Setting up ultra-small or ultra-thin discrete components for easy assembly
First Claim
Patent Images
1. A method comprising:
- attaching a release layer to a handle substrate, in which the release layer comprises multiple layers, in which a first layer of the multiple layers is a permanent adhesive and a second layer of the multiple layers is one or more of thermally sensitive and UV sensitive;
releasing a discrete component from an interim handle and depositing the discrete component on the handle substrate such that the discrete component is releasably attached to the release layer, the discrete component having an ultra-thin, an ultra-small, or an ultra-thin and ultra-small configuration, at least one side of the handle substrate having a length longer than at least one side of the discrete component; and
depositing the discrete component onto a device substrate and releasing the discrete component from the handle substrate, in which depositing the discrete component onto the device substrate comprises interconnecting the discrete component to the device substrate.
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Abstract
Among other things a method including releasing a discrete component from an interim handle and depositing a discrete component on a handle substrate, attaching the handle substrate to the discrete component, and removing the handle substrate from the discrete component.
13 Citations
23 Claims
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1. A method comprising:
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attaching a release layer to a handle substrate, in which the release layer comprises multiple layers, in which a first layer of the multiple layers is a permanent adhesive and a second layer of the multiple layers is one or more of thermally sensitive and UV sensitive; releasing a discrete component from an interim handle and depositing the discrete component on the handle substrate such that the discrete component is releasably attached to the release layer, the discrete component having an ultra-thin, an ultra-small, or an ultra-thin and ultra-small configuration, at least one side of the handle substrate having a length longer than at least one side of the discrete component; and depositing the discrete component onto a device substrate and releasing the discrete component from the handle substrate, in which depositing the discrete component onto the device substrate comprises interconnecting the discrete component to the device substrate. - View Dependent Claims (2, 3)
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4. A method comprising:
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attaching a release layer to a handle substrate; releasing a discrete component from an interim handle and depositing the discrete component on the handle substrate such that the discrete component is releasably attached to the release layer, the discrete component having an ultra-thin, an ultra-small, or an ultra-thin and ultra-small configuration, at least one side of the handle substrate having a length longer than at least one side of the discrete component; and depositing the discrete component onto a device substrate and releasing the discrete component from the handle substrate, in which depositing the discrete component onto the device substrate comprises interconnecting the discrete component to the device substrate, in which releasing the discrete component from the handle is at least partially contemporaneous with interconnecting the discrete component to the device substrate. - View Dependent Claims (5, 6)
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7. A method comprising
a. applying a process step to cause a material between a surface of an ultra-thin, an ultra-small, or an ultra-thin and ultra-small discrete component and a substrate to which the ultra-thin and ultra-small discrete component is to be attached, to change to a state in which the material holds the ultra-thin and ultra-small discrete component on the substrate, b. the processing step at least partially concurrently causing or resulting in a material that temporarily holds an opposite surface of the ultra-thin and ultra-small discrete component on a handle that is being held by a chuck of a pick and place tool, to change to a state in which the material no longer holds the ultra-thin and ultra-small discrete component to the handle.
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12. A method comprising:
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attaching a release layer to the handle substrate, in which the release layer comprises multiple layers, wherein a first layer of the multiple layers is permanent adhesive and a second layer of the multiple layers is one or more of thermally sensitive and UV sensitive; depositing an ultra-thin wafer onto the handle substrate such that the ultra-thin wafer is releasably attached to the release layer; releasing a discrete component from the ultra-thin wafer, the discrete component having an ultra-thin configuration, handle substrate having a thickness of at least 50 microns; and depositing the discrete component onto a device substrate and releasing the discrete component from the handle substrate, in which depositing the discrete component onto the device substrate comprises interconnecting the discrete component to the device substrate. - View Dependent Claims (13, 14)
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15. A method comprising:
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depositing an ultra-thin wafer onto a handle substrate; releasing a discrete component from the ultra-thin wafer, the discrete component having an ultra-thin configuration, handle substrate having a thickness of at least 50 microns; and depositing the discrete component onto a device substrate and releasing the discrete component from the handle substrate, in which depositing the discrete component onto the device substrate comprises interconnecting the discrete component to the device substrate, in which releasing the discrete component from the handle is at least partially contemporaneous with interconnecting the discrete component to the device substrate. - View Dependent Claims (16, 17, 18)
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19. A method comprising:
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using a releasable layer to attach a handle substrate to a discrete component, in which the releasable layer comprises multiple layers, wherein a first layer of the multiple layers is a permanent adhesive and a second layer of the multiple layers is one or more of thermally sensitive and UV sensitive; while the handle substrate is attached to the discrete component, using a tool to hold the handle substrate and cause the discrete component to contact an adhesive layer on the device substrate; and causing the releasable layer to release the handle substrate from the discrete component and causing the discrete component to become attached to the device substrate at the adhesive layer. - View Dependent Claims (20, 21)
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22. A method comprising:
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using a releasable layer to attach a handle substrate to a discrete component, while the handle substrate is attached to the discrete component, using a tool to hold the handle substrate and cause the discrete component to contact an adhesive layer on the device substrate, and causing the releasable layer to release the handle substrate from the discrete component and causing the discrete component to become attached to the device substrate at the adhesive layer, in which releasing the discrete component from the handle is at least partially contemporaneous with attaching the discrete component to the device substrate. - View Dependent Claims (23)
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Specification