Diamond nitrogen vacancy sensor with nitrogen-vacancy center diamond located between dual RF sources
First Claim
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1. A magnetic field sensor assembly comprising:
- a first radio frequency (RF) element;
a second RF element;
an RF feed cable operably connected to the first RF element and the second RF element that provides an RF signal to the first RF element and the second RF element;
a magneto-optical defect center material located between the first RF element and the second RF element, wherein the first RF element and the second RF element generate a microwave signal that is uniform over the magneto-optical defect center material;
a first circuit board that includes the first RF element, wherein the first circuit board comprises a light ingress portion that allows light to travel through the first circuit board including the first RF element via the light ingress portion; and
a second circuit board that includes the second RF element, wherein the second circuit board comprises a light egress portion that allows light to travel through the second circuit board including the second RF element via the light egress portion.
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Abstract
A magnetic field sensor assembly includes a first radio frequency (RF) element; a second RF element; an RF feed cable operably connected to the first RF element and the second RF element that provides an RF signal to the first RF element and the second RF element; and a magneto-optical defect center material located between the first RF element and the second RF element. The first RF element and the second RF element generate a microwave signal that is uniform over the magneto-optical defect center material. The magneto-optical defect center material may be a nitrogen-vacancy center diamond.
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Citations
47 Claims
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1. A magnetic field sensor assembly comprising:
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a first radio frequency (RF) element; a second RF element; an RF feed cable operably connected to the first RF element and the second RF element that provides an RF signal to the first RF element and the second RF element; a magneto-optical defect center material located between the first RF element and the second RF element, wherein the first RF element and the second RF element generate a microwave signal that is uniform over the magneto-optical defect center material; a first circuit board that includes the first RF element, wherein the first circuit board comprises a light ingress portion that allows light to travel through the first circuit board including the first RF element via the light ingress portion; and a second circuit board that includes the second RF element, wherein the second circuit board comprises a light egress portion that allows light to travel through the second circuit board including the second RF element via the light egress portion. - View Dependent Claims (2, 3, 4, 5)
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6. A magnetic field sensor assembly comprising:
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a first radio frequency (RF) element; a second RF element; an RF feed cable operably connected to the first RF element and the second RF element that provides an RF signal to the first RF element and the second RF element; a magneto-optical defect center material located between the first RF element and the second RF element, wherein the first RF element and the second RF element generate a microwave signal that is uniform over the magneto-optical defect center material; a first circuit board that includes the first RF element, wherein the first circuit board comprises a first light egress portion that allows light to travel through the first circuit board including the first RF element via the first light egress portion; and a second circuit board that includes the second RF element, wherein the second circuit board comprises a second light egress portion that allows light to travel through the second circuit board including the second RF element via the second light egress portion. - View Dependent Claims (7, 8)
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9. A magnetic field sensor assembly comprising:
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a first radio frequency (RF) element; a second RF element; a first RF feed cable operably connected to the first RF element that provides a first RF signal to the first RF element; a second RF feed cable operably connected to the second RF element that provides a second RF signal to the second RF element; a magneto-optical defect center material located between the first RF element and the second RF element, wherein the first RF element and the second RF element generate a microwave signal that is uniform over the magneto-optical defect center material; and a first circuit board that includes the first RF element, wherein the first circuit board comprises a light ingress portion that allows light to travel through the first circuit board including the first RF element via the light ingress portion; and a second circuit board that includes the second RF element, wherein the second circuit board comprises a light egress portion that allows light to travel through the second circuit board including the second RF element via the light egress portion. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A magnetic field sensor assembly comprising:
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a first radio frequency (RF) element; a second RF element; an RF feed cable operably connected to the first RF element and the second RF element that provides an RF signal to the first RF element and the second RF element; a nitrogen-vacancy (NV) center diamond located between the first RF element and the second RF element, wherein the first RF element and the second RF element generate a microwave signal that is uniform over the NV center diamond; a housing that houses the NV center diamond, the first RF element, and the second RF element; and a housing position adjustment that adjusts a position of the NV center diamond relative to a light source; and a first circuit board that includes the first RF element, wherein the first circuit board comprises a light ingress portion that allows light to travel through the first circuit board including the first RF element via the light ingress portion; and a second circuit board that includes the second RF element, wherein the second circuit board comprises a light egress portion that allows light to travel through the second circuit board including the second RF element via the light egress portion. - View Dependent Claims (18, 19, 20, 21, 22, 23)
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24. A magnetic field sensor assembly comprising:
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a first radio frequency (RF) element; a second RF element; an RF feed cable operably connected to the first RF element and the second RF element that provides an RF signal to the first RF element and the second RF element; a nitrogen-vacancy (NV) center diamond located between the first RF element and the second RF element, wherein the first RF element and the second RF element generate a microwave signal that is uniform over the NV center diamond; a housing that houses the NV center diamond, the first RF element, and the second RF element; and a housing rotational adjustment that adjusts a rotation of the NV center diamond relative to a light source; a first circuit board that includes the first RF element, wherein the first circuit board comprises a light ingress portion that allows light to travel through the first circuit board including the first RF element via the light ingress portion; and a second circuit board that includes the second RF element, wherein the second circuit board comprises a light egress portion that allows light to travel through the second circuit board including the second RF element via the light egress portion. - View Dependent Claims (25, 26, 27, 28, 29)
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30. A magnetic field sensor assembly comprising:
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a first radio frequency (RF) element; a second RF element; a first RF feed cable operably connected to the first RF element that provides a first RF signal to the first RF element; a second RF feed cable operably connected to the second RF element that provides a second RF signal to the second RF element; a nitrogen-vacancy (NV) center diamond located between the first RF element and the second RF element, wherein the first RF element and the second RF element generate a microwave signal that is uniform over the NV center diamond; a housing that houses the NV center diamond, the first RF element, and the second RF element; and a housing position adjustment that adjusts a position of the NV center diamond relative to a light source; a first circuit board that includes the first RF element, wherein the first circuit board comprises a light ingress portion that allows light to travel through the first circuit board including the first RF element via the light ingress portion; and a second circuit board that includes the second RF element, wherein the second circuit board comprises a light egress portion that allows light to travel through the second circuit board including the second RF element via the light egress portion. - View Dependent Claims (31, 32, 33, 34, 35, 36, 37, 38, 39)
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40. A magnetic field sensor assembly comprising:
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a first radio frequency (RF) element; a second RF element; a first RF feed cable operably connected to the first RF element that provides a first RF signal to the first RF element; a second RF feed cable operably connected to the second RF element that provides a second RF signal to the second RF element; a nitrogen-vacancy (NV) center diamond located between the first RF element and the second RF element, wherein the first RF element and the second RF element generate a microwave signal that is uniform over the NV center diamond; a housing that houses the NV center diamond, the first RF element, and the second RF element; and a housing rotational adjustment that adjusts a rotation of the NV center diamond relative to a light source; a first circuit board that includes the first RF element, wherein the first circuit board comprises a light ingress portion that allows light to travel through the first circuit board including the first RF element via the light ingress portion; and a second circuit board that includes the second RF element, wherein the second circuit board comprises a light egress portion that allows light to travel through the second circuit board including the second RF element via the light egress portion. - View Dependent Claims (41, 42, 43, 44, 45, 46, 47)
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Specification