Gain integration in Si photonic coherent modulators

• US 10,545,291 B1
• Filed: 08/28/2018
• Issued: 01/28/2020
• Est. Priority Date: 08/28/2018
• Status: Active Grant

• Current Assignee: Cisco Technology, Inc. (Cisco Systems, Inc.)
• Original Assignee: Cisco Technology, Inc. (Cisco Systems, Inc.)
• Inventors: Anderson, Sean P., Siriani, Dominic F., Bovington, Jock T., Traverso, Matthew J., Patel, Vipulkumar
• Primary Examiner(s): Peace, Rhonda S
• Application Number:
  US16/115,432
• Time in Patent Office: 518 Days
• Field of Search: None
• CPC Class Codes: G02B 2006/12061 Silicon
• CPC Class Codes: G02B 2006/12147 Coupler
• CPC Class Codes: G02B 6/1228 Tapered waveguides, e.g. integrated spot-size transformers for coupling with fibres G02B6/305
• CPC Class Codes: G02B 6/14 Mode converters
• CPC Class Codes: G02B 6/2835 formed or shaped by thermal treatment, e.g. couplers
• CPC Class Codes: G02B 6/305 and having an integrated mode-size expanding section, e.g. tapered waveguide
• CPC Class Codes: H01S 3/06754 Fibre amplifiers H01S3/06708 takes precedence
• CPC Class Codes: H01S 5/0085 for modulating the output, i.e. the laser beam is modulated outside the laser cavity
• CPC Class Codes: H01S 5/021 Silicon based substrates
• CPC Class Codes: H01S 5/1014 Tapered waveguide, e.g. spotsize converter H01S5/1064 takes precedence
• CPC Class Codes: H01S 5/1085 Oblique facets
• CPC Class Codes: H01S 5/22 having a ridge or stripe structure
• CPC Class Codes: H01S 5/4012 Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
• CPC Class Codes: H01S 5/5027 Concatenated amplifiers, i.e. amplifiers in series or cascaded

Abstract

The embodiments herein describe an optical transmitter that integrates a SCOWA into a photonic chip that includes a modulator. The embodiments herein place the SCOWA between the laser and the modulator. To accommodate the large mode size of the waveguide in the SCOWA, the photonic chip includes a pair of spot size converters coupled to the input and output of the SCOWA. Rather than amplifying a modulated signal as is typical with an inline amplifier, the SCOWA amplifies a continuous wave (CW) optical signal generated by the laser which introduces less noise and improves the OSNR of the transmitter.

Claims

1. A semiconductor photonic chip, comprising:

an input optical interface configured to receive an optical signal from an optical source;

a first spot size converter comprising an input optically coupled to the input optical interface and an output optically coupled to a slab-coupled optical waveguide amplifier (SCOWA), wherein the SCOWA includes one or more slab regions to filter one or more modes, and an active region located near a border of an optical mode of the optical signal, and wherein the first spot size converter is configured to increase a mode size of the optical signal before transferring the optical signal to the SCOWA; and

a second spot size converter comprising an input optically coupled to the SCOWA and an output optically coupled to an optical component in the photonic chip, wherein the second spot size converter is configured to decrease the mode size of an amplified optical signal received from the SCOWA before transferring the amplified optical signal to the optical component.

2. The semiconductor photonic chip of claim 1, further comprising:

a pocket etched between the first and second spot size converters, wherein the SCOWA is mounted within the pocket.

3. The semiconductor photonic chip of claim 2, wherein a waveguide of the SCOWA for amplifying the optical signal received from the first spot size converter is disposed within the pocket, wherein the first and second spot size converters are arranged in the photonic chip to transfer signals between respective sides of the pocket that are perpendicular to a bottom surface of the pocket.

4. The semiconductor photonic chip of claim 3, wherein the respective sides form angled facets that align optical signals passing therethrough with the waveguide of the SCOWA.

5. The semiconductor photonic chip of claim 1, further comprising:

a plurality of SCOWAs comprising the SCOWA; and

a plurality of pairs of spot size converters, wherein a first converter of each pair of the plurality of pairs of spot size converters optically couples a respective SCOWA of the plurality of SCOWAs to the optical source and a second converter of each pair of the plurality of pairs of spot size converters optically couples the respective SCOWA to the optical component.

6. The semiconductor photonic chip of claim 5, wherein the optical component comprises at least two phase modulators optically coupled to each output of the plurality of SCOWAs.

7. The semiconductor photonic chip of claim 5, further comprising:

a pocket etched between each pair of the plurality of pairs of spot size converters, wherein at least a portion of each of the plurality of SCOWAs is disposed within the pocket.

8. The semiconductor photonic chip of claim 1, wherein the optical component is a coherent modulator.

9. The semiconductor photonic chip of claim 1, wherein the first and second spot size converters each comprises a plurality of prongs disposed in a plurality of layers, wherein a width dimension of at least one of the plurality of prongs tapers in a direction of optical propagation in the first and second spot size converters.

10. An optical transmitter comprising:

a laser configured to output a continuous wave (CW) optical signal; and

a photonic chip optically coupled to the laser, the photonic chip comprising;

a first spot size converter comprising an input optically coupled to the laser and an output optically coupled to a SCOWA, wherein the SCOWA includes one or more slab regions to filter one or more modes, and an active region located near a border of an optical mode of the CW optical signal, and wherein the first spot size converter is configured to adjust a mode size of the CW optical signal before transferring the CW optical signal to the SCOWA,

a modulator, and

a second spot size converter comprising an input optically coupled to the SCOWA and an output optically coupled to the modulator, wherein the second spot size converter is configured to adjust the mode size of an amplified optical signal received from the SCOWA before transferring the amplified optical signal to the modulator.

11. The optical transmitter of claim 10, further comprising:

a pocket etched between the first and second spot size converters, wherein the SCOWA is mounted within the pocket.

12. The optical transmitter of claim 11, wherein a waveguide of the SCOWA for amplifying the CW optical signal received from the first spot size converter is disposed within the pocket, wherein the first and second spot size converters are arranged in the photonic chip to transfer signals between respective sides of the pocket that are perpendicular to a bottom surface of the pocket.

13. The optical transmitter of claim 11, wherein the photonic chip further comprises:

a plurality of SCOWAs; and

a plurality of pairs of spot size converters, wherein a first converter of each pair of the plurality of pairs of spot size converters optically couples a respective SCOWA of the plurality of SCOWAs to the laser and a second converter of each pair of the plurality of pairs of spot size converters optically couples the respective SCOWA to the modulator.

14. The optical transmitter of claim 13, wherein the modulator comprises at least two phase modulators optically coupled to each output of the plurality of SCOWAs.

15. The optical transmitter of claim 13, wherein the pocket is arranged between each pair of the plurality of pairs of spot size converters, wherein at least a portion of each of the plurality of SCOWAs is disposed within the pocket.

16. A semiconductor photonic chip, comprising:

a first spot size converter comprising an input configured to receive an optical signal and an output optically coupled to a slab-coupled optical waveguide amplifier (SCOWA); and

a second spot size converter comprising an input optically coupled to the SCOWA and an output optically coupled to an optical component in the photonic chip, wherein the SCOWA is disposed in an etched pocket disposed between the first and second spot size converters,

wherein the first and second spot size converters are configured to adjust a mode size of optical signals to better match respective mode sizes of waveguides corresponding to the SCOWA and the optical component, and

wherein the SCOWA includes one or more slab regions to filter one or more modes, and an active region located near a border of an optical mode of the optical signal.

17. The semiconductor photonic chip of claim 16, wherein a waveguide of the SCOWA for amplifying the optical signal received from the first spot size converter is disposed within the etched pocket, wherein the first and second spot size converters are arranged in the photonic chip to transfer signals between respective sides of the etched pocket that are perpendicular to a bottom surface of the etched pocket.

18. The semiconductor photonic chip of claim 16, further comprising:

a plurality of SCOWAs comprising the SCOWA; and

a plurality of pairs of spot size converters, wherein a first converter of each pair of the plurality of pairs of spot size converters optically couples a respective SCOWA of the plurality of SCOWAs to an optical source generating the optical signal and a second converter of each pair of the plurality of pairs of spot size converters optically couples the respective SCOWA to the optical component.

19. The semiconductor photonic chip of claim 18, wherein the optical component comprises at least two phase modulators optically coupled to each output of the plurality of SCOWAs.

20. The semiconductor photonic chip of claim 16, wherein the optical component is a coherent modulator.