Device having time division multiplexing capability of heat dissipation

• US 10,545,547 B2
• Filed: 01/15/2019
• Issued: 01/28/2020
• Est. Priority Date: 01/18/2018
• Status: Active Grant

• Current Assignee: Dell Products LP (Dell Technologies Inc.)
• Original Assignee: Dell Products LP (Dell Technologies Inc.)
• Inventors: Zhai, Haifang, Wu, Hendry Xiaoping, Dong, David, Zhou, Yujie
• Primary Examiner(s): Buttar, Mandeep S
• Application Number:
  US16/248,286
• Publication Number:
  US 20190220072A1
• Time in Patent Office: 378 Days
• Field of Search: 361694, 361697, 361695, 361704, 361690, 361703, 36167954, 361709
• CPC Class Codes: G06F 1/206 comprising thermal management
• CPC Class Codes: G06F 2200/201 Cooling arrangements using cooling fluid
• CPC Class Codes: H05K 5/026 having standardized interfaces flash memory cards G06K19/077
• CPC Class Codes: H05K 7/20145 Means for directing air flow, e.g. ducts, deflectors, plenum or guides
• CPC Class Codes: H05K 7/2039 characterised by the heat transfer by conduction from the heat generating element to a dissipating body arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00

Abstract

In the embodiments of the present disclosure, a device having time division multiplexing capability of heat dissipation is provided, including: a first component and a second component arranged in different orientations; and a heat sink arranged to guide an air flow flowing through the heat sink to the first component and the second component respectively during different time periods. Therefore, the device having time division multiplexing capability of heat dissipation of the present disclosure may reduce the number of heat sinks in the device and thus, reduce the overall size of the device.

Claims

1. A device having time division multiplexing capability of heat dissipation, comprising:

a first component and a second component arranged in different orientations; and

a heat sink arranged to guide an air flow flowing through the heat sink respectively to the first component and the second component during different time periods;

wherein the heat sink comprises a rotatable set of cooling fins configured to control a direction of the air flow by rotating orientations of the cooling fins.

2. The device of claim 1, wherein the heat sink is configured to switch the air flow to the second component in response to an air pressure of the air flow exceeding a threshold.

3. The device of claim 1, wherein the heat sink is configured to switch the air flow to the first component in response to an air pressure of the air flow being lower than a threshold.

4. The device of claim 1, wherein the heat sink comprises a coil spring configured to be operable to drive the cooling fins to rotate in response to an air pressure of the air flow being lower or higher than a threshold, so as to change the direction of the air flow.

5. The device of claim 4, wherein the heat sink comprises a fixed baseplate and a rotatable baseplate, between which the coil spring is arranged, and the coil spring is operable to drive the rotatable baseplate.

6. The device of claim 1, wherein the device is an input/output (I/O) card.

7. The device of claim 6, wherein the first component is an M.2 card and the second component is a battery.

8. The device of claim 7, further comprising a third component, wherein the heat sink is arranged on the third component, and the fixed baseplate contacts the third component so as to dissipate heat for the third component.

9. The device of claim 8, wherein the third component is a central processing unit (CPU).

10. An electronic apparatus, comprising the device according to claim 1.

11. An electrical apparatus, comprising the device according to claim 1.