QFN pre-molded leadframe having a solder wettable sidewall on each lead

• US 10,541,196 B2
• Filed: 08/21/2018
• Issued: 01/21/2020
• Est. Priority Date: 05/31/2017
• Status: Active Grant

• Current Assignee: STMicroelectronics International N.V. (STMicroelectronics NV)
• Original Assignee: STMicroelectronics Incorporated (STMicroelectronics NV)
• Inventors: Cadag, Aaron, Antilano, Jr., Ernesto, Cadag, Ela Mia
• Primary Examiner(s): Clark, Jasmine J
• Application Number:
  US16/107,807
• Publication Number:
  US 20180358286A1
• Time in Patent Office: 518 Days
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/3192 Multilayer coating
• CPC Class Codes: H01L 23/49503 characterised by the die pad
• CPC Class Codes: H01L 23/4952 the additional leads being a bump or a wire
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 23/49548 Cross section geometry H01L23/49562 takes precedence
• CPC Class Codes: H01L 23/49582 Metallic layers on lead frames
• CPC Class Codes: H01L 23/49861 Lead-frames fixed on or encapsulated in insulating substrates H01L23/4985, H01L23/49805 take precedence
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

The present disclosure is directed to a leadframe package having solder wettable sidewalls that is formed using a pre-molded leadframe and methods of manufacturing the same. A metal plated leadframe with a plurality of recesses and a plurality of apertures is placed into a top and bottom mold tool. A molding compound is then formed in the plurality of recesses and apertures in the leadframe to form a pre-molded leadframe. A plurality of die and wires are coupled to the pre-molded leadframe and the resulting combination is covered in an encapsulant. Alternatively, a bare leadframe can be processed and the metal layer can be applied after encapsulation. A saw or other cutting means is used for singulation to form leadframe packages. Each resulting leadframe package has a solder wettable sidewall for improving the strength of solder joints between the package and a circuit board.

Claims

1. A method comprising:

placing a leadframe on a bottom mold tool, the leadframe having a first plurality of recesses and a plurality of apertures, each of the first plurality of recesses having a size and a shape configured to receive one of the plurality of ridges, the leadframe also having a plurality of die pads and a plurality of leads;

placing a top mold tool on the leadframe, the top mold tool having a second plurality of recesses;

forming a first plurality of molding compound portions in the plurality of apertures and forming a second plurality of molding compound portions in the second plurality of recesses in a single molding step to form a pre-molded leadframe;

releasing the top mold tool and the bottom mold tool, the releasing including removing the pre-molded leadframe from the top mold tool and the bottom mold tool;

coupling a plurality of dies to each respective die pad of the pre-molded leadframe;

coupling the plurality of dies to the plurality of leads through a plurality of wires;

encapsulating the plurality of dies, the plurality of wires, and the second plurality of molding compound portions with an encapsulant; and

cutting the encapsulant, the leadframe and a metal layer to form a plurality of leadframe packages, each leadframe package having a first sidewall and a second sidewall with a portion of each sidewall covered by the metal layer.

2. The method of claim 1 wherein positioning the mold release film includes the mold release film comprised of a non-adhesive material.

3. The method of claim 1 wherein forming the second plurality of molding compound portions further comprises forming the second plurality of molding compound portions at a location adjacent to the first plurality of recesses.

4. The method of claim 1 wherein forming the first plurality of recesses further comprises removing a remaining portion of the leadframe opposite the first plurality of recesses to form a plurality of leads.

5. The method of claim 4 further comprising:

forming a plurality of leadframe packages with the pre-molded leadframe, each of the plurality of leadframe packages having a first lead portion of the first sidewall and a second lead portion of the second sidewall; and

forming the metal layer on the first lead portion of the first sidewall and the second lead portion of the second sidewall.

6. The method of claim 5 wherein forming the metal layer on the first lead portion and the second lead portion further comprises the metal layer substantially covering the first lead portion of the first sidewall and the second lead portion of the second sidewall.

7. The method of claim 1 further comprising forming the metal layer on an exposed surface of the leadframe and on the first plurality of recesses in the leadframe is carried out prior to the step of placing the leadframe on the bottom mold tool.

8. The method of claim 1 further comprising forming a metal layer on an exposed surface of the leadframe and on the first plurality of recesses in the leadframe is carried out after the step of removing the pre-molded leadframe from the top mold tool and prior to the step of and the bottom mold tool placing the leadframe on the bottom mold tool and prior to the step of coupling a plurality of dies to each respective die pad of the pre-molded leadframe.

9. The method of claim 1 wherein cutting the encapsulant, the leadframe and the metal layer includes the first sidewall and the second sidewall each having a lead portion.

10. The method of claim 1 wherein cutting the encapsulant, the leadframe and the metal layer further comprises forming a flange, the flange including the lead portion and extending from the first plurality of recesses.

11. The method of claim 1 wherein forming the metal layer further comprises forming a layer that includes tin on the leadframe.

12. The method of claim 1 wherein forming the metal layer further comprises forming a layer that includes at least two different layers, one on top of each other and the layers include at least two selected from the group of nickel, palladium, and gold.

13. The method according to claim 1, further including:

forming the metal layer on an exposed surface of the leadframe and on the first plurality of recesses in the leadframe.

14. The method according to claim 13 wherein forming the metal layer on an exposed surface of the leadframe and on the first plurality of recesses in the leadframe occurs after encapsulating the plurality of dies, the plurality of wires, and the second plurality of molding compound portions with an encapsulant and before cutting the encapsulant, the leadframe and the metal layer to form a plurality of leadframe packages, each leadframe package having a first sidewall and a second sidewall with a portion of each sidewall covered by the metal layer.

15. The method according to claim 1, further including:

positioning a mold release film on a first surface of a bottom mold tool, the mold tool having a plurality of ridges prior to placing a leadframe on the bottom mold tool.

16. The method of claim 15 wherein positioning a mold release film on a first surface of a bottom mold tool prior to placing the leadframe on the bottom mold tool, the mold tool having a plurality of ridges, the leadframe having a first plurality of recesses and a plurality of apertures, each of the first plurality of recesses having a size and a shape configured to receive one of the plurality of ridges, the leadframe also having a plurality of die pads and a plurality of leads.

17. A method of molding a semiconductor die comprising:

placing a leadframe in a mold;

injecting molding compound into the mold in a top region of the leadframe to adhere to a top of the leadframe;

injecting molding compound into the mold in a plurality of apertures of the leadframe to adhere to a bottom region of the leadframe;

releasing the leadframe and the molding compound from the mold;

coupling a plurality of dies to each respective die pad of the leadframe;

coupling the plurality of dies to the leadframe through a plurality of wires;

encapsulating the plurality of dies, the plurality of wires, and the second plurality of molding compound portions with an encapsulant; and

cutting the encapsulant, the leadframe and the molding compound to form a plurality of leadframe packages.

18. The method of claim 17 further including:

forming a first metal layer on the leadframe prior to placing the leadframe in the mold.

19. The method of claim 17 further including:

forming a second metal layer on the leadframe after removing it from the mold and after coupling a plurality of die to the leadframe and prior to encapsulating the plurality of die, the plurality of wires, and the second plurality of molding compound portions with an encapsulant.