LED packaging material and manufacturing method of the same

• US 10,522,724 B2
• Filed: 05/30/2019
• Issued: 12/31/2019
• Est. Priority Date: 05/12/2017
• Status: Active Grant

• Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Original Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Inventors: Wang, Haijun
• Primary Examiner(s): Choi, Calvin Y
• Application Number:
  US16/425,976
• Publication Number:
  US 20190280173A1
• Time in Patent Office: 215 Days
• Field of Search: None
• CPC Class Codes: C08K 3/04 Carbon
• CPC Class Codes: C08K 9/04 Ingredients treated with organic substances treated with macromolecular compounds C08K9/08
• CPC Class Codes: C08L 101/00 Compositions of unspecified macromolecular compounds
• CPC Class Codes: C08L 2201/08 Stabilised against heat, light or radiation or oxydation
• CPC Class Codes: C08L 2203/206 use in coating or encapsulating of electronic parts
• CPC Class Codes: H01L 33/005 Processes
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin

Abstract

A light-emitting diode (LED) packaging material is formed by compounding graphene with silane or epoxy resin, to improve the defects of manufacturing an LED packaging material only of silane or epoxy resin. The addition of graphene helps improve the performance of the LED packaging material. Also provided is a manufacturing method of a LED packaging material.

Claims

1. A light-emitting diode (LED) packaging material, comprising silane, a control agent, a basic ion exchange resin, and graphene, wherein a mass percentage of the basic ion exchange resin is 5%-10%;

a mass percentage of graphene is 0.5%-2%; and

a molar ratio of silane and the control agent is 1;

0.3-1;

1.

2. The LED packaging material according to claim 1, wherein the control agent comprises terminal hydroxyl groups;

and the basic ion exchange resin is a basic anion exchange resin or a basic cation exchange resin.