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Method for depositing a semiconductor structure on a surface of a substrate and related semiconductor structures

  • US 10,535,516 B2
  • Filed: 02/01/2018
  • Issued: 01/14/2020
  • Est. Priority Date: 02/01/2018
  • Status: Active Grant
First Claim
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1. A method for depositing a semiconductor structure on a surface of a substrate, the method comprising:

  • depositing a first group IVA semiconductor layer, comprising silicon germanium (Si1-xGex), over a surface of the substrate;

    contacting an exposed surface of the first group IVA semiconductor layer with a first gas comprising a first chloride gas;

    depositing a second group IVA semiconductor layer, comprising silicon, over a surface of the first group IVA semiconductor layer; and

    forming an interface region between the first group IVA semiconductor layer and the second group IVA semiconductor layer, wherein the interface region comprises a graded composition between having silicon germanium (Si1-xGex) wherein x equals 0.3 proximate the first group IVA semiconductor layer and having silicon germanium (Si1-xGex) wherein x equals 0 proximate the second group IVA semiconductor layer.

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