Thermal print head

• US 10,543,696 B2
• Filed: 05/31/2018
• Issued: 01/28/2020
• Est. Priority Date: 06/08/2017
• Status: Expired due to Fees

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Aoki, Yoichi, Yamamoto, Tadashi, Nakanishi, Masatoshi
• Primary Examiner(s): Mruk, Geoffrey S
• Application Number:
  US15/994,391
• Publication Number:
  US 20180354265A1
• Time in Patent Office: 607 Days
• CPC Class Codes: B41J 2/3351 Electrode layers
• CPC Class Codes: B41J 2/33515 Heater layers
• CPC Class Codes: B41J 2/3352 Integrated circuits
• CPC Class Codes: B41J 2/33525 Passivation layers
• CPC Class Codes: B41J 2/3353 Protective layers
• CPC Class Codes: B41J 2/33535 Substrates
• CPC Class Codes: B41J 2/3354 characterised by geometry
• CPC Class Codes: B41J 2/3357 Surface type resistors

Abstract

A thermal print head includes: a substrate having an obverse surface; a plurality of heat generators arranged on the substrate in a main scanning direction; and a wiring layer provided on the substrate and constituting an energization path to the heat generators. The substrate has a protrusion protruding from the obverse surface and extending in the main scanning direction. The protrusion has a top portion having the largest distance from the obverse surface, and an inclined portion connected to the top portion in a sub-scanning direction. The inclined portion is inclined relative to the obverse surface at a predetermined angle. Each of the plurality of heat generators extends across a boundary between the top portion and the inclined portion. Each of the heat generators is formed on at least a part of the top portion and at least a part of the inclined portion in the sub-scanning direction.

Claims

1. A thermal print head comprising:

a first substrate made of a monocrystalline semiconductor and having a first obverse surface;

a resistor layer supported by the first substrate and having a plurality of heat generators arranged in a main scanning direction; and

a wiring layer supported by the first substrate and constituting an energization path to the plurality of heat generators,

wherein the first substrate has a protrusion made of the monocrystalline semiconductor, protruding from the first obverse surface, and extending in the main scanning direction,

the protrusion has a top portion having a largest distance from the first obverse surface, and a first inclined portion connected to the top portion in a sub-scanning direction and inclined at a first inclination angle relative to the first obverse surface, and

each of the heat generators extends across a boundary between the top portion and the first inclined portion and is formed on at least a part of the top portion in the sub-scanning direction and at least a part of the first inclined portion in the sub-scanning direction.

2. The thermal print head according to claim 1, wherein the protrusion has a second inclined portion connected to the first inclined portion, the second inclined portion being positioned opposite to the top portion in the sub-scanning direction with respect to the first inclined portion,

the second inclined portion is inclined relative to the first obverse surface at a second inclination angle, the second inclination angle being larger than the first inclination angle.

3. The thermal print head according to claim 2, wherein the protrusion has a pair of first inclined portions including the first inclined portion, and the pair of first inclined portions are positioned opposite to each other in the sub-scanning direction relative to the top portion.

4. The thermal print head according to claim 3, wherein the protrusion has a pair of second inclined portions including the second inclined portion, and the pair of second inclined portions are positioned opposite to each other in the sub-scanning direction with the pair of first inclined port ions therebetween.

5. The thermal print head according to claim 2, wherein the first inclined portion is positioned downstream of the top portion in the sub-scanning direction, and each of the heat generators is formed over an entire length of the first inclined portion in the sub-scanning direction.

6. The thermal print head according to claim 5, wherein each of the heat generators is formed on only a part of the top portion in the sub-scanning direction.

7. The thermal print head according to claim 2, wherein each of the heat generators is formed over an entire length of the top portion in the sub-scanning direction, and over an entire length of the first inclined portion in the sub-scanning direction.

8. The thermal print head according to claim 2, wherein each of the heat generators is formed on at least a part of the second inclined portion in the sub-scanning direction.

9. The thermal print head according to claim 8, wherein each of the heat generators is formed on only a part of the second inclined portion in the sub-scanning direction.

10. The thermal print head according to claim 2, wherein an angle between the second inclined portion and the first obverse surface is 54.8°

.

11. The thermal print head according to claim 1, wherein the first substrate is made of Si.

12. The thermal print head according to claim 11, wherein the first obverse surface is a (100) surface.

13. The thermal print head according to claim 1, wherein an angle between the first inclined portion and the first obverse surface is 30.1°

.

14. The thermal print head according to claim 1, further comprising:

a second substrate arranged upstream in the sub-scanning direction relative to the first substrate and having a second obverse surface; and

at least one driver IC mounted on the second obverse surface and performing energization control on the plurality of heat generators.

15. The thermal print head according to claim 14, further comprising a heat dissipator supporting the first substrate and the second substrate.

16. The thermal print head according to claim 14, wherein the first obverse surface of the first substrate is parallel to the second obverse surface of the second substrate.

17. The thermal print head according to claim 14, wherein an angle between the first obverse surface of the first substrate and the second obverse surface of the second substrate is obtuse.

18. The thermal print head according to claim 14, wherein the first substrate has a connecting inclined portion provided at an upstream end of the first substrate in the sub-scanning direction, and the connecting inclined portion is inclined toward a side in a thickness direction of the first substrate with increasing distance from the protrusion in the sub-scanning direction, the side being opposite to a side in the thickness direction toward which the first obverse surface faces, and

wherein the wiring layer includes a plurality of wire bonding pads formed on the connecting inclined portion.