Methods for CMOS-MEMS integrated devices with multiple sealed cavities maintained at various pressures
First Claim
1. A Microelectromechanical Systems (MEMS) structure comprising:
- a MEMS substrate bonded to a second substrate, forming a plurality of enclosures of at least two types,wherein each of the plurality of enclosures is defined by the MEMS substrate, the second substrate, and a seal-ring between the MEMS substrate and the second substrate,wherein a first enclosure type has a first seal-ring type,wherein a second enclosure type has a second seal-ring type, andwherein the second enclosure type comprises a gap of the seal-ring of the second seal-ring type configured to allow a pressure differential between first enclosure type and the second enclosure type upon sealing the second enclosure type.
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Abstract
A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity in the handle wafer. Four methods are described to create two or more enclosures having multiple gas pressure or compositions on a single substrate including, each enclosure containing a moveable portion. The methods include: A. Forming a secondary sealed enclosure, B. Creating multiple ambient enclosures during wafer bonding, C. Creating and breaching an internal gas reservoir, and D. Forming and subsequently sealing a controlled leak/breach into the enclosure.
24 Citations
19 Claims
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1. A Microelectromechanical Systems (MEMS) structure comprising:
a MEMS substrate bonded to a second substrate, forming a plurality of enclosures of at least two types, wherein each of the plurality of enclosures is defined by the MEMS substrate, the second substrate, and a seal-ring between the MEMS substrate and the second substrate, wherein a first enclosure type has a first seal-ring type, wherein a second enclosure type has a second seal-ring type, and wherein the second enclosure type comprises a gap of the seal-ring of the second seal-ring type configured to allow a pressure differential between first enclosure type and the second enclosure type upon sealing the second enclosure type. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method, comprising:
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forming a Microelectromechanical Systems (MEMS) substrate with cavities; contacting the MEMS substrate with a second substrate, thereby forming a plurality of enclosures of at least two types, wherein each of the plurality of enclosures is defined by the MEMS substrate, the second substrate, and a seal-ring between the MEMS substrate and the second substrate, wherein a first enclosure type has a first seal-ring type, wherein a second enclosure type has a second seal-ring type, wherein the second enclosure type comprises a gap of the seal ring of the second seal-ring type configured to allow a pressure differential between first enclosure type and the second enclosure type upon sealing the second enclosure type; and bonding the MEMS substrate with the second substrate. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification