Light emitting diode having a current blocking layer

• US 10,541,351 B2
• Filed: 01/06/2017
• Issued: 01/21/2020
• Est. Priority Date: 01/07/2016
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Song, Hyun Don
• Primary Examiner(s): Pham, Hoai V
• Application Number:
  US16/068,557
• Publication Number:
  US 20190027647A1
• Time in Patent Office: 1,110 Days
• CPC Class Codes: H01L 2224/14 of a plurality of bump connectors
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/0033 having Schottky barriers
• CPC Class Codes: H01L 33/145 with a current-blocking structure
• CPC Class Codes: H01L 33/32 containing nitrogen
• CPC Class Codes: H01L 33/36 characterised by the electrodes
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 characterized by the materials
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A light emitting device according to embodiments includes a substrate, a light emitting structure disposed under the substrate and including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, a submount disposed to face the substrate, first and second metal pads disposed on the submount to be spaced apart from each other, a first bump disposed on the first metal pad, a plurality of second bumps disposed on the second metal pad to be spaced apart from each other, a first ohmic layer interposed between the first conductive semiconductor layer and the first bump, a second ohmic layer interposed between the second conductive semiconductor layer and the plurality of second bumps, a first spreading layer interposed between the first ohmic layer and the first bump, a second spreading layer interposed between the second ohmic layer and the plurality of second bumps, and a current blocking layer disposed in a maximum heating area of the second ohmic layer overlapping an area between the plurality of second bumps in a thickness direction of the light emitting structure such that the current blocking layer does not cut the second ohmic layer in a horizontal direction intersecting the thickness direction.

Claims

1. A light emitting device comprising:

a substrate;

a light emitting structure disposed on the substrate and including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer;

a first ohmic layer disposed on the first conductive semiconductor layer;

a second ohmic layer disposed on the second conductive semiconductor layer;

a first bump disposed on the first ohmic layer;

a plurality of second bumps disposed on the second ohmic layer to be spaced apart from each other; and

a current blocking layer interposed between the second ohmic layer and the second conductive semiconductor layer,

wherein the second ohmic layer includes a first region interposed between the plurality of second bumps,

the current blocking layer is disposed on the first region to overlap the second ohmic layer in a horizontal direction and has a width smaller than that of the second ohmic layer, and

the horizontal direction intersects a thickness direction of the light emitting structure.

2. The semiconductor device of claim 1, wherein:

the first region overlaps an area interposed between the plurality of second bumps in the thickness direction of the light emitting structure; and

the second ohmic layer further includes

a second region adjacent to the first region in the horizontal direction intersecting the thickness direction of the light emitting structure.

3. The light emitting device of claim 2, wherein the current blocking layer is disposed to extend from the first region to the second region.

4. The light emitting device of claim 2, wherein the current blocking layer includes a first segment disposed in the first region.

5. The light emitting device of claim 4, wherein the current blocking layer further includes a second segment extending from the first segment to the second region and overlapping the plurality of second bumps in the thickness direction of the light emitting structure.

6. The light emitting device of claim 1, wherein

a width of the first segment ranges from 10 μ

m to 90 μ

m; and

a width of the second segment ranges from 5 μ

m to 25 μ

m.

7. The light emitting device of claim 1, wherein the current blocking layer includes air or a material in Schottky contact with the second conductive semiconductor layer.

8. The light emitting device of claim 1, wherein the current blocking layer includes an insulating material.

9. The light emitting device of claim 1, wherein the active layer emits light in a deep ultraviolet wavelength band.

10. The light emitting device of claim 1, wherein the current blocking layer includes a plurality of current blocking layers which have portions overlapping the plurality of second bumps in the thickness direction of the light emitting structure and are disposed in the horizontal direction.

11. The light emitting device of claim 10, wherein the plurality of current blocking layers are disposed to be spaced apart from each other.

12. The light emitting device of claim 1, further comprising:

a submount disposed to face the substrate;

first and second metal pads disposed on the submount to be spaced apart from each other;

a first spreading layer interposed between the first ohmic layer and the first bump; and

a second spreading layer interposed between the second ohmic layer and the plurality of second bumps.

13. The semiconductor device of claim 12, wherein the current blocking layer includes:

a first surface in contact with the second conductive semiconductor layer; and

a second surface facing the second spreading layer in the thickness direction of the light emitting structure and disposed to be opposite the first surface.

14. The light emitting device of claim 13, wherein:

the second ohmic layer includes a light-transmitting conductive material; and

a shortest distance from the second surface of the current blocking layer to the second spreading layer ranges from 1 nm to 10 nm.

15. The light emitting device of claim 13, wherein:

the second ohmic layer includes a metal material; and

a shortest distance from the second surface of the current blocking layer to the second spreading layer is 200 nm or more.

16. A light emitting device comprising:

a substrate;

a light emitting structure disposed on the substrate and including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer;

an electrode layer disposed on the light emitting structure;

a plurality of bumps disposed on the electrode layer; and

a current blocking layer which is disposed in a region between the plurality of bumps to overlap the electrode layer in a horizontal direction and has a width smaller than that of the electrode layer.

17. The light emitting device of claim 16, wherein:

the electrode layer includes

an ohmic layer interposed between the light emitting structure and the plurality of bumps; and

a spreading layer interposed between the ohmic layer and the plurality of bumps,

wherein the current blocking layer is disposed in the ohmic layer.

18. The light emitting device of claim 17, wherein the light emitting structure includes:

a first conductive semiconductor layer disposed under the substrate;

an active layer disposed under the first conductive semiconductor layer; and

a second conductive semiconductor layer disposed under the active layer.

19. The light emitting device of claim 18, wherein:

the ohmic layer includes first and second ohmic layers;

the spreading layer includes first and second spreading layers;

the plurality of metal pads include first and second metal pads;

the plurality of bumps include a first bump interposed between the first spreading layer and the first metal pad, and a plurality of second bumps interposed between the second spreading layer and the second metal pad; and

the current blocking layer horizontally extends to a region overlapping the plurality of second bumps in a thickness direction of the light emitting structure.