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Multilayer thin film encapsulation structure for a organic electroluminescent device

  • US 10,516,136 B2
  • Filed: 06/13/2017
  • Issued: 12/24/2019
  • Est. Priority Date: 06/13/2017
  • Status: Active Grant
First Claim
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1. An organic electroluminescent device, comprising:

  • a substrate;

    a driving circuit layer including a plurality of TFTs formed on the substrate, a plurality of gate bus lines and a plurality of source bus lines each connected with any of the plurality of TFTs, a plurality of terminals, and a plurality of lead wires connecting each of the plurality of terminals with either one of the plurality of gate bus lines or either one of the plurality of source bus lines;

    an inorganic protective layer formed on the driving circuit layer and exposing at least the plurality of terminals;

    an organic flattening layer formed on the inorganic protective layer;

    an organic electroluminescent element layer formed on the organic flattening layer and including a plurality of organic electroluminescent elements each connected with either one of the plurality of TFTs; and

    a thin film encapsulation structure formed to cover the organic electroluminescent element layer, the thin film encapsulation structure including a first inorganic barrier layer, an organic barrier layer in contact with a top surface of the first inorganic barrier layer, and a second inorganic barrier layer in contact with a top surface of the organic barrier layer, the organic barrier layer being formed in a region enclosed by an inorganic barrier layer joint portion where the first inorganic barrier layer and the second inorganic barrier layer are in direct contact with each other;

    wherein;

    as seen in a direction of normal to the substrate, the organic flattening layer is formed in a region where the inorganic protective layer is formed, the plurality of organic electroluminescent elements are located in a region where the organic flattening layer is formed, and an outer perimeter of the thin film encapsulation structure crosses the plurality of lead wires and is present between an outer perimeter of the organic flattening layer and an outer perimeter of the inorganic protective layer; and

    in a region where the inorganic protective layer and the first inorganic barrier layer are in direct contact with each other on the plurality of lead wires, a tapering angle of a side surface of a cross-section of the first inorganic barrier layer taken along a plane parallel to a width direction of the plurality of lead wires is smaller than 90 degrees.

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