Enclosure-to-board interface with tamper-detect circuit(s)
First Claim
1. A tamper-respondent assembly comprising:
- a circuit board;
an enclosure mounted to the circuit board along an enclosure-to-board interface, the enclosure facilitating enclosing at least one electronic component coupled to the circuit board within a secure volume;
a tamper-respondent electronic circuit structure facilitating defining the secure volume, the tamper-respondent electronic circuit structure comprising one or more tamper-detect circuits defined, at least in part, by at least one conductive trace disposed, at least in part, within the enclosure-to-board interface, the at least one conductive trace comprising stress rise regions to facilitate detecting a tamper event at the enclosure-to-board interface, wherein the at least one conductive trace comprises a serpentine conductive trace with angle bends disposed, at least in part, within the enclosure-to-board interface, and the angle bends are selected from the group comprising right angle bends and acute angle bends;
multiple conductive vias intersecting the serpentine conductive trace and extending into the circuit board, the multiple conductive vias facilitating defining, at least in part, the stress rise regions of the at least one conductive trace, wherein the multiple conductive vias extend through the circuit board; and
an adhesive securing the enclosure to the circuit board, the adhesive contacting, at least in part, the at least one conductive trace of the one or more tamper-detect circuits within the enclosure-to-board interface, including at the stress rise regions of the at least one conductive trace.
1 Assignment
0 Petitions
Accused Products
Abstract
Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure-to-circuit board protection. The tamper-respondent assemblies include a circuit board, and an enclosure mounted to the circuit board along an enclosure-to-board interface. The enclosure facilitates enclosing at least one electronic component coupled to the circuit board within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and includes one or more tamper-detect circuits including at least one conductive trace disposed, at least in part, within the enclosure-to-board interface. The conductive trace(s) includes stress rise regions to facilitate tamper-detection at the enclosure-to-board interface. An adhesive is provided to secure the enclosure to the circuit board. The adhesive contacts, at least in part, the conductive trace(s) of the tamper-detect circuit(s) at the enclosure-to-board interface, including at the stress rise regions of the conductive trace(s).
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Citations
11 Claims
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1. A tamper-respondent assembly comprising:
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a circuit board; an enclosure mounted to the circuit board along an enclosure-to-board interface, the enclosure facilitating enclosing at least one electronic component coupled to the circuit board within a secure volume; a tamper-respondent electronic circuit structure facilitating defining the secure volume, the tamper-respondent electronic circuit structure comprising one or more tamper-detect circuits defined, at least in part, by at least one conductive trace disposed, at least in part, within the enclosure-to-board interface, the at least one conductive trace comprising stress rise regions to facilitate detecting a tamper event at the enclosure-to-board interface, wherein the at least one conductive trace comprises a serpentine conductive trace with angle bends disposed, at least in part, within the enclosure-to-board interface, and the angle bends are selected from the group comprising right angle bends and acute angle bends; multiple conductive vias intersecting the serpentine conductive trace and extending into the circuit board, the multiple conductive vias facilitating defining, at least in part, the stress rise regions of the at least one conductive trace, wherein the multiple conductive vias extend through the circuit board; and an adhesive securing the enclosure to the circuit board, the adhesive contacting, at least in part, the at least one conductive trace of the one or more tamper-detect circuits within the enclosure-to-board interface, including at the stress rise regions of the at least one conductive trace. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A tamper-respondent assembly comprising:
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a circuit board; at least one electronic component to be protected, the at least one electronic component being associated with the circuit board; an enclosure mounted to the circuit board along an enclosure-to-board interface, the enclosure facilitating enclosing the at least one electronic component within a secure volume; a tamper-respondent electronic circuit structure facilitating defining the secure volume, the tamper-respondent electronic circuit structure comprising one or more tamper-detect circuits comprising at least one conductive trace disposed, at least in part, within the enclosure-to-board interface, the at least one conductive trace comprising stress rise regions to facilitate detecting a tamper event at the enclosure-to-board interface, wherein the at least one conductive trace comprises a serpentine conductive trace with angle bends disposed, at least in part, within the enclosure-to-board interface, and the angle bends are selected from the group comprising right angle bends and acute angle bends; multiple conductive vias intersecting the serpentine conductive trace and extending into the circuit board, the multiple conductive vias facilitating defining, at least in part, the stress rise regions of the at least one conductive trace, wherein the multiple conductive vias extend through the circuit board; and an adhesive securing the enclosure to the circuit board, the adhesive contacting, at least in part, the at least one conductive trace of the one or more tamper-detect circuits within the enclosure-to-board interface, including at the stress rise regions of the at least one conductive trace. - View Dependent Claims (8, 9, 10)
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11. A fabrication method comprising:
fabricating a tamper-respondent assembly, the fabricating comprising; providing a circuit board; providing an enclosure mounted to the circuit board along an enclosure-to-board interface, the enclosure facilitating enclosing at least one electronic component coupled to the circuit board within a secure volume; providing a tamper-respondent electronic circuit structure facilitating defining the secure volume, the tamper-respondent electronic circuit structure comprising one or more tamper-detect circuits comprising at least one conductive trace disposed, at least in part, within the enclosure-to-board interface, the at least one conductive trace comprising stress rise regions to facilitate detecting a tamper event at the enclosure-to-board interface, wherein the at least one conductive trace comprises a serpentine conductive trace with angle bends disposed, at least in part, within the enclosure-to-board interface, and the angle bends are selected from the group comprising right angle bends and acute angle bends; providing multiple conductive vias intersecting the serpentine conductive trace and extending into the circuit board, the multiple conductive vias facilitating defining, at least in part, the stress rise regions of the at least one conductive trace, wherein the multiple conductive vias extend through the circuit board; and securing the enclosure to the circuit board using an adhesive, the adhesive contacting, at least in part, the at least one conductive trace of the one or more tamper-detect circuits within the enclosure-to-board interface, including at the stress rise regions of the at least one conductive trace.
Specification