MEMS actuation systems and methods

• US 10,523,135 B2
• Filed: 09/08/2017
• Issued: 12/31/2019
• Est. Priority Date: 09/12/2016
• Status: Active Grant

• Current Assignee: MEMS Drive, Inc.
• Original Assignee: MEMS Drive, Inc.
• Inventors: Ng, Matthew, Liu, Xiaolei, Wang, Guiqin
• Primary Examiner(s): Payen, Marvin
• Application Number:
  US15/699,007
• Publication Number:
  US 20180072565A1
• Time in Patent Office: 844 Days
• CPC Class Codes: B81B 2201/033 Comb drives
• CPC Class Codes: B81B 2203/0118 Cantilevers
• CPC Class Codes: B81B 2203/0145 Flexible holders
• CPC Class Codes: B81B 2203/051 Translation according to an axis parallel to the substrate
• CPC Class Codes: B81B 2203/053 Translation according to an axis perpendicular to the substrate
• CPC Class Codes: B81B 3/0021 Transducers for transforming electrical into mechanical energy or vice versa dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00
• CPC Class Codes: B81B 3/0062 Devices moving in two or more dimensions, i.e. having special features which allow movement in more than one dimension
• CPC Class Codes: B81B 7/0016 Protection against shocks or vibrations, e.g. vibration damping
• CPC Class Codes: B81C 2203/032 Gluing
• CPC Class Codes: G02B 27/646 compensating for small deviations, e.g. due to vibration or shake movement of one or more optical elements for control of motion blur in cameras, projectors or printers G03B2205/0007; image stabilisation in cameras peculiar to the presence or use of an electronic image sensor H04N23/68
• CPC Class Codes: H02N 2/02 producing linear motion, e.g. actuators; Linear positioners ; Linear motors
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/58 Means for changing the camera field of view without moving the camera body, e.g. nutating or panning of optics or image sensors
• CPC Class Codes: H10N 30/2044 having multiple segments mechanically connected in series, e.g. zig-zag type

Abstract

A method of manufacturing a micro-electrical-mechanical system (MEMS) assembly includes mounting a micro-electrical-mechanical system (MEMS) actuator to a metal plate. An image sensor assembly is mounted to the micro-electrical-mechanical system (MEMS) actuator. The image sensor assembly is electrically coupled to the micro-electrical-mechanical system (MEMS) actuator, thus forming a micro-electrical-mechanical system (MEMS) subassembly.

Claims

1. A method of manufacturing a micro-electrical-mechanical system (MEMS) assembly comprising:

mounting a MEMS actuator to a metal plate, wherein mounting the MEMS actuator to the metal plate includes, applying epoxy to the metal plate, positioning the MEMS actuator on the epoxy, and curing the epoxy;

mounting an image sensor assembly to the MEMS actuator; and

electrically coupling the image sensor assembly to the MEMS actuator, thus forming a MEMS subassembly.

2. The method of manufacturing the MEMS assembly of claim 1 wherein mounting the image sensor assembly to the MEMS actuator includes:

applying epoxy to the MEMS actuator;

positioning the image sensor on the epoxy; and

curing the epoxy.

3. The method of manufacturing the MEMS assembly of claim 1 wherein electrically coupling the image sensor assembly to the MEMS actuator includes:

wirebonding the image sensor assembly to the MEMS actuator.

4. The method of manufacturing the MEMS assembly of claim 1 further comprising:

mounting the MEMS subassembly to a printed circuit board.

5. The method of manufacturing the MEMS assembly of claim 4 wherein mounting the MEMS subassembly to the printed circuit board includes:

applying epoxy to the printed circuit board;

positioning the MEMS subassembly on the epoxy; and

curing the epoxy.

6. The method of manufacturing the MEMS assembly of claim 4 further comprising:

electrically coupling the MEMS subassembly to the printed circuit board.

7. The method of manufacturing the MEMS assembly of claim 6 wherein electrically coupling the MEMS subassembly to the printed circuit board includes:

wirebonding the MEMS subassembly to the printed circuit board.

8. The method of manufacturing the MEMS assembly of claim 7 wherein electrically coupling the MEMS subassembly to the printed circuit board further includes:

encapsulating the wirebonding in epoxy.

9. The method of manufacturing the MEMS assembly of claim 1 further comprising:

mounting a holder assembly to the MEMS subassembly.

10. The method of manufacturing the MEMS assembly of claim 9 wherein mounting the holder assembly to the MEMS subassembly includes:

applying epoxy to the printed circuit board;

positioning the holder assembly on the epoxy; and

curing the epoxy.

11. A method of manufacturing a micro-electrical-mechanical system (MEMS) assembly comprising:

mounting a MEMS actuator to a metal plate, wherein mounting the MEMS actuator to the metal plate includes, applying epoxy to the metal plate, positioning the MEMS actuator on the epoxy, and curing the epoxy;

mounting an image sensor assembly to the MEMS actuator;

electrically coupling the image sensor assembly to the MEMS actuator, thus forming a MEMS subassembly;

mounting the MEMS subassembly to a printed circuit board; and

electrically coupling the MEMS subassembly to the printed circuit board.

12. The method of manufacturing the MEMS assembly of claim 11 wherein mounting the image sensor assembly to the MEMS actuator includes:

applying epoxy to the MEMS actuator;

positioning the image sensor on the epoxy; and

curing the epoxy.

13. The method of manufacturing the MEMS assembly of claim 11 wherein electrically coupling the image sensor assembly to the MEMS actuator includes:

wirebonding the image sensor assembly to the MEMS actuator.

14. The method of manufacturing the MEMS assembly of claim 11 wherein mounting the MEMS subassembly to the printed circuit board includes:

applying epoxy to the printed circuit board;

positioning the MEMS subassembly on the epoxy; and

curing the epoxy.

15. The method of manufacturing the MEMS assembly of claim 11 wherein electrically coupling the MEMS subassembly to the printed circuit board includes:

wirebonding the MEMS subassembly to the printed circuit board; and

encapsulating the wirebonding in epoxy.

16. The method of manufacturing the MEMS assembly of claim 11 further comprising:

mounting a holder assembly to the MEMS subassembly.

17. The method of manufacturing the MEMS assembly of claim 16 wherein mounting the holder assembly to the MEMS subassembly includes:

applying epoxy to the printed circuit board;

positioning the holder assembly on the epoxy; and

curing the epoxy.

18. A method of manufacturing a micro-electrical-mechanical system (MEMS) assembly comprising:

mounting a MEMS actuator to a metal plate, wherein mounting the MEMS actuator to the metal plate includes, applying epoxy to the metal plate, positioning the MEMS actuator on the epoxy, and curing the epoxy;

mounting an image sensor assembly to the MEMS actuator;

electrically coupling the image sensor assembly to the MEMS actuator, thus forming a MEMS subassembly;

mounting the MEMS subassembly to a printed circuit board;

electrically coupling the MEMS subassembly to the printed circuit board; and

mounting a holder assembly to the MEMS subassembly.