Device modified substrate article and methods for making

• US 10,543,662 B2
• Filed: 04/07/2015
• Issued: 01/28/2020
• Est. Priority Date: 02/08/2012
• Status: Active Grant

• Current Assignee: Corning Incorporated
• Original Assignee: Corning Incorporated
• Inventors: Bellman, Robert Alan, Mazumder, Prantik, Manley, Robert George, Adib, Kaveh
• Primary Examiner(s): Alanko, Anita K
• Application Number:
  US15/302,098
• Publication Number:
  US 20170182744A1
• Time in Patent Office: 1,757 Days
• CPC Class Codes: B32B 17/00 Layered products essentially comprising sheet glass, or glass, slag, or like fibres
• CPC Class Codes: B32B 17/06 comprising glass as the main or only constituent of a layer, next to another layer of a specific material
• CPC Class Codes: B32B 2250/02 2 layers
• CPC Class Codes: B32B 2255/00 Coating on the layer surface
• CPC Class Codes: B32B 2307/308 Heat stability dimensional stability B32B2307/734
• CPC Class Codes: B32B 2307/50 having particular mechanical properties
• CPC Class Codes: B32B 2307/546 Flexural strength; Flexion stiffness
• CPC Class Codes: B32B 2307/702 Amorphous
• CPC Class Codes: B32B 2307/732 Dimensional properties
• CPC Class Codes: B32B 2307/748 Releasability
• CPC Class Codes: B32B 2307/75 Printability
• CPC Class Codes: B32B 2309/02 Temperature
• CPC Class Codes: B32B 2309/04 Time
• CPC Class Codes: B32B 2309/105 Thickness
• CPC Class Codes: B32B 2315/08 Glass
• CPC Class Codes: B32B 2457/00 Electrical equipment
• CPC Class Codes: B32B 27/06 as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to a layer of a particular substance B32B9/045; next to a bituminous or tarry layer B32B11/046; next to a water setting substance layer B32B13/12; next to a metal layer B32B15/08; next to a glass layer B32B17/10; next to a layer formed of natural mineral fibres or particles B32B19/045; next to a wood layer B32B21/08; next to a cellulosic plastic layer B32B23/08; next to a natural or synthetic rubber layer B32B25/08
• CPC Class Codes: B32B 3/266 characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
• CPC Class Codes: B32B 38/0008 Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation heat treatment B32B38/0036
• CPC Class Codes: B32B 7/06 permitting easy separation
• CPC Class Codes: B32B 7/12 : using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: B32B 9/005 : comprising one layer of ceramic material, e.g. porcelain, ceramic tile layered products with at least two ceramic layers composed mainly of ceramic B32B18/00
• CPC Class Codes: B32B 9/04 : comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to a glass layer B32B17/06; layered products with at least two ceramic layers composed mainly of ceramic B32B18/00
• CPC Class Codes: C03C 15/00 : Surface treatment of glass, not in the form of fibres or filaments, by etching etching or surface-brightening compositions, in general C09K13/00
• CPC Class Codes: H01L 21/02043 : Cleaning before device manufacture, i.e. Begin-Of-Line process
• CPC Class Codes: H01L 21/02079 : Cleaning for reclaiming

Abstract

A method of making a device substrate article having a device modified substrate supported on a glass carrier substrate, including: treating at least a portion of the first surface of a device substrate, at least a portion of a first surface of a glass carrier, or a combination thereof, wherein the treating produces a surface having: silicon; oxygen; carbon; and fluorine amounts; and a metal to fluorine ratio as defined herein; contacting the treated surface with an untreated or like-treated counterpart device substrate or glass carrier substrate to form a laminate comprised of the device substrate bonded to the glass carrier substrate; modifying at least a portion of the non-bonded second surface of the device substrate of the laminate with at least one device surface modification treatment; and separating the device substrate having the device modified second surface from the glass carrier substrate.

Claims

1. A method of making a device substrate article having a device modified substrate supported on a glass carrier substrate, comprising:

treating at least a portion of the first surface of a device substrate, at least a portion of the first surface of a glass carrier substrate, or both, wherein the treated surface has;

silicon of about 0.1 to about 14 at %;

oxygen of about 1 to about 40 at %;

carbon of about 3 to 60 at %;

fluorine of about 5 to 65 at %; and

a metal to fluorine (M;

F) atomic ratio of about 1;

1 to about 1;

3;

contacting the treated surface of the device substrate with the glass carrier substrate, or contacting the treated surface of the glass carrier substrate with the device substrate, or contacting the treated surface of the device substrate with the treated surface of the glass carrier substrate to form a laminate comprised of the device substrate bonded to the glass carrier substrate; and

modifying at least a portion of the non-bonded second surface of the device substrate of the laminate with at least one device surface modification treatment to form the device substrate article.

2. The method of claim 1 further comprising heating the laminate in at least one device surface modification treatment at from about 200 to about 700°

C., for 1 second to 1200 minutes; and

separating the device substrate article having the device modified second surface from the glass carrier substrate of the laminate.

3. The method of claim 2 wherein separating comprises at least one of:

peeling the device substrate article from the glass carrier substrate, peeling the glass carrier substrate from the device substrate, or both; and

contacting at least one of the device substrate or the glass carrier substrate with a suction device, a gripper device, a knife edge, or a combination thereof.

4. The method of claim 2 further comprising cleaning the separated glass carrier substrate for repeated reuse in the method.

5. The method of claim 1 wherein treating comprises:

contacting at least one portion of the first glass surface of the glass carrier substrate with a plasma comprised of a polymerizing agent;

an etching agent;

or a combination thereof.

6. The method of claim 5 wherein:

the polymerizing agent comprises at least one of CHF₃, C₄F₈, C₃F₆, C₃F₈, H₂, CH₄, a hydrocarbon having from 3 to 12 carbon atoms and free of fluorine atoms selected from the group consisting of an alkane, an alkene, an alkyl, an aromatic, and combinations thereof; and

the etching agent comprises at least one of CF₄, C₂F₆, NF₃, SF₆, HF, or a combination thereof.

7. The method of claim 1 wherein the laminate has an interfacial bond with an adhesive strength of from about 100 to about 2,000 mJ/m² between the device substrate and the glass carrier substrate, when the device substrate is glass.

8. The method of claim 1 wherein modifying with at least one device surface modification treatment is at least one of:

etching, coating, printing, plating, vapor deposition, sputtering, or combinations thereof.

9. The method of claim 1 wherein the device substrate is glass and has a thickness of from about 10 to about 500 microns, the glass carrier substrate has a thickness of about 200 microns to 3 mm, and the thickness of the interfacial bonding layer between the glass device substrate and the glass carrier substrate is from about a single atomic layer to about 100 nanometers.

10. The method of claim 1 wherein the device substrate has a device modified semiconductor substrate supported on the glass carrier substrate.

11. The method of claim 10 wherein the device substrate is selected from a silicon (Si), a gallium arsenide (GaAs), or a combination thereof.