System and method for encoding IC chips for payment objects

• US 10,535,046 B2
• Filed: 02/23/2017
• Issued: 01/14/2020
• Est. Priority Date: 02/24/2016
• Status: Active Grant

• Current Assignee: CPI Card Group - Colorado Incorporated (CPI Card Group), CPI Card Group - Minnesota Incorporated (CPI Card Group), CPI Card Group - Tennessee, Inc.
• Original Assignee: CPI Card Group - Colorado Incorporated (CPI Card Group)
• Inventors: Mosteller, Barry
• Primary Examiner(s): Reames, Matthew L
• Application Number:
  US15/780,176
• Publication Number:
  US 20180357622A1
• Time in Patent Office: 1,055 Days
• CPC Class Codes: B42D 25/485 by electronic processing means
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06Q 20/105 involving programming of a portable memory device, e.g. IC cards, "electronic purses"
• CPC Class Codes: G06Q 20/341 Active cards, i.e. cards including their own processing means, e.g. including an IC or chip
• CPC Class Codes: G06Q 20/355 Personalisation of cards for use
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support

Abstract

A system and method are disclosed for providing integrated circuit (IC) chip modules for inclusion in payment objects. IC chip modules may be received from a supplier of IC chip modules, wherein the IC chip modules are supportably interconnected to a flexible substrate and transport key data is encoded in the IC chip modules. Each IC chip module may be encoded with personalization data and issuer key data. Encoding of IC chip modules may be completed utilizing either a contact IC chip interface device or a non-contact IC chip interface device. Encoding the IC chip modules may be completed with the IC chip modules supportably interconnected to the flexible substrate as supplied by the supplier of the IC chip modules, free from fixed interconnection of the IC chip modules and carrier to another support structure.

Claims

1. A method for providing integrated circuit (IC) chip modules for use in payment objects, comprising:

receiving an integrated circuit (IC) chip module, wherein said IC chip module is one of a plurality of IC chip modules supportably interconnected to a flexible tape, and wherein each of the plurality of IC chip modules comprise an IC chip and interconnected antenna that are fixedly interconnected to a flexible carrier defined by different portions of said flexible tape;

powering the IC chip module;

encoding the following data in the IC chip comprising the IC chip module after the powering;

personalization data provided by an issuer payment institution corresponding with a specific account administered by the issuer payment institution; and

,

issuer key data provided by the issuer payment institution; and

,

terminating the powering after the encoding, wherein the IC chip module is automatically locked to restrict access to at least the issuer key data; and

,

packaging the IC chip module as one of and together with the plurality of IC chip modules, after the terminating, for provision to a third-party payment object provider;

wherein said receiving, powering, encoding and terminating are completed with said IC chip module supportably interconnected to the flexible tape, free from fixed interconnection of said IC chip module and said flexible tape to any card body or other support structure.

2. A method as recited in claim 1, wherein said receiving comprises:

positioning the IC chip module at a first position.

3. A method as recited in claim 2, wherein said powering comprises:

utilizing one of a contact IC chip interface device and a non-contact IC chip interface device to interface with the IC chip module located at the first position.

4. A method as recited in claim 3, wherein said encoding comprises:

utilizing said one of a contact IC chip interface device and non-contact IC chip interface device to interface with the IC chip module located at said first position.

5. A method as recited in claim 4, wherein transport key data is encoded in the received IC chip module, and further comprising:

utilizing a transport key identifier to obtain the transport key data from a secure server;

unlocking the IC chip module by presenting the transport key data to the IC chip module, wherein said issuer key data is encoded by overwriting the transport key data.

6. A method as recited in claim 5, wherein said unlocking comprises:

utilizing said one of a contact IC chip interface device and a non-contact IC chip interface device to interface with the IC chip module located at said first position.

7. A method as recited in claim 4, further comprising:

employing an issuer key identifier to obtain the issuer key data from said secure server.

8. A method as recited in claim 4, wherein the encoding comprises:

writing said personalization data and said issuer key data in to different predetermined memory portions of the IC chip comprising the IC chip module.

9. A method as recited in claim 4, further comprising:

completing one of the following after the powering and before the terminating;

reading unique chip identification data assigned to and stored in a memory portion of the IC chip comprising the IC chip module;

or,

writing unique chip identification data assigned to and stored in a memory portion of the IC chip comprising the IC chip module.

10. A method as recited in claim 9, wherein said completing comprises:

utilizing said one of a contact IC chip interface device and a non-contact IC chip interface device to interface with the IC chip module located at said first position.

11. A method as recited in claim 9, wherein said positioning comprises:

first advancing said flexible tape to position the IC chip module at said first position.

12. A method as recited in claim 11, wherein said receiving, powering, encoding completing, and terminating are completed in an automated manner.

13. A method as recited in claim 12, wherein said powering, unlocking, encoding, completing, and terminating are completed with said IC chip module positioned at said first position.

14. A method as recited in claim 11, further comprising:

second advancing said flexible tape to position the IC chip module at a second position for the packaging.

15. A method as recited in claim 14, wherein said packaging comprises:

separating the IC chip module from said flexible tape at said second position; and

,

locating the IC chip module, after the separating, in a receptacle for provision to the third-party payment object provider.

16. A method as recited in claim 14, wherein said receiving, powering, encoding, completing, terminating, second advancing, and packaging are completed in an automated manner.

17. A method as recited in claim 16, further comprising:

repeating said receiving, powering, encoding, completing, terminating, second advancing and packaging for each of said plurality of IC chip modules for provision to the third-party payment object provider in relation to fulfillment of a given order, wherein the personalization data and issuer data for each of the plurality of IC chip modules is provided by the same issuer payment institution.

18. A method as recited in claim 17, further comprising:

providing an issuer data return file to said issuer payment institution in relation the given order comprising said plurality of IC chip modules, wherein the issuer data return file comprises;

order identification data corresponding with the given order; and

,

unique account identification data corresponding with each different one of a plurality of different payment accounts in relation to which corresponding account-specific personalization data, provided by the issuer payment institution, has been encoded in different ones of the IC chips of the corresponding plurality of IC chip modules utilized to fulfill the given order; and

the unique chip identification data for the IC chip included in each different one of the plurality of IC chip modules utilized to fulfill the given order;

wherein the unique account identification data and unique chip identification data provided in relation to each different one of the plurality of IC chip modules utilized to fulfill the given order are provided in the issuer data return file in associative relation.

19. A method as recited in claim 17, wherein said flexible tape is wound on a reel, and wherein said first and second advancing comprise:

rotating in an automated manner, a rotatable member engaged with at least one edge portion of said flexible tape in spaced relation to said plurality of IC chip modules, wherein said rotating progressively unwinds said flexible tape from said reel.

20. A method as recited in claim 19, wherein when said plurality of IC chip modules are dual interface type IC chip modules, and wherein said rotating comprises:

positioning teeth of said rotatable member into and out of apertures extending along said at least one edge portion of said flexible tape as said first rotatable member is rotated in an automated matter.

21. A method as recited in claim 19, wherein when said plurality of IC chip modules are contactless type IC chip modules, and wherein said rotating comprises:

engaging said at least one edge portion of said flexible tape between a roller surface of said rotatable member and a roller surface of an opposing roller.