Semiconductor device and a method for fabricating the same
First Claim
1. A semiconductor device, comprising:
- a fin structure;
a first gate electrode disposed over a first part of the fin structure and between first gate sidewall spacers made of an insulating material;
a second gate electrode disposed over a second part of the fin structure and between second gate sidewall spacers made of the insulating material;
a first source/drain (S/D) region disposed adjacent to the first gate electrode;
a second S/D region disposed adjacent to the second gate electrode;
a first S/D contact made of a first conductive material and disposed on the first S/D region;
a second S/D contact made of the first conductive material and disposed on the second S/D region;
a first contact layer made of a second conductive material and being in contact with the first gate electrode and the first S/D contact;
a second contact layer made of the second conductive material and being in contact with the second gate electrode; and
a third contact layer made of the second conductive material and disposed on the second S/D region, wherein;
the third contact layer is disposed above the second part of the fin structure, andthe second contact layer is not disposed above the fin structure.
1 Assignment
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Accused Products
Abstract
A semiconductor device includes a fin field effect transistor. The semiconductor device includes a first gate electrode, a first source/drain (S/D) region disposed adjacent to the first gate electrode, a first S/D contact disposed on the first S/D region, a first spacer layer disposed between the first gate electrode and the first S/D region, a first contact layer in contact with the first gate electrode and the first S/D contact, and a first wiring layer integrally formed with the first contact layer. There is no interface between the first contact layer and the first wiring layer in a cross sectional view, and the first contact layer has a smaller area than the first wiring layer in plan view.
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Citations
19 Claims
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1. A semiconductor device, comprising:
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a fin structure; a first gate electrode disposed over a first part of the fin structure and between first gate sidewall spacers made of an insulating material; a second gate electrode disposed over a second part of the fin structure and between second gate sidewall spacers made of the insulating material; a first source/drain (S/D) region disposed adjacent to the first gate electrode; a second S/D region disposed adjacent to the second gate electrode; a first S/D contact made of a first conductive material and disposed on the first S/D region; a second S/D contact made of the first conductive material and disposed on the second S/D region; a first contact layer made of a second conductive material and being in contact with the first gate electrode and the first S/D contact; a second contact layer made of the second conductive material and being in contact with the second gate electrode; and a third contact layer made of the second conductive material and disposed on the second S/D region, wherein; the third contact layer is disposed above the second part of the fin structure, and the second contact layer is not disposed above the fin structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A semiconductor device, comprising:
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a fin structure; a first gate electrode disposed over a first part of the fin structure and between first gate sidewall spacers made of an insulating material; a second gate electrode disposed over a second part of the fin structure and between second gate sidewall spacers made of an insulating material; a first gate contact layer made of a first conductive material and being disposed on the first gate electrode; a second gate contact layer made of the first conductive material and being disposed on the second gate electrode; a first source/drain (S/D) region; a second source/drain (S/D) region; a first S/D contact made of a second conductive material and being disposed on the first S/D region; a second S/D contact made of the second conductive material and being disposed on the second S/D region; a first contact layer made of a third conductive material and being in contact with the first gate contact layer and the first S/D contact; a second contact layer made of the third conductive material and being in contact with the second gate contact layer; and a third contact layer made of the third conductive material and being in contact with the second S/D contact, wherein; the third contact layer is disposed above the second part of the fin structure, and the second contact layer is disposed above an isolation insulating layer from which the fin structure protrudes. - View Dependent Claims (15, 16, 17, 18)
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19. A semiconductor device, comprising:
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a fin structure; a first gate electrode disposed over the fin structure; a second gate electrode disposed over the fin structure; a first source/drain (S/D) region disposed on the fin structure; a second source/drain (S/D) region disposed on the fin structure; a first S/D contact disposed on the first S/D region; a second S/D contact disposed on the second S/D region; a first contact layer in contact with the first gate electrode and the first S/D contact; a second contact layer in contact with the second gate electrode; and a third contact layer in contact with the second S/D contact, wherein; the third contact layer is disposed above the fin structure, the second contact layer is disposed above an isolation insulating layer from which the fin structure protrudes, and the second contact layer is a closest contact layer to the third contact layer in pan view.
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Specification