Bulk annealing of glass sheets

• US 10,538,452 B2
• Filed: 04/08/2016
• Issued: 01/21/2020
• Est. Priority Date: 12/13/2012
• Status: Active Grant

• Current Assignee: Corning Incorporated
• Original Assignee: Corning Incorporated
• Inventors: Bellman, Robert Alan, Bookbinder, Dana Craig, Chang, Theresa, Domey, Jeffrey John, Manley, Robert George, Mazumder, Prantik, Stephens, II, Alan Thomas
• Primary Examiner(s): Dodds, Scott W
• Application Number:
  US15/094,477
• Publication Number:
  US 20160221860A1
• Time in Patent Office: 1,383 Days
• Field of Search: 156 99-107
• CPC Class Codes: B05D 1/60 Deposition of organic layers from vapour phase vapour phase deposition in general C23C14/00, C23C16/00
• CPC Class Codes: B32B 17/06 comprising glass as the main or only constituent of a layer, next to another layer of a specific material
• CPC Class Codes: B32B 7/06 permitting easy separation
• CPC Class Codes: C03B 25/025 Glass sheets
• CPC Class Codes: C03B 35/14 Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands
• CPC Class Codes: C03B 40/005 Fabrics, felts or loose covers
• CPC Class Codes: C03C 1/00 Ingredients generally applicable to manufacture of glasses, glazes, or vitreous enamels
• CPC Class Codes: C03C 17/328 Polyolefins
• CPC Class Codes: G02F 1/133302 Rigid substrates, e.g. inorganic substrates

Abstract

Surface modification layers and associated heat treatments, that may be provided on a sheet, a carrier, or both, to control both room-temperature van der Waals (and/or hydrogen) bonding and high temperature covalent bonding between the thin sheet and carrier. The room-temperature bonding is controlled so as to be sufficient to hold the thin sheet and carrier together during vacuum processing, wet processing, and/or ultrasonic cleaning processing, for example. And at the same time, the high temperature covalent bonding is controlled so as to prevent a permanent bond between the thin sheet and carrier during high temperature processing, as well as maintain a sufficient bond to prevent delamination during high temperature processing.

Claims

1. A method of annealing glass, comprising:

providing a ribbon of glass, the ribbon of glass having two major surfaces;

forming a surface modification layer on at least one surface of the ribbon of glass, wherein the surface modification layer is one of HDMA, a plasma polymerized fluoropolymer, or an aromatic silane;

rolling the ribbon of glass into a roll such that the ribbon of glass defines a plurality of glass layers so that interfaces are defined between adjacent ones of the glass layers in the plurality of glass layers;

exposing the glass layers to a time-temperature cycle sufficient to compact each of the glass layers,

wherein the surface modification layer is sufficient to control, throughout the time-temperature cycle, annealing between the adjacent ones of the glass layers in the stack defining the one of the interfaces such that the layers may be separated without breaking one of the adjacent ones of the glass layers into two or more pieces.

2. The method of claim 1, wherein the time-temperature cycle includes a temperature ≥

400°

C., but less than the strain point of the glass.

3. The method of claim 1, wherein the time-temperature cycle includes a temperature ≥

600°

C., but less than the strain point of the glass.

4. The method of claim 1, wherein when the surface modification layer comprises a plasma polymerized fluoropolymer, the surface modification layer is one of:

plasma polymerized polytetrafluroethylene; and

a plasma polymerized fluoropolymer surface modification layer deposited from a CF4-C4F8 mixture having ≥

40% C4F8.

5. The method of claim 1, wherein when the surface modification layer comprises an aromatic silane, the surface modification layer is a phenyl silane.

6. The method of claim 1, wherein when the surface modification layer comprises an aromatic silane, the surface modification layer is one of:

phenyltriethoxysilane;

diphenyldiethoxysilane; and

4-pentafluorophenyltriethoxysilane.

7. The method of claim 1, wherein the time-temperature cycle is carried out in an oxygen-free environment.

8. The method of claim 1, wherein the at least one of the major surfaces having the surface modification layer thereon has a surface energy of ≥

40 mJ/m².

9. The method of claim 1, wherein adhesion energy between the major surfaces of the layers facing the one of the interfaces is greater than about 24 mJ/m².

10. The method of claim 1, wherein adhesion energy between the major surfaces of the layers facing the one of the interfaces is from 50 to 1000 mJ/m².