Method for depositing a semiconductor structure on a surface of a substrate and related semiconductor structures
First Claim
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1. A method for depositing a semiconductor structure on a surface of a substrate, the method comprising:
- depositing a first group IVA semiconductor layer, comprising silicon germanium (Si1-xGex), over a surface of the substrate;
contacting an exposed surface of the first group IVA semiconductor layer with a first gas comprising a first chloride gas;
depositing a second group IVA semiconductor layer, comprising silicon, over a surface of the first group IVA semiconductor layer; and
forming an interface region between the first group IVA semiconductor layer and the second group IVA semiconductor layer, wherein the interface region comprises a graded composition between having silicon germanium (Si1-xGex) wherein x equals 0.3 proximate the first group IVA semiconductor layer and having silicon germanium (Si1-xGex) wherein x equals 0 proximate the second group IVA semiconductor layer.
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Abstract
A method for depositing a semiconductor structure on a surface of a substrate is disclosed. The method may include: depositing a first group IVA semiconductor layer over a surface of the substrate; contacting an exposed surface of the first group IVA semiconductor layer with a first gas comprising a first chloride gas; and depositing a second group IVA semiconductor layer over a surface of the first group IVA semiconductor layer. Related semiconductor structures are also disclosed.
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20 Claims
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1. A method for depositing a semiconductor structure on a surface of a substrate, the method comprising:
- depositing a first group IVA semiconductor layer, comprising silicon germanium (Si1-xGex), over a surface of the substrate;
contacting an exposed surface of the first group IVA semiconductor layer with a first gas comprising a first chloride gas;
depositing a second group IVA semiconductor layer, comprising silicon, over a surface of the first group IVA semiconductor layer; and
forming an interface region between the first group IVA semiconductor layer and the second group IVA semiconductor layer, wherein the interface region comprises a graded composition between having silicon germanium (Si1-xGex) wherein x equals 0.3 proximate the first group IVA semiconductor layer and having silicon germanium (Si1-xGex) wherein x equals 0 proximate the second group IVA semiconductor layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
- depositing a first group IVA semiconductor layer, comprising silicon germanium (Si1-xGex), over a surface of the substrate;
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18. A semiconductor structure comprising:
a silicon substrate;
a first silicon germanium (Si1-xGex) layer disposed over a surface of the silicon substrate;
a first silicon layer disposed over the first silicon germanium (Si1-xGex) layer; and
a first interface region disposed directly between the first silicon germanium (Si1-xGex) layer and the first silicon layer, wherein the interface region comprises a graded composition between having silicon germanium (Si1-xGex) wherein x equals 0.3 proximate the first silicon germanium (Si1-xGex) layer and having silicon germanium (Si1-xGex) wherein x equals 0 proximate the first silicon layer.- View Dependent Claims (19, 20)
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