Communication system with enhanced partial power source and method of manufacturing same

• US 10,517,507 B2
• Filed: 06/18/2014
• Issued: 12/31/2019
• Est. Priority Date: 04/28/2005
• Status: Active Grant

• Current Assignee: Otsuka Pharmaceutical Company Limited (Otsuka Holdings Company Limited)
• Original Assignee: Proteus Digital Health, Inc. (Otsuka Holdings Company Limited)
• Inventors: Frank, Jeremy, Bjeletich, Peter, Hafezi, Hooman, Azevedo, Robert, Duck, Robert, Pesic, Iliya, Costello, Benedict, Snyder, Eric
• Primary Examiner(s): Padgett, Marianne L
• Assistant Examiner(s): Bowman, Andrew J
• Application Number:
  US14/308,548
• Publication Number:
  US 20150080678A1
• Time in Patent Office: 2,022 Days
• Field of Search: 600117, 3405731
• CPC Class Codes: A61B 2560/0214 of power generation or supply
• CPC Class Codes: A61B 2562/12 Manufacturing methods specially adapted for producing sensors for in-vivo measurements
• CPC Class Codes: A61B 2562/125 characterised by the manufacture of electrodes
• CPC Class Codes: A61B 2562/162 Capsule shaped sensor housings, e.g. for swallowing or implantation
• CPC Class Codes: A61B 5/0028 Body tissue as transmission medium, i.e. transmission systems where the medium is the human body
• CPC Class Codes: A61B 5/0031 Implanted circuitry
• CPC Class Codes: A61B 5/01 Measuring temperature of body parts ; Diagnostic temperature sensing, e.g. for malignant or inflamed tissue clinical contact thermometers G01K13/20
• CPC Class Codes: A61B 5/073 Intestinal transmitters
• CPC Class Codes: A61B 5/14539 for measuring pH
• CPC Class Codes: A61B 5/4839 combined with drug delivery
• CPC Class Codes: A61B 5/6861 Capsules, e.g. for swallowing or implanting
• CPC Class Codes: A61J 3/007 Marking tablets or the like apparatus for printing on tablets or the like B41F17/36
• CPC Class Codes: H01M 2220/30 Batteries in portable systems, e.g. mobile phone, laptop
• CPC Class Codes: H01M 4/0402 Methods of deposition of the material
• CPC Class Codes: H01M 4/06 Electrodes for primary cells
• CPC Class Codes: H01M 4/08 Processes of manufacture
• CPC Class Codes: H01M 4/366 as layered products
• CPC Class Codes: H01M 4/381 Alkaline or alkaline earth metals elements H01M4/40 takes precedence
• CPC Class Codes: H01M 4/582 Halogenides
• CPC Class Codes: H01M 4/66 Selection of materials
• CPC Class Codes: H01M 6/34 : Immersion cells, e.g. sea-water cells
• CPC Class Codes: H01Q 1/273 : Adaptation for carrying or wearing by persons or animals
• CPC Class Codes: Y10T 156/1056 : Perforating lamina
• CPC Class Codes: Y10T 29/49002 : Electrical device making
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing

Abstract

The system of the present invention includes a conductive element, an electronic component, and a partial power source in the form of dissimilar materials. Upon contact with a conducting fluid, a voltage potential is created and the power source is completed, which activates the system. The electronic component controls the conductance between the dissimilar materials to produce a unique current signature. The system can also measure the conditions of the environment surrounding the system.

Claims

1. A device comprising a partial power source for communication, the device comprising:

a support structure;

a layer of adhesion material deposited onto a first location of the support structure, wherein the layer of adhesion material defines a plurality of holes, and the support structure remains a solid and continuous support material underneath each of the plurality of holes;

a first material deposited onto the layer of adhesion material and over the plurality of holes such that the first material covers the plurality of holes, wherein the first material adheres to the layer of adhesion material;

a layer of transition material deposited onto a second location of the support structure; and

a second material deposited onto the layer of transition material, wherein the first material and the second material are configured to generate a voltage potential difference when the first material and the second material come into contact with a conducting fluid.

2. The device of claim 1, wherein the layer of adhesion material comprises a layer of gold.

3. The device of claim 1, wherein a surface of the adhesion material is roughened to enhance adhesion property.

4. The device of claim 1, wherein the support structure is a silicon based material.

5. The device of claim 1, wherein the first material is deposited via evaporating deposition using electron beams.

6. The device of claim 1, wherein the layer of adhesion material is less than 100 microns thick and the first material is deposited via evaporating deposition using electron beams.

7. A device comprising a partial power source for communication, the device comprising:

a support structure;

a layer of adhesion material deposited onto a first location of the support structure, wherein the layer of adhesion material defines a plurality of holes;

a first material deposited onto the layer of adhesion material and over the plurality of holes such that the first material covers the plurality of holes, wherein the first material adheres to the layer of adhesion material;

a layer of transition material deposited onto a second location of the support structure; and

a second material deposited onto the layer of transition material, wherein the first material and the second material are configured to generate a voltage potential difference when the first material and the second material come into contact with a conducting fluid,

wherein the plurality of holes are confined to a center region of the layer of adhesion material such that each edge of the first material is not positioned over any hole of the plurality of holes when the first material adheres to the layer of adhesion material.

8. The device of claim 7, wherein the layer of adhesion material comprises a layer of gold.

9. The device of claim 7, wherein a surface of the adhesion material is roughened to enhance adhesion property.

10. The device of claim 7, wherein the support structure is a silicon based material.

11. The device of claim 7, wherein the first material is deposited via evaporating deposition using electron beams.

12. The device of claim 7, wherein the layer of adhesion material is less than 100 microns thick and the first material is deposited via evaporating deposition using electron beams.

13. A device comprising a partial power source for communication, the device comprising:

a support structure;

a layer of adhesion material deposited onto a first location of the support structure, wherein the layer of adhesion material defines a plurality of holes;

a first material deposited onto the layer of adhesion material and over the plurality of holes such that the first material covers the plurality of holes, wherein the first material adheres to the layer of adhesion material and the plurality of holes is configured to enhance adhesion of the first material to the layer of adhesion material;

a layer of transition material deposited onto a second location of the support structure; and

a second material deposited onto the layer of transition material, wherein the first material and the second material a voltage potential difference when the first material and the second material come into contact with a conducting fluid.

14. The device of claim 13, wherein the layer of adhesion material comprises a layer of gold.

15. The device of claim 13, wherein a surface of the adhesion material is roughened to enhance adhesion property.

16. The device of claim 13, wherein the support structure is a silicon based material.