Multilayered electromagnetic assembly

• US 10,546,677 B2
• Filed: 12/13/2013
• Issued: 01/28/2020
• Est. Priority Date: 12/15/2012
• Status: Active Grant

• Current Assignee: Arthur L. Jenkins III
• Original Assignee: Arthur L. Jenkins III
• Inventors: Jenkins, III, Arthur L.
• Primary Examiner(s): Nguyen, Tuyen T
• Application Number:
  US14/652,410
• Publication Number:
  US 20150302967A1
• Time in Patent Office: 2,237 Days
• Field of Search: 336 65, 336 83, 336200, 336206-208, 336232-234
• CPC Class Codes: H01F 2007/062 Details of terminals or connectors for electromagnets
• CPC Class Codes: H01F 2007/068 using printed circuit coils
• CPC Class Codes: H01F 2027/2809 on stacked layers
• CPC Class Codes: H01F 27/22 Cooling by heat conduction through solid or powdered fillings
• CPC Class Codes: H01F 5/00 Coils superconducting coils H01F6/06; fixed inductances of the signal type H01F17/00
• CPC Class Codes: H01F 7/1607 Armatures entering the winding

Abstract

A multilayered electromagnetic assembly. The assembly has a plurality of substantially planar substrate layers, each substrate layer having a cutaway portion. An insulated electrically conductive material is provided, arranged in a spiral configuration on at least two of the substrate layers. The spiral configuration is formed from adjacent the cutaway portion to the edges of the substrate layer. The electrically conductive material is formed substantially on and/or partially recessed or beneath the surface of the substrate layer. The spiral configurations has first and second electrical contacts that are operable to pass electric current to electrical contacts of spiral configurations on other substrate layers. A ferromagnetic core is located through the cutaway portions of the substrate layers. The substrate layers are stacked and an electrical current is passed sequentially through the two or more spiral configurations, thereby generating a magnetic field in the core.

Claims

1. A multilayered electromagnetic assembly, the electromagnetic assembly comprising:

a plurality of substantially planar substrate layers, each substrate layer having a cutaway portion;

an insulated electrically conductive material arranged in a spiral configuration on at least two of the substrate layers, the spiral configuration formed between a position adjacent the cutaway portion to a position adjacent the edge of the substrate layer, the electrically conductive material being formed substantially on and/or partially recessed or beneath the surface of the substrate layer, the spiral configurations having first and second electrical contacts that are operable to pass electric current to electrical contacts of spiral configurations on other substrate layers; and

a ferromagnetic core, located through the cutaway portions of the substrate layers;

wherein the substrate layers may be stacked and an electrical current may be passed sequentially through the two or more spiral configurations, thereby generating a magnetic field in the core.

2. The multilayered electromagnetic assembly of claim 1, wherein the ferromagnetic core is fixed relative to the assembly, thereby functioning as an electromagnet.

3. The multilayered electromagnetic assembly of claim 1, wherein the ferromagnetic core is moveable within the assembly, thereby functioning as a solenoid.

4. The multilayered electromagnetic assembly of claim 1, wherein the cutaway portions, the core and the spiral configurations are substantially circular in plan view.

5. The multilayered electromagnetic assembly of claim 1, wherein the electromagnetic assembly is modular and expandable.

6. The multilayered electromagnetic assembly of claim 1, wherein the electromagnetic assembly is manufactured in an integrated form.

7. A multilayered electromagnetic assembly, the electromagnetic assembly comprising:

a plurality of substantially planar substrate layers, each substrate layer having a cutaway portion;

one or more heat conducting layers substantially dedicated to heat conduction, being provided on one or more portions of one or more of the said planar substrate layers and/or being distinct planar layers;

an insulated electrically conductive material arranged in a spiral configuration on at least two of the substrate layers, the spiral configuration formed between a position adjacent the cutaway portion to a position adjacent the edge of the substrate layer, the electrically conductive material being formed substantially on and/or partially recessed or beneath the surface of the substrate layer, the spiral configurations having first and second electrical contacts that are operable to pass electric current to electrical contacts of spiral configurations on other substrate layers; and

a ferromagnetic core, located through the cutaway portions of the substrate and heat conducting layers;

wherein the substrate layers may be stacked and an electrical current may be passed sequentially through the two or more coils, thereby generating a magnetic field in the core, with any internal heat generated within the electromagnetic assembly being conducted through the one or more heat conducting layers and out to at least one external surface.

8. The multilayered electromagnetic assembly of claim 7, wherein the ferromagnetic core is fixed relative to the assembly, thereby functioning as an electromagnet.

9. The multilayered electromagnetic assembly of claim 7, wherein the ferromagnetic core is moveable within the assembly, thereby functioning as a solenoid.

10. The multilayered electromagnetic assembly of claim 7, wherein the substrate layers further comprise at least one heat conducting portion provided thereon at a position common to some or all of the other substrate layers, the heat conducting portion passing through the substrate to provide a conducting surface on both sides of the layer, thereby enabling heat passing through the heat conducting layers to pass through the overlapping common heat conducting portions provided on each substrate layer.

11. An electromagnetic assembly, comprising:

a bottom substrate layer having a cutaway and a conductive trace spiraling around the cutaway on a bottom portion of the bottom substrate layer;

a top substrate layer having a cutaway and a conductive trace spiraling around the cutaway on a top portion of the top substrate layer;

one or more multilayer stacks positioned between the bottom substrate layer and the top substrate layer, each including;

a lower substrate layer having a cutaway and a conductive trace spiraling around the cutaway on a top portion of the lower substrate layer;

an upper substrate layer having a cutaway and a conductive trace spiraling around the cutaway on a bottom portion of the upper substrate layer; and

a heat conducting layer having a cutaway and disposed between the lower substrate layer and the upper substrate layer;

wherein the respective cutaways of the bottom substrate layer, the top substrate layer, and the layers of the one or more multilayer stacks are aligned relative to one another such that they collectively form a cavity for receiving a ferromagnetic core; and

wherein the respective conductive traces of the bottom substrate layer, the top substrate layer, and the lower and upper substrate layers of the one or more multilayer stacks are electrically connected such that they form a continuous conductive path for the flow of electrical current.

12. The electromagnetic assembly of claim 11, wherein the bottom substrate layer, the top substrate layer, and the layers of the one or more multilayer stacks are each planar.

13. The electromagnetic assembly of claim 11, wherein the respective conductive traces of the bottom substrate layer, the top substrate layer, and the lower and upper substrate layers of the one or more multilayer stacks each have a first end adjacent the cutaway and a second end adjacent an outer edge of the respective layer.

14. The electromagnetic assembly of claim 11, further comprising a ferromagnetic core fixed within the cavity.

15. The electromagnetic assembly of claim 11, further comprising a ferromagnetic core movable within the cavity.

16. The electromagnetic assembly of claim 11, wherein the bottom substrate layer is integrally formed with the lower substrate layer of a first multilayer stack of the one or more multilayer stacks.

17. The electromagnetic assembly of claim 11, wherein the top substrate layer is integrally formed with the upper substrate layer of a first multilayer stack of the one or more multilayer stacks.