Process variability aware adaptive inspection and metrology

• US 10,514,614 B2
• Filed: 01/20/2016
• Issued: 12/24/2019
• Est. Priority Date: 02/13/2015
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Vellanki, Venugopal, Jain, Vivek Kumar, Hunsche, Stefan
• Primary Examiner(s): Kik, Phallaka
• Application Number:
  US15/546,592
• Publication Number:
  US 20180031981A1
• Time in Patent Office: 1,434 Days
• Field of Search: 716 52, 716 54, 716 56, 716112, 716136, 700 97, 700110, 700119, 700120
• CPC Class Codes: G03F 1/60 Substrates
• CPC Class Codes: G03F 1/84 Inspecting
• CPC Class Codes: G03F 7/705 Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
• CPC Class Codes: G03F 7/70525 Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
• CPC Class Codes: G03F 7/70641 Focus
• CPC Class Codes: G03F 7/7065 Defects, e.g. optical inspection of patterned layer for defects
• CPC Class Codes: G03F 7/70666 Aerial image, i.e. measuring the image of the patterned exposure light at the image plane of the projection system
• CPC Class Codes: G06F 2119/18 Manufacturability analysis or optimisation for manufacturability
• CPC Class Codes: G06F 30/20 Design optimisation, verification or simulation optimisation, verification or simulation of circuit designs G06F30/30
• CPC Class Codes: G06F 30/398 Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM] optical proximity correction [OPC] design processes G03F1/36
• CPC Class Codes: G06N 20/00 Machine learning

Abstract

A defect prediction method for a device manufacturing process involving processing one or more patterns onto a substrate, the method including: determining values of one or more processing parameters under which the one or more patterns are processed; and determining or predicting, using the values of the one or more processing parameters, an existence, a probability of existence, a characteristic, and/or a combination selected from the foregoing, of a defect resulting from production of the one or more patterns with the device manufacturing process.

Claims

1. A defect prediction method for a device manufacturing process involving processing one or more patterns onto a substrate, the defect prediction method comprising:

determining values of one or more processing parameters under which the one or more patterns are processed;

determining or predicting, by a hardware computer system using the values of the one or more processing parameters, an existence, a probability of existence, a characteristic, and/or a combination selected from the foregoing, of a defect resulting from production of the one or more patterns with the device manufacturing process; and

generating electronic data representing one or more sub-areas of a surface of the substrate for inspection by a physical inspection apparatus, the one or more sub-areas enclose the one or more patterns for which the determined or predicted existence, probability of existence, characteristic, and/or combination selected from the foregoing, meets one or more criteria and enclose one or more other patterns not identified as prone to produce a defect.

2. The method of claim 1, further comprising inspecting the one or more patterns responsive to the determined or predicted existence, probability of existence, characteristic, and/or combination selected from the foregoing, meeting one or more criteria.

3. The method of claim 1, wherein the determining or predicting the existence, probability of existence, characteristic, and/or combination selected from the foregoing, of the defect further uses a characteristic of the one or more patterns.

4. The method of claim 1, wherein the one or more patterns comprise a process window limiting pattern.

5. The method of claim 1, wherein the determining or predicting the existence, probability of existence, characteristic, and/or combination selected from the foregoing, of the defect comprises:

comparing the values of the one or more processing parameters with an overlapping process window of the one or more patterns, or

determining whether the values of the one or more processing parameters are beyond one or more thresholds, or

using a classification model with the values of the one or more processing parameters as input to the classification model.

6. The method of claim 1, wherein the determining or predicting the existence, probability of existence, characteristic, and/or combination selected from the foregoing, of the defect comprises simulating an image, or expected patterning contour, of the one or more patterns under the values of the one or more processing parameters and determining an image or contour parameter.

7. The method of claim 1, wherein the one or more patterns are identified using an empirical model or a computational model.

8. The method of claim 1, wherein the one or more processing parameters are selected from:

focus, depth of focus, focus error, dose, an illumination parameter, a projection optics parameter, data obtained from metrology, and/or data from an operator of a processing apparatus used in the device manufacturing process.

9. The method of claim 1, wherein the values of the one or more processing parameters are obtained from metrology.

10. The method of claim 1, wherein the one or more processing parameters are determined or predicted using a model or by querying a database.

11. The method of claim 1, wherein the one or more processing parameters comprise one or more local processing parameters, one or more global processing parameters, and/or a combination selected from the foregoing.

12. The method of claim 1, wherein the defect is undetectable before the substrate is irreversibly processed.

13. A device for selecting areas to be inspected on a substrate,

the device configured to obtain values of one or more processing parameters under which one or more patterns are processed onto an area of the substrate;

and

the device configured to select a sub-area of a surface of the substrate for inspection by a physical inspection apparatus, responsive to an existence, a probability of existence, a characteristic, and/or a combination selected from the foregoing, of a defect in the area resulting from production of the one or more patterns, meets one or more criteria and generate electronic data representing the sub-area, for use by an apparatus to enable the inspection,

wherein the existence, probability of existence, characteristic, and/or combination selected from the foregoing, is determined or predicted using the values of the one or more processing parameters, and

wherein the sub-area for inspection includes a pattern prone to produce a defect and a pattern not identified as prone to produce a defect.

14. The device of claim 13, wherein the device is further configured to export a file including a data structure representing the sub-area.

15. The device of claim 13, wherein the device is further configured to cause inspection of the one or more patterns responsive to the determined or predicted existence, probability of existence, characteristic, and/or combination selected from the foregoing, meeting one or more criteria.

16. The device of claim 13, wherein the determination or prediction of the existence, probability of existence, characteristic, and/or combination selected from the foregoing, of the defect further uses a characteristic of the one or more patterns.

17. The device of claim 13, wherein the one or more patterns comprise a process window limiting pattern.

18. A method for a device manufacturing process involving processing one or more patterns onto a substrate, the method comprising:

determining values across the substrate of one or more processing parameters of the device manufacturing process under which one or more patterns are processed onto the substrate;

identifying one or more sub-areas of a surface of the substrate for inspection by a physical inspection apparatus, by a hardware computer system utilizing the values of the one or more processing parameters, as having, or having increased probability of existence of, a defect resulting from production with the device manufacturing process, wherein the one or more sub-areas for inspection includes a pattern prone to produce a defect and a pattern not identified as prone to produce a defect; and

generating electronic data representing the one or more sub-areas, for use by an apparatus to enable the inspection.

19. The method of claim 18, wherein the identifying comprises:

comparing a process window associated with the one or more patterns located at the identified one or more sub-areas with the values of the one or more processing parameters at the identified one or more sub-areas, and

determining or predicting, using the comparison, an existence, a probability of existence, a characteristic, or a combination thereof, of a defect produced from the one or more patterns at the identified one or more sub-areas with the device manufacturing process.

20. The method of claim 18, further comprising inspecting the one or more sub-areas based on the electronic data.