Multi-step image alignment method for large offset die-die inspection
First Claim
Patent Images
1. A method for obtaining an aligned die-die inspection image, comprising:
- receiving a reference image at a processor, the reference image comprising rows and columns of pixels;
selecting a first local section from the reference image using the processor;
receiving a test image at the processor, the test image comprising rows and columns of pixels;
selecting a second local section from the test image using the processor;
determining, using the processor, an estimated rotation offset and an estimated translation offset from the first local section and the second local section;
performing a rough alignment comprising a test image de-skew using the processor, thereby making a partially-aligned test image; and
performing a fine alignment comprising partitioned translation on the partially-aligned test image to obtain an aligned die-die inspection image.
1 Assignment
0 Petitions
Accused Products
Abstract
A die-die inspection image can be aligned using a method or system configured to receive a reference image and a test image, determine a global offset and rotation angle from local sections on the reference image and test image, and perform a rough alignment de-skew of the test image prior to performing a fine alignment.
-
Citations
20 Claims
-
1. A method for obtaining an aligned die-die inspection image, comprising:
-
receiving a reference image at a processor, the reference image comprising rows and columns of pixels; selecting a first local section from the reference image using the processor; receiving a test image at the processor, the test image comprising rows and columns of pixels; selecting a second local section from the test image using the processor; determining, using the processor, an estimated rotation offset and an estimated translation offset from the first local section and the second local section; performing a rough alignment comprising a test image de-skew using the processor, thereby making a partially-aligned test image; and performing a fine alignment comprising partitioned translation on the partially-aligned test image to obtain an aligned die-die inspection image. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A non-transitory computer-readable storage medium, comprising one or more programs for executing the following steps on one or more computing devices:
-
receive a reference image, the reference image comprising rows and columns of pixels; select a first local section from the reference image; receive a test image, the test image comprising rows and columns of pixels; select a second local section from the test image; determine an estimated rotation offset and an estimated translation offset from the first local section and the second local section; perform a rough alignment on the test image comprising a test image de-skew, thereby making a partially-aligned test image; and perform a fine alignment comprising partitioned translation on the partially-aligned test image to obtain an aligned die-die inspection image. - View Dependent Claims (10, 11, 12, 13)
-
-
14. A semiconductor die-die inspection system comprising a sensor to capture images of features of a die and a computing system comprising:
-
a beam source, wherein the beam source is a light source or an electron beam source; a stage configured to hold a wafer in a path of a beam produced by the beam source, wherein the beam is a light beam from the light source or an electron beam from the electron beam source; a detector configured to receive a portion of the beam reflected from the wafer; and a processor in electronic communication with the detector configured to perform; a rough alignment of a test image comprising a test image de-skew, thereby making a partially-aligned test image, and a fine alignment comprising partitioned translation of the partially-aligned test image. - View Dependent Claims (15, 16, 17, 18, 19, 20)
-
Specification