×

Power semiconductor device and package

  • US 10,535,579 B2
  • Filed: 03/11/2019
  • Issued: 01/14/2020
  • Est. Priority Date: 04/06/2018
  • Status: Active Grant
First Claim
Patent Images

1. A power semiconductor device and package, comprising:

  • a plurality of electrically parallel semiconductor device legs configured to share a line-in and line-out source regions and share a drain region between two devices in each leg, wherein each leg is laterally staggered from each other leg to distribute thermal conductivity across the shared source regions;

    a plurality of jigsaw patterned lateral isolation trenches in a substrate of the device, the trenches configured to isolate the laterally staggered line-in and line-out source regions from a common drain region of the plurality of semiconductor device legs; and

    a current spreader for each of the line-in and the line-out source regions, each current spreader configured to extend a length of the line-in and the line-out source regions and to increase a current conduction area there through.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×