Plating apparatus, substrate holder, plating apparatus controlling method, and storage medium configured to store program for instructing computer to implement plating apparatus controlling method

• US 10,533,262 B2
• Filed: 02/22/2019
• Issued: 01/14/2020
• Est. Priority Date: 06/03/2016
• Status: Active Grant

• Current Assignee: Ebara Corporation
• Original Assignee: Ebara Corporation
• Inventors: Fujikata, Jumpei
• Primary Examiner(s): Smith, Nicholas A
• Application Number:
  US16/283,611
• Publication Number:
  US 20190186039A1
• Time in Patent Office: 326 Days
• CPC Class Codes: C25D 17/001 Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
• CPC Class Codes: C25D 17/004 Sealing devices
• CPC Class Codes: C25D 17/06 Suspending or supporting devices for articles to be coated
• CPC Class Codes: C25D 21/12 Process control or regulation controlling or regulating in general G05
• CPC Class Codes: C25D 7/123 Semiconductors first coated with a seed layer or a conductive layer
• CPC Class Codes: H01L 21/2885 using an external electrical current, i.e. electro-deposition
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 21/68785 characterised by the mechanical construction of the susceptor, stage or support
• CPC Class Codes: H01L 21/76879 by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating plating on semiconductors in general H01L21/288
• CPC Class Codes: H01L 2224/11462 Electroplating
• CPC Class Codes: H01L 2224/117 involving monitoring, e.g. feedback loop
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/742 Apparatus for manufacturing bump connectors

Abstract

Provided is a plating apparatus for plating a substrate by using a substrate holder including an elastic projection that seals a to-be-plated surface of the substrate, the plating apparatus comprising a measurement device configured to measure a deformed state of the elastic projection by measuring at least either one of a compression amount of the elastic projection and load applied to the elastic projection at a time when the substrate physically contacts the elastic projection of the substrate holder; and a controlling device configured to make a judgment on the basis of the measured deformed state as to whether sealing by the elastic projection is normal.

Claims

1. A substrate holder comprising:

a first holding member including a support face with which a substrate comes into contact;

a second holding member configured to clamp an outer circumferential portion of the substrate to detachably hold the substrate in consort with the first holding member;

an elastic projection configured to seal a gap between the second holding member and the outer circumferential portion of the substrate when the substrate is clamped between the first and second holding members; and

at least one pressure sensor that is disposed or embedded in the support face of the first holding member and configured to detect a pressing force at which the substrate is pressed by the second holding member and the elastic projection.

2. The substrate holder according to claim 1, wherein

the at least one pressure sensor comprises a plurality of pressure sensors that are arranged at regular intervals in the support face.

3. The substrate holder according to claim 1, wherein

the first holding member includes a backing base and a movable base that is disposed to be movable relative to the backing base, and the support face is provided to the movable base.