LED lighting apparatus
First Claim
1. An LED lighting apparatus comprising:
- a plurality of LED chips;
a substrate including a mount surface on which the LED chips are mounted; and
an electronic element mounted on the substrate and including a circuit that causes the LED chips to emit light,wherein the LED chips are arranged at or near a center of the mount surface of the substrate,the substrate includes a base, a wiring pattern formed on the base, and an insulating layer formed on the base or the wiring pattern and formed with a plurality of openings,the wiring pattern includes a plurality of pad portions comprising parts of the wiring pattern, respectively,each of the parts of the wiring pattern is exposed through one of the openings of the insulating layer as viewed in a thickness direction of the substrate,each of the LED chips is mounted on one of the pad portions,the apparatus further comprises a socket supporting the substrate,the socket includes a light-emitting cylindrical portion that houses the substrate and that is open in a direction in which the mount surface of the substrate faces,the socket includes a bottom plate portion closing the light-emitting cylindrical portion from a side opposite to the side to which the mount surface of the substrate faces,the socket includes a fin projecting from the bottom plate portion away from the substrate,the socket includes a coupling-side cylindrical portion that houses at least a portion of the fin,the coupling-side cylindrical portion includes a stepped portion, andthe LED lighting apparatus further comprises a packing fitted to the stepped portion of the coupling-side cylindrical portion.
1 Assignment
0 Petitions
Accused Products
Abstract
An LED lighting apparatus is provided. The LED lighting apparatus includes LED chips, a substrate, and an electronic element. The substrate includes a mount surface on which the LED chips are mounted. The LED chips are arranged at or near a center of the mount surface of the substrate. The substrate includes a base, a wiring pattern, and an insulating layer. The wiring pattern is formed on the base. The insulating layer is formed on the base or the wiring pattern and formed with a plurality of openings. The wiring pattern includes pad portions comprising parts of the wiring pattern, respectively. Each of the parts of the wiring pattern is exposed through one of the openings of the insulating layer as viewed in a thickness direction of the substrate. Each of the LED chips is mounted on one of the pad portions.
8 Citations
26 Claims
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1. An LED lighting apparatus comprising:
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a plurality of LED chips; a substrate including a mount surface on which the LED chips are mounted; and an electronic element mounted on the substrate and including a circuit that causes the LED chips to emit light, wherein the LED chips are arranged at or near a center of the mount surface of the substrate, the substrate includes a base, a wiring pattern formed on the base, and an insulating layer formed on the base or the wiring pattern and formed with a plurality of openings, the wiring pattern includes a plurality of pad portions comprising parts of the wiring pattern, respectively, each of the parts of the wiring pattern is exposed through one of the openings of the insulating layer as viewed in a thickness direction of the substrate, each of the LED chips is mounted on one of the pad portions, the apparatus further comprises a socket supporting the substrate, the socket includes a light-emitting cylindrical portion that houses the substrate and that is open in a direction in which the mount surface of the substrate faces, the socket includes a bottom plate portion closing the light-emitting cylindrical portion from a side opposite to the side to which the mount surface of the substrate faces, the socket includes a fin projecting from the bottom plate portion away from the substrate, the socket includes a coupling-side cylindrical portion that houses at least a portion of the fin, the coupling-side cylindrical portion includes a stepped portion, and the LED lighting apparatus further comprises a packing fitted to the stepped portion of the coupling-side cylindrical portion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. An LED lighting apparatus comprising:
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a plurality of LED chips; a substrate including a mount surface on which the LED chips are mounted; and an electronic element mounted on the substrate and including a circuit that causes the LED chips to emit light, wherein the LED chips are arranged at or near a center of the mount surface of the substrate, the substrate includes a base, a wiring pattern formed on the base, and an insulating layer formed on the base or the wiring pattern and formed with a plurality of openings, the wiring pattern includes a plurality of pad portions comprising parts of the wiring pattern, respectively, each of the parts of the wiring pattern is exposed through one of the openings of the insulating layer as viewed in a thickness direction of the substrate, each of the LED chips is mounted on one of the pad portions, the apparatus further comprises a socket supporting the substrate, the socket includes a light-emitting cylindrical portion that houses the substrate and that is open in a direction in which the mount surface of the substrate faces, the socket includes a bottom plate portion that is formed integral with the light-emitting cylindrical portion and that supports the substrate, the bottom plate portion is formed with a first through-hole extending through the bottom plate portion, and the base is formed with a second through-hole extending through the base, and the second through-hole overlaps with the first through-hole as viewed in the thickness direction of the substrate. - View Dependent Claims (22, 23, 24, 25, 26)
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Specification