Jamil
• Application Number:
  US15/864,458
• Publication Number:
  US 20180128597A1
• Time in Patent Office: 715 Days
• CPC Class Codes: G01B 11/02 for measuring length, width or thickness G01B11/08 takes precedence
• CPC Class Codes: G03F 9/7011 Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
• CPC Class Codes: G03F 9/7084 Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A wafer alignment apparatus includes a light source, a light detection device, and a rotation device configured to rotate a wafer. The light source is configured to provide a light directed to the wafer. The light detection device is configured to detect reflected light intensity from the wafer to locate at least one wafer alignment mark of wafer alignment marks separated by a plurality of angles. At least two of those angles are equal.

Claims

1. A method comprising:

directing light in a first direction;

receiving a first reflected light with a first light intensity difference from the light;

receiving a second reflected light with a second light intensity difference from the light, the first light intensity difference being identifiably different from the second light intensity difference, wherein the wafer is rotated during the receiving the first reflected light and the receiving the second reflected light; and

determining a position of the wafer based on the first light intensity difference and the second light intensity difference.

2. The method of claim 1, wherein the directing light comprises directing a laser in the first direction.

3. The method of claim 1, wherein the receiving the first reflected light comprises receiving the first reflected light with a charge-coupled device.

4. The method of claim 1, wherein the receiving the first reflected light comprises collecting a light intensity distribution.

5. The method of claim 1, wherein the wafer is rotated 90°

between the receiving the first reflected light and the receiving the second reflected light.

6. The method of claim 1, wherein the wafer is rotated 120°

between the receiving the first reflected light and the receiving the second reflected light.

7. A method comprising:

directing light towards a rotating wafer;

analyzing a first reflected light from the rotating wafer to determine a first light intensity from a first alignment mark;

analyzing a second reflected light from the rotating wafer to determine a second light intensity from a second alignment mark identifiably different from the first light intensity; and

determining a position of the rotating wafer based on the first light intensity and the second light intensity.

8. The method of claim 7, wherein the rotating wafer comprises:

a first set of alignment marks at a first location;

a second set of alignment marks at a second location; and

a third set of alignment marks at a third location.

9. The method of claim 8, wherein the first location is located 90°

away from the second location.

10. The method of claim 8, wherein the first set of alignment marks are in a pyramidal formation.

11. The method of claim 8, wherein the first location is located 120°

away from the second location.

12. The method of claim 8, wherein the first set of alignment marks are arranged in a square configuration.

13. The method of claim 7, wherein the rotating wafer is rotated no more than 90°

.

14. A method comprising:

placing a semiconductor wafer onto a rotation device;

rotating the semiconductor wafer;

while the semiconductor wafer is rotating, reflecting light from a back side of the semiconductor wafer to a light detection device; and

determining a position of the semiconductor wafer from two identifiably different light intensities, each light intensity being modified by recesses within the back side of the semiconductor wafer.

15. The method of claim 14, wherein the recesses have a first depth of about 0.12 μ

m.

16. The method of claim 14, wherein the recesses have a first depth of between about 100 nm and about 200 nm.

17. The method of claim 14, wherein a first one of the two identifiably different light intensities is reflected from a first set of recesses with a first number of recesses and wherein a second one of the two identifiably different light intensities is reflected from a second set of recesses with a second number of recesses different from the first number of recesses.

18. The method of claim 17, wherein the first set of recesses is located 90°

away from the second set of recesses.

19. The method of claim 17, wherein the first set of recesses is located 120°

away from the second set of recesses.

20. The method of claim 14, wherein the reflecting light comprises directing a laser towards the back side of the semiconductor wafer.