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Thermal print head

  • US 10,543,696 B2
  • Filed: 05/31/2018
  • Issued: 01/28/2020
  • Est. Priority Date: 06/08/2017
  • Status: Expired due to Fees
First Claim
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1. A thermal print head comprising:

  • a first substrate made of a monocrystalline semiconductor and having a first obverse surface;

    a resistor layer supported by the first substrate and having a plurality of heat generators arranged in a main scanning direction; and

    a wiring layer supported by the first substrate and constituting an energization path to the plurality of heat generators,wherein the first substrate has a protrusion made of the monocrystalline semiconductor, protruding from the first obverse surface, and extending in the main scanning direction,the protrusion has a top portion having a largest distance from the first obverse surface, and a first inclined portion connected to the top portion in a sub-scanning direction and inclined at a first inclination angle relative to the first obverse surface, andeach of the heat generators extends across a boundary between the top portion and the first inclined portion and is formed on at least a part of the top portion in the sub-scanning direction and at least a part of the first inclined portion in the sub-scanning direction.

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