Atomic layer deposition of silicon carbon nitride based materials
First Claim
1. A method for forming a film on a substrate comprising:
- performing a plurality of SiCN deposition cycles comprising alternately and sequentially contacting the substrate with a first vapor-phase silicon precursor comprising two silicon atoms bound to a hydrocarbon in an —
Si—
R—
Si—
structure, where R comprises a C1 to C8 hydrocarbon, and a second vapor-phase nitrogen reactant; and
subsequently exposing the substrate to a hydrogen-containing plasma generated from a reactant gas that comprises H2,wherein the film has a wet etch rate of less than about 1 nm/min in a dilute aqueous solution of hydrofluoric acid having a concentration of 0.5 weight %.
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Abstract
A process for depositing a silicon carbon nitride film on a substrate can include a plurality of complete deposition cycles, each complete deposition cycle having a SiN sub-cycle and a SiCN sub-cycle. The SiN sub-cycle can include alternately and sequentially contacting the substrate with a silicon precursor and a SiN sub-cycle nitrogen precursor. The SiCN sub-cycle can include alternately and sequentially contacting the substrate with carbon-containing precursor and a SiCN sub-cycle nitrogen precursor. The SiN sub-cycle and the SiCN sub-cycle can include atomic layer deposition (ALD). The process for depositing the silicon carbon nitride film can include a plasma treatment. The plasma treatment can follow a completed plurality of complete deposition cycles.
93 Citations
20 Claims
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1. A method for forming a film on a substrate comprising:
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performing a plurality of SiCN deposition cycles comprising alternately and sequentially contacting the substrate with a first vapor-phase silicon precursor comprising two silicon atoms bound to a hydrocarbon in an —
Si—
R—
Si—
structure, where R comprises a C1 to C8 hydrocarbon, and a second vapor-phase nitrogen reactant; andsubsequently exposing the substrate to a hydrogen-containing plasma generated from a reactant gas that comprises H2, wherein the film has a wet etch rate of less than about 1 nm/min in a dilute aqueous solution of hydrofluoric acid having a concentration of 0.5 weight %. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method for forming a film on a substrate comprising:
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performing one or more SiCN deposition cycles each comprising; alternately and sequentially contacting the substrate with a first vapor-phase silicon precursor comprising two silicon atoms bound to a hydrocarbon, and a second vapor-phase nitrogen reactant; and subsequently exposing the substrate to a hydrogen-containing plasma generated from a reactant gas that comprises H2, wherein the plasma-treated film has a wet etch rate that is less than about 50% of the wet etch rate of thermal silicon oxide, as measured in dilute hydrofluoric acid having a concentration of 0.5 weight %. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification