Method for manufacturing electronic component with coil

• US 10,529,485 B2
• Filed: 08/20/2019
• Issued: 01/07/2020
• Est. Priority Date: 03/14/2013
• Status: Active Grant

• Current Assignee: Sumida Corporation
• Original Assignee: Sumida Corporation
• Inventors: Sakamoto, Shinichi, Malcolm, Douglas James
• Primary Examiner(s): Nguyen, Tuyen T
• Application Number:
  US16/545,618
• Publication Number:
  US 20190371524A1
• Time in Patent Office: 140 Days
• Field of Search: 336 65, 336 83, 336 90, 336 96, 336220-223, 296021, 29604-606, 29846, 29848
• CPC Class Codes: H01F 17/04 with magnetic core
• CPC Class Codes: H01F 2017/048 with encapsulating core, e.g. made of resin and magnetic powder
• CPC Class Codes: H01F 27/022 Encapsulation
• CPC Class Codes: H01F 27/24 Magnetic cores
• CPC Class Codes: H01F 27/255 made from particles H01F27/26 takes precedence
• CPC Class Codes: H01F 27/2828 Construction of conductive connections, of leads
• CPC Class Codes: H01F 27/29 Terminals; Tapping arrangements for signal inductances
• CPC Class Codes: H01F 41/02 for manufacturing cores, coils, or magnets H01F41/14 takes precedence; for dynamo-electric machines H02K15/00
• CPC Class Codes: H01F 41/0246 Manufacturing of magnetic circuits by moulding or by pressing powder magnetic cores made by moulding or by pressing powder H01F27/255; soft magnetic particles H01F1/20, H01F1/36
• CPC Class Codes: H01F 41/064 Winding non-flat conductive wires, e.g. rods, cables or cords
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49071 by winding or coiling

Abstract

A method for manufacturing an electronic component is provided. The method includes placing a T-shaped core and an air-core coil in a mold, placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the T-shaped core and the air-core coil in the mixture, applying pressure in a range of 0.1 to 20.0 kg/cm2 to the placed mixture so that a shape of the placed mixture conforms to the T-shaped core, the air-core coil, and the mold, and, after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.

Claims

1. A method for manufacturing an electronic component comprising:

placing an air-core coil in a mold;

placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the air-core coil in the mixture;

after placing the mixture, applying a pressure to the placed mixture so that a shape of the placed mixture conforms to the air-core coil and the mold; and

after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened,

wherein the mixture is supplied into the mold by a dispenser, and the dispenser includes;

a material tank in which the mixture is stored;

a cylinder;

a flow passage fluidly connected between the material tank and the cylinder;

a mixer disposed in the cylinder and configured to mix the mixture;

a valve disposed in the flow passage, the valve being configured to selectively supply the mixture from the material tank to the cylinder via the flow passage;

a valve driving member configured to drive the valve;

a piston movably disposed in the cylinder and configured to move the mixture in the cylinder; and

a discharge opening from which the mixture is supplied into the mold.

2. The method for manufacturing an electronic component according to claim 1,

wherein a T-shaped core using for support the air-core coil is placed into the mold with the air-core coil together.

3. The method for manufacturing an electronic component according to claim 1,

wherein the pressure applied to the placed mixture is in a range of 0.1 to 20.0 kg/cm2.

4. The method for manufacturing an electronic component according to claim 1,

wherein the predetermined temperature is in a range of 120 to 200°

C. and the predetermined time is in a range of 10 to 90 minutes.

5. The method for manufacturing an electronic component according to claim 2, further comprising:

winding a wire to form the air-core coil, and

preparing the T-shaped core separately,

wherein an inside diameter of the air-core coil is larger than an outside diameter of a core part of the T-shaped core.

6. The method for manufacturing an electronic component according to claim 5,

wherein the difference of the diameters is larger than a distance of several times a maximum particle in the mixture so that the mixture fills between the core part and the air-core coil.

7. The method for manufacturing an electronic component according to claim 2, further comprising:

preparing the mixture at the same time as preparing the T-shaped core and the air-core coil,

wherein the mixture comprises Fe—

Si—

Cr alloy and resin, and a viscosity of the mixture is 1,000 to 1,000,000 mPa·

s at room temperature.

8. The method for manufacturing an electronic component according to claim 7,

wherein a solvent is used in the mixture.

9. The method for manufacturing an electronic component according to claim 2, further comprising:

dipping both ends of the air-core coil in solder so that insulating layers on the ends are removed, and solder are adheres to the ends of the air-core coil,

after that, the air-cored coil is assembled with the T-shaped core.

10. The method for manufacturing an electronic component according to claim 9, further comprising:

placing the air-core coil on a first surface of the T-shaped core;

bending the end wires at a side of the T-shaped core; and

fixing both ends to a second surface of the T-shaped core opposite the first surface.