Apparatus and method for transfering semiconductor devices from a substrate and stacking semiconductor devices on each other

• US 10,529,685 B2
• Filed: 02/07/2018
• Issued: 01/07/2020
• Est. Priority Date: 02/07/2017
• Status: Active Grant

• Current Assignee: Cowles SEMI LLC
• Original Assignee: Rohinni LLC
• Inventors: Huska, Andrew, Peterson, Cody
• Primary Examiner(s): Nguyen, Thanh T
• Application Number:
  US15/891,018
• Publication Number:
  US 20180226376A1
• Time in Patent Office: 699 Days
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/6836 Wafer tapes, e.g. grinding or dicing support tapes adhesive tapes in general C09J7/20
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/75262 in the lower part of the bonding apparatus, e.g. in the apparatus chuck
• CPC Class Codes: H01L 2224/75263 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/753 by means of pressure
• CPC Class Codes: H01L 2224/75301 Bonding head
• CPC Class Codes: H01L 2224/75343 by ultrasonic vibrations
• CPC Class Codes: H01L 2224/75701 in the lower part of the bonding apparatus, e.g. in the apparatus chuck
• CPC Class Codes: H01L 2224/75702 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/75704 in the lower part of the bonding apparatus, e.g. in the apparatus chuck
• CPC Class Codes: H01L 2224/75705 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/75753 Means for optical alignment, e.g. sensors
• CPC Class Codes: H01L 2224/75901 using a computer, e.g. fully- or semi-automatic bonding
• CPC Class Codes: H01L 2224/7598 specially adapted for batch processes
• CPC Class Codes: H01L 2224/79262 in the lower part of the bonding apparatus, e.g. in the apparatus chuck
• CPC Class Codes: H01L 2224/7955 Mechanical means, e.g. for pressing, stamping
• CPC Class Codes: H01L 2224/79753 : Means for optical alignment, e.g. sensors
• CPC Class Codes: H01L 2224/81005 : being a temporary or sacrificial substrate
• CPC Class Codes: H01L 2224/81121 : Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
• CPC Class Codes: H01L 2224/81201 : Compression bonding
• CPC Class Codes: H01L 2224/81203 : Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
• CPC Class Codes: H01L 2224/81205 : Ultrasonic bonding
• CPC Class Codes: H01L 2224/8122 : with energy being in the form of electromagnetic radiation
• CPC Class Codes: H01L 2224/81224 : using a laser
• CPC Class Codes: H01L 2224/81801 : Soldering or alloying
• CPC Class Codes: H01L 2224/81862 : Heat curing
• CPC Class Codes: H01L 2224/81905 : Combinations of bonding methods provided for in at least two different groups from H01L2224/818 - H01L2224/81904
• CPC Class Codes: H01L 2224/83005 : being a temporary or sacrificial substrate
• CPC Class Codes: H01L 2224/83191 : wherein the layer connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83193 : wherein the layer connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83201 : Compression bonding
• CPC Class Codes: H01L 2224/83203 : Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
• CPC Class Codes: H01L 2224/83224 : using a laser
• CPC Class Codes: H01L 2224/83805 : involving forming a eutectic alloy at the bonding interface
• CPC Class Codes: H01L 2224/86121 : Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
• CPC Class Codes: H01L 2224/86214 : using a laser
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/79 : Apparatus for Tape Automated Bonding [TAB]
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/86 : using tape automated bonding [TAB]
• CPC Class Codes: H01L 25/0753 : the devices being arranged next to each other
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 33/0095 : Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An apparatus including components to stack semiconductor device die.

Claims

1. An apparatus to directly transfer a first semiconductor device die to a substrate from a wafer tape having a first side and a second side, the first semiconductor device die being disposed on the first side of the wafer tape, the substrate including a second semiconductor device die onto which the first semiconductor device die is to be transferred, the apparatus comprising:

a first frame to hold the wafer tape;

a second frame to hold the substrate adjacent to the first side of the wafer tape;

a needle disposed adjacent to the second side of the wafer tape and extending in a direction toward the wafer tape; and

a needle actuator connected to the needle to move the needle, during a direct transfer process, to a die transfer position at which the needle contacts the second side of the wafer tape to press the first semiconductor device die into contact with the second semiconductor device die,

wherein a bond between the first semiconductor device die and the second semiconductor device die is induced such that the first semiconductor device die is released from the wafer tape and is attached to the second semiconductor device die.

2. The apparatus according to claim 1, further comprising a controller communicatively coupled to the first frame and the second frame, the controller being configured to:

orient the first frame such that the first semiconductor device die on the wafer tape is aligned with a die transfer location on the substrate, and/or

orient the second frame such that the die transfer location on the substrate is aligned with the first semiconductor device die.

3. The apparatus according to claim 1, further comprising:

a first optical sensor positioned to sense a position of the first semiconductor device die with respect to a die transfer location on the second semiconductor device die; and

a second optical sensor positioned to sense a position of the second semiconductor device die as the die transfer location on the substrate.

4. The apparatus according to claim 1, wherein the needle actuator is configured to apply the needle to cause pressure between the first semiconductor device die and the second semiconductor device die on the substrate.

5. The apparatus according to claim 1, further comprising an energy-emitting device configured to emit heat energy at a die transfer location aligned with the first semiconductor device die and the second semiconductor device die.

6. The apparatus according to claim 5, wherein the energy-emitting device includes a laser.

7. The apparatus according to claim 1, wherein the needle actuator is configured to move the needle, during the direct transfer process, to cause a deflection of the wafer tape at a localized position of the first semiconductor device die.

8. A system for performing a direct transfer of a first semiconductor device die to a substrate from a wafer tape having a first side and a second side, the first semiconductor device die being disposed on the first side of the wafer tape, the substrate including a second semiconductor device die onto which the first semiconductor device die is to be transferred, the system comprising:

a first conveyance mechanism to convey the wafer tape;

a second conveyance mechanism to convey the substrate with respect to the wafer tape;

a transfer mechanism disposed adjacent to the first conveyance mechanism to effectuate the direct transfer;

a controller including one or more processors communicatively coupled with the first conveyance mechanism, the second conveyance mechanism, and the transfer mechanism, the controller having executable instructions, which when executed cause the one or more processors to perform operations including;

determining a position of the second semiconductor device die based at least in part on map data, the map data describing where the first semiconductor device die is to be transferred onto the second semiconductor device die,

conveying at least one of the wafer tape or the substrate such that the substrate is adjacent to the first side of the wafer tape and disposed relative to the second conveyance mechanism to permit stacking of the first semiconductor device die onto the second semiconductor device die,

orienting the transfer mechanism to a position adjacent to the second side of the wafer tape, and

activating the transfer mechanism to contact the second side of the wafer tape to press the first semiconductor device die into contact with the second semiconductor device die such that the first semiconductor device die is released from the wafer tape and is attached to the second semiconductor device die.

9. The system of claim 8, wherein the first conveyance mechanism includes a frame to secure the wafer tape within the frame, and

wherein the frame is movable in at least one direction.

10. The system of claim 8, wherein the transfer mechanism includes a needle to press on the second side of the wafer tape.

11. The system of claim 8, further comprising a sensor communicatively coupled with the transfer mechanism, the sensor configured to determine a position of the first semiconductor device die relative to a transfer fixing location on the second semiconductor device die,

wherein the conveying further includes conveying the at least one of the wafer tape or the substrate to align the position of the first semiconductor device die with the transfer fixing location.

12. The system of claim 8, further comprising a sensor communicatively coupled with the transfer mechanism, the sensor configured to determine the position of the second semiconductor device die with respect to the transfer mechanism,

wherein the conveying further includes conveying the at least one of the wafer tape or the substrate to align the position of the second semiconductor device die with the transfer mechanism.

13. A system for performing a direct transfer of a first semiconductor device die to a substrate from a wafer tape having a first side and a second side, the first semiconductor device die being disposed on the first side of the wafer tape, the substrate including a second semiconductor device die onto which the first semiconductor device die is to be transferred, the system comprising:

a first conveyance mechanism to convey the wafer tape;

a second conveyance mechanism to convey the substrate with respect to the wafer tape; and

a transfer mechanism disposed adjacent to the first conveyance mechanism to effectuate the direct transfer;

wherein a bond between the first semiconductor device die and the second semiconductor device die is induced such that the first semiconductor device die is released from the wafer tape and is attached to the second semiconductor device die, and

wherein the first conveyance mechanism is conveyed to a different position relative to the second conveyance mechanism to permit stacking of the first semiconductor device die onto the second semiconductor device die.

14. The system of claim 13, wherein the first conveyance mechanism is conveyed in a vertical direction to accommodate for a differential in space between the transfer mechanism and the substrate created by a placement of the first semiconductor device die onto the second semiconductor device die to permit the stacking of the first semiconductor device die onto the second semiconductor device die.

15. The system of claim 13, further comprising:

a controller including a processor communicatively coupled with the first conveyance mechanism, the second conveyance mechanism, and the transfer mechanism, the controller including executable instructions, which, when executed, cause the processor to perform operations including;

conveying at least one of the wafer tape or the substrate such that the substrate is adjacent to the first side of the wafer tape,

orienting the transfer mechanism to a position adjacent to the second side of the wafer tape, and

activating the transfer mechanism to contact the second side of the wafer tape to press the first semiconductor device die into contact with the second semiconductor device die such that the first semiconductor device die is released from the wafer tape and is attached to the second semiconductor device die.

16. The system of claim 15, wherein the executable instructions, which, when executed, cause the processor to perform further operations including arranging the first conveyance mechanism relative to the second conveyance mechanism to a subsequent transfer orientation to permit stacking of a third semiconductor device die onto the first semiconductor device die.

17. The system of claim 16, wherein the arranging includes:

determining, based at least in part on data input from a first optical sensor, a position of the first semiconductor device die with respect to a die transfer location on the second semiconductor device die; and

determining, based at least on data input from a second optical sensor, a position of the die transfer location on the second semiconductor device die.

18. The system of claim 15, wherein the executable instructions, which, when executed, cause the processor to perform further operations including determining a position of the first semiconductor device die relative to a die transfer location on the substrate to provide the controller with alignment information.

19. The system of claim 15, wherein the executable instructions, which, when executed, cause the processor to perform further operations including:

determining whether additional semiconductor device die are to be transferred from the wafer tape to the substrate,

wherein, when determined that additional semiconductor device die are to be transferred, arranging the first conveyance mechanism and the second conveyance mechanism to a subsequent die transfer orientation.

20. The system of claim 13, further comprising an energy-emitting device configured to emit heat energy at a die transfer location aligned with the first semiconductor device die and the second semiconductor device die, wherein the energy-emitting device includes a laser.