Encapsulated fluid assembly emissive elements

• US 10,516,084 B2
• Filed: 09/08/2018
• Issued: 12/24/2019
• Est. Priority Date: 10/31/2014
• Status: Active Grant

• Current Assignee: Elux Inc.
• Original Assignee: Elux Inc.
• Inventors: Sasaki, Kenji, Schuele, Paul J.
• Primary Examiner(s): Yechuri, Sitaramarao S
• Application Number:
  US16/125,671
• Publication Number:
  US 20190006564A1
• Time in Patent Office: 472 Days
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/95101 in a liquid medium
• CPC Class Codes: H01L 2224/95136 involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 2224/95143 Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
• CPC Class Codes: H01L 23/3185 the coating covering also the sidewalls of the semiconductor body
• CPC Class Codes: H01L 24/03 Manufacturing methods
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 2924/10156 at the periphery
• CPC Class Codes: H01L 2924/10157 at the active surface
• CPC Class Codes: H01L 2924/15156 Side view
• CPC Class Codes: H01L 2924/15157 Top view
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 33/20 : with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/32 : containing nitrogen
• CPC Class Codes: H01L 33/54 : having a particular shape
• CPC Class Codes: H01L 33/58 : Optical field-shaping elements
• CPC Class Codes: H01L 33/60 : Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A method is provided for fabricating an encapsulated emissive element. Beginning with a growth substrate, a plurality of emissive elements is formed. The growth substrate top surface is conformally coated with an encapsulation material. The encapsulation material may be photoresist, a polymer, a light reflective material, or a light absorbing material. The encapsulant is patterned to form fluidic assembly keys having a profile differing from the emissive element profiles. In one aspect, prior to separating the emissive elements from the handling substrate, a fluidic assembly keel or post is formed on each emissive element bottom surface. In one variation, the emissive elements have a horizontal profile. The fluidic assembly key has horizontal profile differing from the emissive element horizontal profile useful in selectively depositing different types of emissive elements during fluidic assembly. In another aspect, the emissive elements and fluidic assembly keys have differing vertical profiles useful in preventing detrapment.

Claims

1. An encapsulated emissive element comprising:

an emissive element having a profile and comprising a top surface, a bottom surface, a keel extending from the bottom surface, sidewall surfaces between the top and bottom surfaces, and a pair of electrical contacts; and

,

a fluidic assembly key at least partially encapsulating the emissive element to form a profile, different than the emissive element profile.

2. The encapsulated emissive element of claim 1 wherein the emissive element top surface is substantially planar in a horizontal orientation;

and,

wherein the emissive element has a horizontal profile and the fluidic assembly key has a differing horizontal profile, as defined from a vantage orthogonal to the emissive element top surface.

3. The encapsulated emissive element of claim 2 wherein the emissive element is capable of emitting light having a first wavelength, and wherein the first wavelength is associated with a first fluidic assembly key horizontal profile.

4. The encapsulated emissive element of claim 3 wherein the fluidic assembly key horizontal profile is selected from a plurality of different horizontally oriented shapes;

and,

wherein each horizontally oriented shape is associated with a different wavelength of emissive element light emission.

5. The encapsulated emissive element of claim 1 wherein the emissive element profile is selected from a group consisting of differing horizontally oriented shapes, as defined from a vantage orthogonal to the emissive element top surface, or differing vertical thicknesses between the emissive element top and bottom surfaces;

and,

wherein each emissive element profile is associated with a different wavelength of emissive element light emission.

6. The encapsulated emissive element of claim 5 wherein a first emissive element has first thickness between its top and bottom surfaces and is associated with a first wavelength of emissive element light emission;

wherein a second emissive element has second thickness between its top and bottom surfaces, less than the first thickness, and is associated with a second wavelength of emissive element light emission;

wherein a first fluidic assembly key encapsulates the first emissive element top and bottom surfaces to form an overall encapsulated emissive element third thickness; and

,

wherein a second fluidic assembly key encapsulates the second emissive element top and bottom surfaces to form the overall encapsulated emissive element third thickness.

7. The encapsulated emissive element of claim 1

wherein the emissive element has a vertical profile and the fluidic assembly key has a differing vertical profile, where a vertical profile is defined from a vantage orthogonal to the emissive element sidewalls.

8. The encapsulated emissive element of claim 7 wherein the fluidic assembly key has a vertical profile slope formed between a fluidic assembly key bottom surface, aligned with the emissive element bottom surface, and a fluidic assembly key top surface aligned with the emissive element top surface;

and,

wherein the fluidic assembly key top surface width is greater than or equal to the fluidic assembly key bottom surface width.

9. The encapsulated emissive element of claim 8 wherein the emissive element top and bottom surfaces are substantially planar in a horizontal orientation;

and,

wherein the emissive element sidewalls form a vertically oriented slope between an emissive element top surface width less than or equal to an emissive element bottom surface width.

10. The encapsulated emissive element of claim 1 wherein the fluidic assembly key is made from a material selected from the group consisting of polymer, photoresist, light reflective, magnetic, and light absorbing materials.

11. The encapsulated emissive element of claim 1 wherein the emissive element electrical contacts are arranged in an orientation selected from the group consisting of vertical, with a first electrical contact mounted on the emissive element top surface and a second electrical contact mounted on the emissive element bottom surface, and surface mount, with both the first and second electrical contacts mounted on the emissive element top surface.

12. The encapsulated emissive element of claim 1 wherein the emissive element is a surface mount emissive element with a first and a second electrical contact mounted on the emissive element top surface;

and,

wherein the fluidic assembly key is an electrical insulator isolating the first electrical contact from the second electrical contact.

13. A fluidic assembly emissive display comprising:

a substrate comprising;

a top surface;

a plurality of trap sites formed in the substrate top surface, with each trap site having an opening with a horizontal shape, defined from a vantage orthogonal to the substrate top surface, and a bottom surface with at least a first electrical interface connected to a corresponding intersection in an underlying row/column enablement matrix;

an encapsulated emissive element occupying each trap site, each encapsulated emissive element comprising;

an emissive element comprising a profile, a top surface, a bottom surface, a keel extending from the emissive element bottom surface, sidewall surfaces between the top and bottom surfaces, and a first electrical contact mounted on the emissive element top surface and connected to a corresponding trap site first electrical interface; and

,

a fluidic assembly key at least partially encapsulating the emissive element to form a profile, different than the emissive element profile.

14. The fluidic assembly emissive display of claim 13 wherein each emissive element top surface is substantially planar in a horizontal orientation;

wherein the emissive element has a horizontal profile and the fluidic assembly key has a differing horizontal profile, as defined from a vantage orthogonal to the emissive element top surface; and

,

wherein the display substrate top surface is substantially planar in the horizontal orientation and each trap site opening shape matches the horizontal profile of its occupying encapsulated emissive element fluidic assembly key.

15. The fluidic assembly display of claim 14 wherein a first plurality of emissive elements are capable of emitting light having a first wavelength, and wherein the first wavelength is associated with a first fluidic assembly key horizontal profile.

16. The fluidic assembly display of claim 15 wherein the fluidic assembly key horizontal profiles are selected from a group consisting of a first horizontally oriented shape, a second horizontally oriented shape differing from the first horizontally oriented shape, and a third horizontally oriented shape differing from the first and second horizontally oriented shapes;

and,

wherein each horizontally oriented shape is associated with a different wavelength of emissive element light emission.

17. The fluidic assembly display of claim 13 wherein the emissive element profiles are selected from a group consisting of differing horizontally oriented shapes, as defined from a vantage orthogonal to the emissive element top surface, or differing vertical thicknesses between the emissive element top and bottom surfaces;

and,

wherein each emissive element profile is associated with a different wavelength of emissive element light emission.

18. The fluidic assembly display of claim 13 wherein a first emissive element type has first thickness between its top and bottom surfaces and is associated with a first wavelength of emissive element light emission;

wherein a second emissive element type has second thickness between its top and bottom surfaces, less than the first thickness, and is associated with a second wavelength of emissive element light emission;

wherein a first fluidic assembly key type encapsulates the first emissive element top and bottom surfaces to form an overall encapsulated emissive element third thickness; and

,

wherein a second fluidic assembly key type encapsulates the second emissive element top and bottom surfaces to form the overall encapsulated emissive element third thickness.

19. The fluidic assembly display of claim 13 wherein each emissive element has a vertical profile and the fluidic assembly key has a differing vertical profile, where a vertical profile is defined from a vantage orthogonal to the emissive element sidewalls.

20. The fluidic assembly display of claim 19 wherein the fluidic assembly keys have a vertical profile slope formed between a fluidic assembly key bottom surface, aligned with the emissive element bottom surface, and a fluidic assembly key top surface aligned with the emissive element top surface;

and,

wherein the fluidic assembly key top surface width is greater than or equal to the fluidic assembly key bottom surface width.

21. The fluidic assembly display of claim 20 wherein the substrate trap sites comprise sidewalls with a vertical profile slope formed between the trap site opening and the trap site bottom surface;

and,

wherein a width of the substrate trap site bottom surface is less than or equal to a width of the trap site opening.

22. The fluidic assembly display of claim 20 wherein the emissive element top and bottom surfaces are substantially planar in a horizontal orientation;

and,

wherein the emissive element sidewalls form a vertically oriented slope between an emissive element top surface width less than or equal to an emissive element bottom surface width.

23. The fluidic assembly display of claim 13 wherein the emissive element electrical contacts are arranged in an orientation selected from the group consisting of vertical, with a second electrical contact mounted on the emissive element bottom surface, and surface mount, with the second electrical contact mounted on the emissive element top surface and connected to a second electrical interface mounted on the trap site bottom surface.

24. The fluidic assembly display of claim 13 wherein the emissive elements are surface mount emissive elements with a first and a second electrical contact mounted to the emissive element top surface;

and,

wherein the fluidic assembly keys are an electrical insulator isolating the first electrical contact from the second electrical contact.

25. The fluidic assembly display of claim 13 wherein the fluidic assembly key is made from a material selected from the group consisting of polymer, photoresist, light reflective, magnetic, and light absorbing materials.

26. An encapsulated emissive element comprising:

an emissive element having a vertical profile and comprising a top surface, a bottom surface, sidewall surfaces between the top and bottom surfaces, and a pair of electrical contacts, where a vertical profile is defined from a vantage orthogonal to the emissive element sidewalls;

a fluidic assembly key at least partially encapsulating the emissive element to form a vertical profile, different than the emissive element vertical profile, the fluidic assembly key having a top surface width greater than or equal to a fluidic assembly key bottom surface width; and

,

wherein the fluidic assembly key has a vertical profile slope formed between the fluidic assembly key bottom surface, aligned with the emissive element bottom surface, and the fluidic assembly key top surface aligned with the emissive element top surface.

27. The encapsulated emissive element of claim 26 wherein the emissive element further comprises a keel extending from the emissive element bottom surface.

28. The encapsulated emissive element of claim 26 wherein the emissive element top surface is substantially planar in a horizontal orientation;

and,

wherein the emissive element has a horizontal profile and the fluidic assembly key has a differing horizontal profile, as defined from a vantage orthogonal to the emissive element top surface.

29. The encapsulated emissive element of claim 26 wherein the fluidic assembly key is made from a material selected from the group consisting of polymer, photoresist, light reflective, magnetic, and light absorbing materials.

30. An encapsulated emissive element comprising:

a surface mount emissive element having a profile and comprising a top surface, a bottom surface, sidewall surfaces between the top and bottom surfaces, a first electrical contact mounted on the top surface, and a second electrical contact mounted on the top surface;

a fluidic assembly key at least partially encapsulating the emissive element to form a profile, different than the emissive element profile; and

,

wherein the fluidic assembly key is an electrical insulator isolating the first electrical contact from the second electrical contact.

31. The encapsulated emissive element of claim 30 wherein the emissive element further comprises a keel extending from the emissive element bottom surface.

32. The encapsulated emissive element of claim 30 wherein the emissive element top surface is substantially planar in a horizontal orientation;

and,

wherein the emissive element has a horizontal profile and the fluidic assembly key has a differing horizontal profile, as defined from a vantage orthogonal to the emissive element top surface.

33. The encapsulated emissive element of claim 30 wherein the fluidic assembly key is made from a material selected from the group consisting of polymer, photoresist, light reflective, magnetic, and light absorbing materials.

34. The encapsulated emissive element of claim 30

wherein the emissive element has a vertical profile and the fluidic assembly key has a differing vertical profile, where a vertical profile is defined from a vantage orthogonal to the emissive element sidewalls.

35. A fluidic assembly emissive display comprising:

a substrate comprising;

a top surface;

a plurality of trap sites formed in the substrate top surface, with each trap site having an opening with a horizontal shape, defined from a vantage orthogonal to the substrate top surface, and a bottom surface with at least a first electrical interface connected to a corresponding intersection in an underlying row/column enablement matrix;

an encapsulated emissive element occupying each trap site, each encapsulated emissive element comprising;

an emissive element having a vertical profile and comprising a top surface, a bottom surface, sidewall surfaces between the top and bottom surfaces, and a pair of electrical contacts, where a vertical profile is defined from a vantage orthogonal to the emissive element sidewalls;

a fluidic assembly key at least partially encapsulating the emissive element to form a vertical profile, different than the emissive element vertical profile, the fluidic assembly key having a top surface width greater than or equal to a fluidic assembly key bottom surface width; and

,

wherein the fluidic assembly key has a vertical profile slope formed between the fluidic assembly key bottom surface, aligned with the emissive element bottom surface, and the fluidic assembly key top surface aligned with the emissive element top surface.

36. The fluidic assembly display of claim 35 wherein the emissive element further comprises a keel extending from the emissive element bottom surface.

37. The fluidic assembly display of claim 35 wherein the emissive element top surface is substantially planar in a horizontal orientation;

and,

wherein the emissive element has a horizontal profile and the fluidic assembly key has a differing horizontal profile, as defined from a vantage orthogonal to the emissive element top surface.

38. The fluidic assembly display of claim 35 wherein the fluidic assembly key is made from a material selected from the group consisting of polymer, photoresist, light reflective, magnetic, and light absorbing materials.

39. A fluidic assembly emissive display comprising:

a substrate comprising;

a top surface;

a plurality of trap sites formed in the substrate top surface, with each trap site having an opening with a horizontal shape, defined from a vantage orthogonal to the substrate top surface, and a bottom surface with at least a first electrical interface connected to a corresponding intersection in an underlying row/column enablement matrix;

an encapsulated emissive element occupying each trap site, each encapsulated emissive element comprising;

a surface mount emissive element having a profile and comprising a top surface, a bottom surface, sidewall surfaces between the top and bottom surfaces, a first electrical contact mounted on the top surface, and a second electrical contact mounted on the top surface;

a fluidic assembly key at least partially encapsulating the emissive element to form a profile, different than the emissive element profile; and

wherein the fluidic assembly key is an electrical insulator isolating the first electrical contact from the second electrical contact.

40. The fluidic assembly display of claim 39 wherein the fluidic assembly key is made from a material selected from the group consisting of polymer, photoresist, light reflective, magnetic, and light absorbing materials.

41. The fluidic assembly display of claim 39 wherein the emissive element further comprises a keel extending from the emissive element bottom surface.