Microperturbation assembly system and method

• US 10,543,486 B2
• Filed: 10/02/2017
• Issued: 01/28/2020
• Est. Priority Date: 10/31/2014
• Status: Active Grant

• Current Assignee: Elux Inc.
• Original Assignee: Elux Inc.
• Inventors: Sasaki, Kenji, Yu, Shu-han, Schuele, Paul J.
• Primary Examiner(s): Vetere, Robert A
• Application Number:
  US15/722,037
• Publication Number:
  US 20180029038A1
• Time in Patent Office: 848 Days
• CPC Class Codes: B01L 3/5027 by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip B01L3/5023 takes precedence; micromixers B01F33/30; microreactors for synthesis B01J19/0093; microcapillary devices in general B81B1/00
• CPC Class Codes: B01L 3/502715 characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces
• CPC Class Codes: B01L 3/50273 characterised by the means or forces applied to move the fluids micropumps F04B19/006, of the membrane type F04B43/043
• CPC Class Codes: B01L 3/502784 specially adapted for droplet or plug flow, e.g. digital microfluidics automatic analysis using a stream of discrete samples in a tube system G01N35/08
• CPC Class Codes: G09G 3/006 Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays testing individual LED's G01R31/2635; testing lamps G01R31/44; testing of optical features of LCD displays G02F1/1309
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95101 in a liquid medium
• CPC Class Codes: H01L 2224/95123 by applying a pressurised fluid flow, e.g. liquid or gas flow
• CPC Class Codes: H01L 2224/95133 by applying an electromagnetic field
• CPC Class Codes: H01L 2224/95136 involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 24/00 Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 33/005 : Processes
• CPC Class Codes: H01L 33/0095 : Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H10K 59/12 : Active-matrix OLED [AMOLED] displays

Abstract

Microperturbation fluidic assembly systems and methods are provided for the fabrication of emissive panels. The method provides an emissive substrate with a top surface patterned to form an array of wells. A liquid suspension is formed over the emissive substrate top surface, comprising a first liquid and emissive elements. Using an array of micropores, a perturbation medium, which optionally includes emissive elements, is injected into the liquid suspension. The perturbation medium may be the first liquid, a second liquid, or a gas. A laminar flow is created in the liquid suspension along the top surface of the emissive substrate in response to the perturbation medium, and emissive elements are captured in the wells. The ejection of the perturbation medium can also be used to control the thickness of the liquid suspension overlying the top surface of the emissive substrate.

Claims

1. An emissive panel microperturbation fluidic assembly system, the system comprising:

a substrate chuck for engaging an emissive substrate, the emissive substrate having a top surface patterned to form an array of wells;

a liquid suspension, comprising a first liquid and emissive elements, overlying the emissive substrate top surface;

a perturbation medium;

a reservoir containing the perturbation medium, having an outlet port; and

,

a distribution module having an input connected to the reservoir outlet port and an array of micropores capable of ejecting the perturbation medium into the liquid suspension and creating a laminar flow in the liquid suspension along the top surface of the emissive substrate for the purpose of capturing the emissive elements in the wells; and

,

a translation module capable of moving the array of micropores in a predetermined pattern with respect to the emissive substrate top surface, synchronously with the ejection of the perturbation medium.

2. The system of claim 1 wherein the perturbation medium is selected from the group consisting of the first liquid, a second liquid, and a gas.

3. The system of claim 1 wherein the distribution module is selected from the group consisting of an array of micro-tubes with micropore orifices and a solid manifold with an array of microholes.

4. The system of claim 1 wherein the micropores eject a perturbation medium in response to a force selected from the group consisting of gravity and a positive pressure.

5. The system of claim 1 wherein the array of micropores regulates the thickness of the liquid suspension overlying the emissive substrate top surface in response to the ejection of a perturbation medium.

6. The system of claim 1 wherein the array of micropores is located in a position selected from the group consisting of a predetermined distance over a top surface of the liquid suspension and submerged in the liquid suspension.

7. The system of claim 1 wherein the liquid suspension first liquid has a first temperature;

and,

wherein perturbation medium is a liquid medium having a second temperature, greater than the first temperature, for the purpose of decreasing viscosity and drying the first liquid.

8. The system of claim 1 further comprising:

a pressure module having a pressurized output; and

wherein the array of micropores is submerged in the liquid suspension, and is capable of alternating the application of a positive pressure with a negative pressure into the liquid suspension in response to the pressurized output and creating an oscillating laminar flow in the liquid suspension in response to a periodic cycle of perturbation medium ejection followed by liquid suspension intake.

9. The system of claim 1 further comprising:

a pressure module having a pulsed pressurized output; and

wherein the array of micropores is capable of periodically ejecting the perturbation medium, in response to the pressurized output, and creating a pulsed ejection of perturbation medium in response to the pulsed pressure having a frequency in a range of 0.5 to 100 Hertz.

10. The system of claim 1 wherein the laminar flow is created in response to characteristics selected from the group consisting of pitch between micropores, micropore diameters, array material, perturbation medium ejection rate, perturbation medium ejection pressure, first fluid viscosity, first fluid density, liquid perturbation medium viscosity, liquid perturbation medium density, and combinations thereof.

11. The system of claim 1 wherein the perturbation medium additionally comprises emissive elements.

12. The system of claim 1 further comprising:

an emissive element detrapping nozzle capable of ejecting perturbation medium to dislodge misaligned and damaged emissive elements from the wells.

13. The system of claim 1 wherein the distribution module comprises an interleaved array of micropores including a first group of micropores capable of ejecting the perturbation medium and a second group of micropores, submerged in the liquid suspension, capable of aspirating the liquid suspension.

14. The system of claim 1 wherein the distribution module comprises an interleaved array including a first group of micropores capable of ejecting a liquid perturbation medium and a second group of micropores capable of ejecting a gaseous perturbation medium.

15. An emissive panel microperturbation fluidic assembly system, the system comprising:

a substrate chuck for engaging an emissive substrate, the emissive substrate having a top surface patterned to form an array of wells;

a liquid suspension, comprising a first liquid and emissive elements, overlying the emissive substrate top surface;

a perturbation medium including emissive elements;

a reservoir containing the perturbation medium, having an outlet port; and

,

a distribution module having an input connected to the reservoir outlet port and an array of micropores capable of ejecting the perturbation medium into the liquid suspension and creating a laminar flow in the liquid suspension along the top surface of the emissive substrate for the purpose of capturing the emissive elements in the wells.

16. The system of claim 15 wherein the perturbation medium is selected from the group consisting of the first liquid, a second liquid, and a gas.

17. The system of claim 15 wherein the distribution module is selected from the group consisting of an array of micro-tubes with micropore orifices and a solid manifold with an array of microholes.

18. The system of claim 15 wherein the micropores eject a perturbation medium in response to a force selected from the group consisting of gravity and a positive pressure.

19. The system of claim 15 wherein the distribution module comprises an interleaved array including a first group of micropores capable of ejecting a liquid perturbation medium and a second group of micropores capable of ejecting a gaseous perturbation medium.

20. The system of claim 15 wherein the array of micropores is located in a position selected from the group consisting of a predetermined distance over a top surface of the liquid suspension and submerged in the liquid suspension.

21. The system of claim 15 wherein the liquid suspension first liquid has a first temperature;

and,

wherein perturbation medium is a liquid medium having a second temperature, greater than the first temperature.

22. The system of claim 15 further comprising:

a pressure module having a pressurized output; and

wherein the array of micropores is submerged in the liquid suspension, and is capable of alternating the application of a positive pressure with a negative pressure into the liquid suspension in response to the pressurized output and creating an oscillating laminar flow in the liquid suspension in response to a periodic cycle of perturbation medium ejection followed by liquid suspension intake.

23. The system of claim 15 further comprising:

a pressure module having a pulsed pressurized output; and

wherein the array of micropores is capable of periodically ejecting the perturbation medium, in response to the pressurized output, and creating a pulsed ejection of perturbation medium in response to the pulsed pressure having a frequency in a range of 0.5 to 100 Hertz.

24. The system of claim 15 further comprising:

a translation module capable of moving the array of micropores in a predetermined pattern with respect to the emissive substrate top surface, synchronously with the ejection of the perturbation medium.

25. The system of claim 15 wherein the laminar flow is created in response to characteristics selected from the group consisting of pitch between micropores, micropore diameters, array material, perturbation medium ejection rate, perturbation medium ejection pressure, first fluid viscosity, first fluid density, liquid perturbation medium viscosity, liquid perturbation medium density, and combinations thereof.

26. The system of claim 15 further comprising:

an emissive element detrapping nozzle capable of ejecting perturbation medium to dislodge misaligned and damaged emissive elements from the wells.

27. The system of claim 15 wherein the distribution module comprises an interleaved array of micropores including a first group of micropores ejecting the perturbation medium and a second group of micropores, submerged in the liquid suspension, aspirating the liquid suspension.

28. An emissive panel microperturbation fluidic assembly system, the system comprising:

a substrate chuck for engaging an emissive substrate, the emissive substrate having a top surface patterned to form an array of wells;

a liquid suspension, comprising a first liquid having a first temperature and emissive elements, overlying the emissive substrate top surface;

a perturbation liquid medium having a second temperature different than the first temperature;

a reservoir containing the perturbation medium, having an outlet port; and

,

a distribution module having an input connected to the reservoir outlet port and an array of micropores capable of ejecting the perturbation medium into the liquid suspension and creating a laminar flow in the liquid suspension along the top surface of the emissive substrate for the purpose of capturing the emissive elements in the wells.

29. The system of claim 28 wherein the array of micropores is located in a position selected from the group consisting of a predetermined distance over a top surface of the liquid suspension and submerged in the liquid suspension.

30. An emissive panel microperturbation fluidic assembly system, the system comprising:

a substrate chuck for engaging an emissive substrate, the emissive substrate having a top surface patterned to form an array of wells;

a liquid suspension, comprising a first liquid and emissive elements, overlying the emissive substrate top surface;

a perturbation medium;

a reservoir containing the perturbation medium, having an outlet port;

a distribution module having an input connected to the reservoir outlet port and an array of micropores capable of ejecting the perturbation medium into the liquid suspension and creating a laminar flow in the liquid suspension along the top surface of the emissive substrate for the purpose of capturing the emissive elements in the wells; and

,

an emissive element detrapping nozzle capable of ejecting perturbation medium to dislodge misaligned and damaged emissive elements from the wells.

31. The system of claim 30 wherein the perturbation medium is selected from the group consisting of the first liquid, a second liquid, and a gas.

32. An emissive panel microperturbation fluidic assembly system, the system comprising:

a substrate chuck for engaging an emissive substrate, the emissive substrate having a top surface patterned to form an array of wells;

a liquid suspension, comprising a first liquid and emissive elements, overlying the emissive substrate top surface;

a perturbation medium;

a reservoir containing the perturbation medium, having an outlet port; and

,

a distribution module having an input connected to the reservoir outlet port and an array of interleaved micropores including a first group of micropores capable of ejecting the perturbation medium into the liquid suspension and a second group of micropores, submerged in the liquid suspension, capable of aspirating the liquid suspension, creating a laminar flow in the liquid suspension along the top surface of the emissive substrate for the purpose of capturing the emissive elements in the wells.

33. The system of claim 32 wherein the perturbation medium includes emissive elements.

34. The system of claim 32 further comprising:

an emissive element detrapping nozzle capable of ejecting perturbation medium to dislodge misaligned and damaged emissive elements from the wells.

35. An emissive panel microperturbation fluidic assembly system, the system comprising:

a substrate chuck for engaging an emissive substrate, the emissive substrate having a top surface patterned to form an array of wells;

a liquid suspension, comprising a first liquid and emissive elements, overlying the emissive substrate top surface;

a perturbation medium;

a reservoir containing the perturbation medium, having an outlet port; and

,

a distribution module having an input connected to the reservoir outlet port and an array of interleaved micropores including a first group of micropores capable of ejecting a liquid perturbation medium into the liquid suspension and a second group of micropores capable of ejecting a gaseous perturbation medium, creating a laminar flow in the liquid suspension along the top surface of the emissive substrate for the purpose of capturing the emissive elements in the wells.