Color-filter device

• US 10,522,719 B2
• Filed: 12/20/2018
• Issued: 12/31/2019
• Est. Priority Date: 04/05/2016
• Status: Active Grant

• Current Assignee: X Display Company Technology Limited (Sensinnovat BVBA)
• Original Assignee: X-Celeprint Limited
• Inventors: Cok, Ronald S., Bower, Christopher Andrew, Rotzoll, Robert R., Willner, Mark
• Primary Examiner(s): Gebreyesus, Yosef
• Application Number:
  US16/227,477
• Publication Number:
  US 20190148604A1
• Time in Patent Office: 376 Days
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 27/15 including semiconductor components having potential barriers, specially adapted for light emission
• CPC Class Codes: H01L 2933/0016 relating to electrodes
• CPC Class Codes: H01L 2933/0025 relating to coatings
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/502 Wavelength conversion materials
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil

Abstract

A micro-transfer color-filter device comprises a color filter, an electrical conductor disposed in contact with the color filter, and at least a portion of a color-filter tether attached to the color filter or structures formed in contact with the color filter. In certain embodiments, a color filter is a variable color filter electrically controlled through one or more electrodes and can be responsive to heat, electrical current, or an electrical field to modify its optical properties, such as color, transparency, absorption, or reflection. In certain embodiments, A color-filter device includes connection posts and can be provided in or on a source wafer suitable for micro-transfer printing. In some embodiments, a color-filter device is disposed on a device substrate and can include a control circuit for controlling the color filter. An array of micro-transfer color-filter devices can be disposed on a display substrate in order to form a display.

Claims

1. A method of making a color-filter device display, comprising:

providing a color-filter device source wafer, wherein the color-filter device source wafer comprises

a wafer comprising a wafer substrate, the wafer substrate comprising a patterned sacrificial layer including sacrificial portions separated by anchors; and

a color-filter device disposed entirely over each sacrificial portion, wherein the color-filter device comprises;

a color filter,

an electrical conductor disposed in contact with the color filter, and

at least a portion of a color-filter tether attached to the color filter or structures formed in contact with or supporting the color filter, wherein the color filter is a variable color filter;

providing a display substrate; and

micro-transfer printing the color-filter devices of the color-filter device source wafer from the color-filter device source wafer to the display substrate.

2. The method of claim 1, comprising micro-transfer printing a capacitor or switch, or both, to the display substrate in correspondence with each color-filter device or micro-transfer printing a capacitor or switch, or both, to each of the color-filter devices on the color-filter device wafer.

3. The method of claim 1, wherein the step of micro-transfer printing the color-filter devices of the color-filter device source wafer from the color-filter device source wafer to the display substrate comprises fracturing the at least a portion of the color-filter tether.

4. The method of claim 1, comprising providing a color-filter substrate on, in, over, or under which the electrical conductor and the color filter are disposed.

5. The method of claim 4, comprising providing multiple color filters on a surface of the color-filter substrate.

6. The method of claim 5, comprising stacking the multiple color filters on a surface of the color-filter substrate.

7. The method of claim 1, comprising providing a light-emitting diode (LED) on an LED source wafer, micro-transfer printing the color filter to the display substrate, and micro-transfer printing the LED onto or over the color filter.

8. The method of claim 1, comprising providing a light-emitting diode (LED) on an LED source wafer, micro-transfer printing the LED onto the display substrate, and micro-transfer printing the color filter onto or over the LED.

9. The method of claim 1, comprising providing an intermediate substrate and disposing the color filter on or over the intermediate substrate or an adhesive layer formed on, over, or under the intermediate substrate.

10. The method of claim 9, wherein the intermediate substrate comprises at least a portion of an intermediate tether.

11. The method of claim 10, wherein the at least a portion of an intermediate tether is the at least a portion of a color-filter tether.

12. The method of claim 10, comprising fracturing the intermediate tether.

13. The method of claim 9, comprising providing multiple color-filter devices on a surface of the intermediate substrate or an adhesive layer formed on, over, or under the intermediate substrate.

14. The method of claim 13, comprising stacking the multiple color-filter devices on a surface of the intermediate substrate or an adhesive layer formed on, over, or under the intermediate substrate.

15. The method of claim 9, comprising micro-transfer printing the intermediate substrate.

16. The method of claim 9, comprising providing a light-emitting diode (LED) on an LED source wafer, micro-transfer printing the LED onto the color filter to form an intermediate structure, and micro-transfer printing the intermediate structure to the display substrate.

17. The method of claim 9, wherein the step of disposing the color filter comprises micro-transfer printing the color filter onto the intermediate substrate or an adhesive layer formed on, over, or under the intermediate substrate.

18. The method of claim 9, wherein the step of disposing the color filter comprises forming the color filter on or over the intermediate substrate or an adhesive layer formed on, over, or under the intermediate substrate.

19. The method of claim 1, wherein the color filter is or comprises one or more of:

a phase-change material, an electrically controlled ink, a gel, a photonic crystal, or a matrix of photonic crystals.

20. The method of claim 1, wherein the electrical conductor is a resistor that heats the color filter in response to an electrical current passed through the resistor and wherein the color filter changes the color of light filtered by the color filter in response to heat received from the electrical conductor.