Electric power conversion apparatus

• US 10,524,398 B2
• Filed: 04/10/2017
• Issued: 12/31/2019
• Est. Priority Date: 03/11/2008
• Status: Active Grant

• Current Assignee: Hitachi Astemo Ltd. (Hitachi, Ltd.)
• Original Assignee: Hitachi, Ltd.
• Inventors: Tokuyama, Takeshi, Nakatsu, Kinya, Saito, Ryuichi, Horiuchi, Keisuke, Satoh, Toshiya, Miyazaki, Hideki
• Primary Examiner(s): Patel, Mukundbhai G
• Application Number:
  US15/483,630
• Publication Number:
  US 20170215304A1
• Time in Patent Office: 995 Days
• Field of Search: 361704, 361707, 361711-714, 257727, 257E25015
• CPC Class Codes: B60K 17/16 of differential gearing
• CPC Class Codes: B60K 6/26 characterised by the motors or the generators
• CPC Class Codes: B60K 6/28 characterised by the electric energy storing means, e.g. batteries or capacitors
• CPC Class Codes: B60K 6/46 Series type
• CPC Class Codes: B60L 15/007 Physical arrangements or structures of drive train converters specially adapted for the propulsion motors of electric vehicles
• CPC Class Codes: B60L 2210/40 DC to AC converters
• CPC Class Codes: B60L 2220/14 Synchronous machines
• CPC Class Codes: B60L 2240/429 Current
• CPC Class Codes: B60L 50/51 characterised by AC-motors
• CPC Class Codes: B60Y 2200/92 Hybrid vehicles
• CPC Class Codes: H01L 2224/36 Structure, shape, material or disposition of the strap connectors prior to the connecting process
• CPC Class Codes: H01L 2224/40 of an individual strap connector
• CPC Class Codes: H01L 2224/40137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/3675 characterised by the shape of the housing
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 23/492 Bases or plates or solder therefor
• CPC Class Codes: H01L 23/49517 Additional leads
• CPC Class Codes: H01L 24/40 : of an individual strap connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 25/072 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/1203 : Rectifying Diode
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H02M 7/003 : Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H02M 7/537 : using semiconductor devices only, e.g. single switched pulse inverters
• CPC Class Codes: H02P 27/06 : using dc to ac converters or inverters H02P27/05 takes precedence
• CPC Class Codes: H05K 1/0262 : Arrangements for regulating voltages or for using plural voltages
• CPC Class Codes: H05K 7/14329 : specially adapted for the configuration of power bus bars
• CPC Class Codes: H05K 7/2089 : for power electronics, e.g. for inverters for controlling motor
• CPC Class Codes: H05K 7/20927 : Liquid coolant without phase change
• CPC Class Codes: Y02T 10/70 : Energy storage systems for electromobility, e.g. batteries
• CPC Class Codes: Y10S 903/906 : Motor or generator
• CPC Class Codes: Y10S 903/907 : Electricity storage, e.g. battery, capacitor
• CPC Class Codes: Y10S 903/909 : Gearing

Abstract

An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

Claims

1. A power semiconductor module, comprising:

a plurality of power semiconductor elements that includes a first IGBT, a second IGBT, a first diode, and a second diode;

a plurality of conducting plates on which a part of the plurality of power semiconductor elements is joined, the plurality of conducting plates including a first conducting plate and a second conducting plate; and

a plurality of terminals including a first DC terminal and a second DC terminal, which are connected with the first and second conducting plates, respectively, wherein

each of the first conducting plate and the second conducting plate includes a main surface that is wider than other surfaces of the first and second conducting plates and a side surface that is narrower than the main surface, and

when viewed from a direction perpendicular to the main surface of the first conducting plate and the second conducting plate, the first IGBT, the second IGBT, the first diode, and the second diode are arranged such that

a first centerline passes through a center of the first IGBT and a center of the first diode,

a second centerline passes through a center of the second IGBT and a center of the second diode,

the first DC terminal is arranged between the first centerline and the second centerline, and

the second DC terminal is arranged so as to overlap with the second centerline and not to overlap with the first DC terminal.

2. The power semiconductor module according to claim 1, wherein

the plurality of conducting plates further includes a third conducting plate which opposes the first conducting plate with the first IGBT and the first diode interposed therebetween,

the terminal further includes an AC terminal that is continuous with the third conducting plate, and

when viewed from a direction perpendicular to the main surface of the first conducting plate and the second conducting plate, the first DC terminal is arranged in a space between the second DC terminal and the AC terminal.

3. The power semiconductor module according to claim 2, wherein

the AC terminal is arranged so as to overlap with the first centerline.

4. The power semiconductor module according to claim 1, further comprising:

a first heat dissipation member and a second heat dissipation member that are made of electrically conductive material, wherein

the plurality of power semiconductor elements and the first and second conducting plates are interposed between the first heat dissipation member and the second heat dissipation member, and

the first DC terminal and the second DC terminal are arranged outside of a space between the first heat dissipation member and the second heat dissipation member.

5. The power semiconductor module according to claim 4, wherein

a first electric insulation member is provided between the first conducting plate and the first heat dissipation member,

a second electric insulation member is provided between the second conducting plate and the second heat dissipation member, and

the plurality of power semiconductor elements are sealed with a mold resin.

6. The power semiconductor module according to claim 1, wherein

the second DC terminal and the second conducting plate are integrally formed without a seam.

7. The power semiconductor module according to claim 1, wherein

the first conducting plate has a first soldered portion to which the first IGBT is joined, and

a thickness of the first soldered portion is larger than a thickness of the first DC terminal.