Optoelectronic units in an optoelectronic device

• US 10,522,588 B2
• Filed: 07/10/2018
• Issued: 12/31/2019
• Est. Priority Date: 05/19/2014
• Status: Active Grant

• Current Assignee: Epistar Corporation
• Original Assignee: Epistar Corporation
• Inventors: Chen, Chao Hsing, Wang, Jia Kuen, Shen, Chien Fu, Ko, Chun Teng
• Primary Examiner(s): Hoang, Quoc D
• Application Number:
  US16/031,737
• Publication Number:
  US 20180331154A1
• Time in Patent Office: 539 Days
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H01L 33/644 in intimate contact or integrated with parts of the device other than the semiconductor body

Abstract

An optoelectronic device comprises a substrate; a first optoelectronic unit formed on the substrate; a second optoelectronic unit formed on the substrate; a plurality of third optoelectronic units formed on the substrate, electrically connected to the first optoelectronic unit and the second optoelectronic unit; a plurality of first electrodes respectively formed on the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units; a plurality of second electrodes respectively formed on the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units; an optical layer surrounding the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units in a top view of the optoelectronic device; a third electrode formed on the first optoelectronic unit and one of the plurality of third optoelectronic units; and a fourth electrode formed on the second optoelectronic unit and another one of the plurality of third optoelectronic units.

Claims

1. An optoelectronic device, comprising:

a substrate;

a first optoelectronic unit formed on the substrate;

a second optoelectronic unit formed on the substrate;

a plurality of third optoelectronic units formed on the substrate, electrically connected to the first optoelectronic unit and the second optoelectronic unit, wherein the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units are separated from each other;

a plurality of first electrodes respectively formed on the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units;

a plurality of second electrodes respectively formed on the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units;

an optical layer surrounding the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units in a top view of the optoelectronic device, wherein the optical layer comprises a boundary greater than a boundary of the substrate;

a third electrode formed on the first optoelectronic unit and one of the plurality of third optoelectronic units; and

a fourth electrode formed on the second optoelectronic unit and another one of the plurality of third optoelectronic units.

2. The optoelectronic device of claim 1, wherein the optical layer comprises silicone or epoxy.

3. The optoelectronic device of claim 2, wherein the optical layer further comprises a high reflectivity substance mixing with silicone or epoxy.

4. The optoelectronic device of claim 3, wherein the high reflectivity substance comprises TiO2.

5. The optoelectronic device of claim 1, further comprising a trench formed between adjacent two of the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units, wherein the trench exposes a surface of the substrate.

6. The optoelectronic device of claim 5, further comprising a plurality of conductor arrangement structures respectively formed between adjacent two of the first optoelectronic unit, the second optoelectronic unit, and the plurality of third optoelectronic units unit, wherein the conductor arrangement structures are separated from one another, and each of the plurality of conductor arrangement structures is conformally disposed in the trench.

7. The optoelectronic device of claim 6, wherein the plurality of conductor arrangement structures comprises a reflectivity more than 80% for a light emitting from the first optoelectronic unit, the second optoelectronic unit or the plurality of third optoelectronic units.

8. The optoelectronic device of claim 6, further comprising a first insulating layer and a second insulating layer formed on opposite sides of one of the plurality of conductor arrangement structures, wherein the second insulating layer comprises a thickness greater than a thickness of the first insulating layer.

9. The optoelectronic device of claim 8, wherein the second insulating layer comprises a distributed bragg reflector structure.

10. The optoelectronic device of claim 1, wherein the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units are arranged in a matrix or a line, in a top view of the optoelectronic device.

11. The optoelectronic device of claim 10, wherein the first optoelectronic unit and the second optoelectronic unit are at two ends of a diagonal line of the matrix.

12. The optoelectronic device of claim 10, wherein the first optoelectronic unit and the second optoelectronic unit are disposed at same column of the matrix, and/or one of the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units is arranged across another adjacent two of the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units of the matrix.

13. The optoelectronic device of claim 1, wherein each of the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units comprises a first semiconductor layer, a second semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer.

14. The optoelectronic device of claim 13, further comprising a contact layer or a metal reflection layer formed on the second semiconductor layer of one of the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units.

15. The optoelectronic device of claim 1, wherein the third electrode or the fourth electrode comprises an outer boundary, the substrate comprises a first outer boundary, and the outer boundary is beyond the first outer boundary.

16. The optoelectronic device of claim 15, wherein the optical layer surrounds the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units.

17. The optoelectronic device of claim 1, wherein the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units are connected as a zigzag.

18. The optoelectronic device of claim 1, wherein the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units comprises three kinds of shapes.

19. The optoelectronic device of claim 1, wherein the third electrode and the fourth electrode respectively comprises a bottom surface lower than a bottom surface of the optical layer.

20. The optoelectronic device of claim 1, wherein the plurality of first electrodes is only formed on the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units, and the plurality of second electrodes respectively is only formed on the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units.