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Package structure and method of fabricating the same

  • US 10,522,470 B1
  • Filed: 07/15/2018
  • Issued: 12/31/2019
  • Est. Priority Date: 07/15/2018
  • Status: Active Grant
First Claim
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1. A package structure, comprising:

  • a first semiconductor die;

    a second semiconductor die disposed adjacent to the first semiconductor die;

    a molding compound encapsulating the first semiconductor die and the second semiconductor die;

    an interconnect structure disposed on the molding compound and electrically connecting the first semiconductor die to the second semiconductor die;

    a plurality of first conductive features disposed on the molding compound and electrically connected to the first semiconductor die and the second semiconductor die, wherein each of the first conductive features has a recessed portion,a plurality of through insulator vias disposed on the recessed portion of the plurality of first conductive features and electrically connected to the first semiconductor die and the second semiconductor die, wherein the plurality of through insulator vias surrounds the interconnect structure;

    an insulating encapsulant encapsulating the interconnect structure and the plurality of through insulator vias, and separating the interconnection structure from the plurality of through insulator vias; and

    a redistribution layer disposed on the insulating encapsulant and over the interconnect structure, wherein the redistribution layer is electrically connected to the plurality of through insulator vias.

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