Systems and methods for improved semiconductor etching and component protection
First Claim
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1. A semiconductor processing system comprising:
- a remote plasma source;
a delivery tube coupled with the remote plasma source; and
a semiconductor processing chamber, wherein the semiconductor processing chamber comprises;
a gas box coupled about a distal region of the delivery tube, wherein the gas box comprises a first gas box plate and a second gas box plate coupled with one another, wherein the second gas box plate defines a plurality of channels within a first upper surface of the second gas box plate, and wherein a lower surface of the coupled first gas box plate and the first upper surface of the second gas box plate define a flow path through the plurality of channels;
a first annular support contacting the gas box at a first surface of the first annular support, wherein the first annular support and the gas box together define a first channel about an interior region of the semiconductor processing chamber, and wherein the second gas box plate at least partially contacts the first annular support along a second surface of the second gas box plate opposite the first surface of the second gas box plate contacting the first gas box plate and a gas distribution plate seated within the first channel.
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Abstract
Semiconductor systems and methods may include a semiconductor processing chamber having a gas box defining an access to the semiconductor processing chamber. The chamber may include a spacer characterized by a first surface with which the gas box is coupled, and the spacer may define a recessed ledge on an interior portion of the first surface. The chamber may include a support bracket seated on the recessed ledge that extends along a second surface of the spacer. The chamber may also include a gas distribution plate seated on the support bracket.
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Citations
19 Claims
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1. A semiconductor processing system comprising:
- a remote plasma source;
a delivery tube coupled with the remote plasma source; and
a semiconductor processing chamber, wherein the semiconductor processing chamber comprises;
a gas box coupled about a distal region of the delivery tube, wherein the gas box comprises a first gas box plate and a second gas box plate coupled with one another, wherein the second gas box plate defines a plurality of channels within a first upper surface of the second gas box plate, and wherein a lower surface of the coupled first gas box plate and the first upper surface of the second gas box plate define a flow path through the plurality of channels;
a first annular support contacting the gas box at a first surface of the first annular support, wherein the first annular support and the gas box together define a first channel about an interior region of the semiconductor processing chamber, and wherein the second gas box plate at least partially contacts the first annular support along a second surface of the second gas box plate opposite the first surface of the second gas box plate contacting the first gas box plate and a gas distribution plate seated within the first channel. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
- a remote plasma source;
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14. A semiconductor processing system comprising:
- a remote plasma source;
a delivery tube coupled with the remote plasma source; and
a semiconductor processing chamber, wherein the semiconductor processing chamber comprises;
a gas box providing access to the semiconductor processing chamber, wherein the gas box comprises a first gas box plate coupled with a second gas box plate along a first surface of the second gas box plate, wherein the second gas box plate defines a plurality of channels within the first upper surface of the second gas box plate, and wherein the coupled first gas box plate and second gas box plate define a flow path between a lower surface of the first gas box plate and the first upper surface of the second gas box plate through the plurality of channels;
a first annular support contacting the gas box at a first surface of the first annular support, wherein the first annular support and the gas box each define a portion of a first channel located at an interface of the gas box and the first annular support;
a first gas distribution plate seated within the first channel;
a second annular support contacting the first annular support at a second surface of the first annular support opposite the first surface of the first annular support, wherein the second annular support at least partially defines a second channel located about an interior region of the semiconductor processing chamber; and
a second gas distribution plate seated within the second channel, wherein the first gas distribution plate and the second gas distribution plate comprise quartz. - View Dependent Claims (15, 16, 17, 18, 19)
- a remote plasma source;
Specification