Modular plug connector with multilayer PCB for very high speed applications

• US 10,530,106 B2
• Filed: 01/30/2019
• Issued: 01/07/2020
• Est. Priority Date: 01/31/2018
• Status: Active Grant

• Current Assignee: Bel Fuse Limited (Bel Fuse)
• Original Assignee: Bel Fuse Limited (Bel Fuse)
• Inventors: Baum, Andrew David, Marowsky, Richard D., Gutter, David Henry, Belopolsky, Yakov, Allison, Jennifer L., Ellis, Mark
• Primary Examiner(s): Patel, Tulsidas C
• Assistant Examiner(s): Leigh, Peter G
• Application Number:
  US16/262,696
• Publication Number:
  US 20190237920A1
• Time in Patent Office: 342 Days
• Field of Search: 439941, 43962021
• CPC Class Codes: H01R 13/506 assembled by snap action of the parts
• CPC Class Codes: H01R 13/514 composed as a modular blocks or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
• CPC Class Codes: H01R 13/627 Snap or like fastening
• CPC Class Codes: H01R 13/6466 on substrates, e.g. printed circuit boards [PCB]
• CPC Class Codes: H01R 13/6469 on substrates
• CPC Class Codes: H01R 13/6585 Shielding material individually surrounding or interposed between mutually spaced contacts
• CPC Class Codes: H01R 13/6587 for mounting on PCBs
• CPC Class Codes: H01R 13/6599 Dielectric material made conductive, e.g. plastic material coated with metal
• CPC Class Codes: H01R 13/6658 on printed circuit board H01R13/6666 - H01R13/6691 take precedence
• CPC Class Codes: H01R 2107/00 Four or more poles
• CPC Class Codes: H01R 2201/04 for network, e.g. LAN connectors
• CPC Class Codes: H01R 24/64 for high frequency, e.g. RJ 45

Abstract

A modular RJ45-type plug apparatus is provided for forming a connector interface with a connector jack in a high speed data transmission network. A housing comprises an insulative front portion and a conductive shield portion attachable to define an interior, within which is positioned a contact subassembly including a first PCB having cable mounting pads on one end and through holes for elongate plug contacts on the other end. The contacts are connected on one end to the first PCB and on a second end to a second PCB, with bridge portions therebetween collectively defining a jack contact interface. The second PCB comprises desired electrical characteristics which provide the apparatus with certain capacitance compensation properties, wherein the capacitance compensation is offset from a signal path defined between the jack-plug connector interface and the cable pairs.

Claims

1. A modular connector plug apparatus for forming a connector interface with a connector jack in a high speed data transmission network, comprising a housing and a contact subassembly configured for positioning within the interior of said housing and further comprising a first printed circuit hoard (PCB) having a first end and a second end, the second end comprising conductive mounting pads for each of a plurality of cable pairs,

the apparatus further characterized in that:

the housing comprises an insulative front portion and a conductive shield portion attachable to define the interior, and

the contact subassembly comprises

a plurality of elongate plug contacts each comprising a first end mounted on the first end of the first PCB, a second end distal from the first end, and a bridge portion there between, the bridge portions of the plurality of plug contacts collectively defining an interface for corresponding contacts of a connector jack, and

the respective second ends of the plurality of plug contacts mounted on a second PCB,

wherein the second PCB comprises desired electrical characteristics which provide the apparatus with certain capacitance compensation properties, and wherein the capacitance compensation is offset from a signal path defined between the jack-plug connector interface and the cable pairs.

2. The apparatus of claim 1, wherein the first PCB further comprises:

through holes for receiving the respective first ends of the plug contacts; and

an air gap slotted from the second end and extending ire parallel with electrical traces between the through-holes and the mounting pads.

3. The apparatus of claim 2, comprising a substantially planar conductive shield located within the slotted air gap and commoned to one or more ground planes within the first PCB, in an orthogonal orientation with respect to a surface plane of the first PCB.

4. The apparatus of claim 3, wherein first and second pairs of conductive mounting pads are provided on a first surface of the first PCB, and respectively positioned on opposing first and second sides of the planar conductive shield, and

third and fourth pairs of conductive mounting pads are provided on an opposing second surface of the first PCB, and respectively positioned on the opposing first and second sides of the planar conductive shield.

5. The apparatus of claim 4, wherein the bridge portion for each plug contact has a maximum width extending in a direction perpendicular to a PCB length, at least one plug contact having a maximum width greater than the maximum width of another plug contact,

wherein each plug contact defines an electrode of a further compensating capacitance formed between adjacent pairs of plug contacts, each further compensating capacitance defined at, least partially by a distance between the respective adjacent pair of plug contacts at the contact interface.

6. The apparatus of claim 5, wherein the respective bridge portion for each plug contact has a length extending between the first end and the second end, at least one plug contact having a bridge portion length shorter than the bridge portion length of another plug contact.

7. The apparatus of claim 6, wherein the respective first ends for a first plurality of plug contacts and a second plurality of plug contacts are situated in first and second parallel spaced planes.

8. The apparatus of claim 1, wherein the contact subassembly comprises a contact retainer configured to receive the plurality of contacts and composed of an isolative material having characteristic dielectric properties providing a supplemental capacitance compensation between adjacent contact pairs and offset from the signal path.

9. The apparatus of claim 8, wherein the contact retainer comprises first and second opposing side portions with protrusions extending therefrom, and

wherein the front portion of the housing comprises corresponding first and second interior slots configured to slidably receive the first and second opposing side portions via the protrusions.

10. The apparatus of claim 9, wherein the first and second interior slots comprise notches along their respective lengths, and the protrusions are configured to compress during insertion into the front portion of the housing and then extend outward to engage the notches.

11. The apparatus of claim 10, wherein the front portion of the housing comprises a top side having one or more apertures, and the conductive shield portion of the housing comprises a respective one or more latches configured to engage the one or more apertures when the front portion and the conductive shield portion are slidably engaged.

12. The apparatus of claim 11, wherein the conductive shield portion comprises jack grounding tabs extending along first and second opposing outer side walls of the front portion of the housing when the front portion and the conductive shield portion are slidably engaged.

13. The apparatus of claim 12, wherein the first and second jack grounding tabs further respectively comprise shield retention tabs configured to fold over the notches of the first and second interior slots when the front portion and the conductive shield portion are slidably engaged, further to engage the protrusions of the contact retainer as extended outward and retained therein.

14. The apparatus of claim 13, wherein the bridge portion for each plug contact has a maximum width extending in a direction perpendicular to a PCB length, at least one plug contact having a maximum width greater than the maximum of another plug contact,

wherein each plug contact defines an electrode of a further compensating capacitance formed between adjacent pairs of plug contacts, each further compensating capacitance defined at least partially by a distance between the respective adjacent pair of plug contacts at the contact interface.

15. The apparatus of claim 14, wherein the respective bridge portion for each plug contact has a length extending between the first end and the second end, at least, one plug contact having a bridge portion length shorter than the bridge portion length of another plug contact.

16. The apparatus of claim 15, wherein the respective first ends for a first plurality of plug contacts and a second plurality of plug contacts are situated in first and second parallel spaced planes.

17. The apparatus of claim 1, wherein the second PCB comprises a plurality of substrate layers having parallel plates disposed therein, and a value of the capacitance compensation is defined by an area, distance and dielectric constant associated therewith.

18. The apparatus of claim 1, wherein the contact subassembly is configured to withstand 1000 VDC between any two adjacent contacts, and 1500 VDC between any two non-adjacent contacts and/or between any one contact and the conductive shield, without shorting or flash-over.