Methods for manufacturing a display device

• US 10,546,793 B2
• Filed: 10/05/2018
• Issued: 01/28/2020
• Est. Priority Date: 06/14/2016
• Status: Active Grant

• Current Assignee: InnoLux Corporation
• Original Assignee: InnoLux Corporation
• Inventors: Chang, Chia-Hsiung, Hung, Ting-Kai, Lin, Hsiao-Lang
• Primary Examiner(s): Blum, David S
• Application Number:
  US16/152,560
• Publication Number:
  US 20190043767A1
• Time in Patent Office: 480 Days
• Field of Search: 438 10
• CPC Class Codes: H01L 22/22 Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement testing and repair of stores after manufacture including at wafer scale G11C29/00; fuses per se H01L23/525
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 27/1214 comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Methods for manufacturing a display device are provided. A representative method includes: providing a substrate having a plurality of sub-pixel locations; providing a carrier substrate supporting a plurality of light emitting diodes (LEDs); transferring the plurality of LEDs from the carrier substrate to the substrate; and fixing the plurality of LEDs with respect to the substrate. The method also may include: positioning the substrate within a chamber; and providing an insulator over the substrate.

Claims

1. A method for manufacturing a display device comprising:

providing a substrate having a plurality of sub-pixel locations;

providing a carrier substrate supporting a plurality of light emitting diodes (LEDs);

transferring the plurality of LEDs from the carrier substrate to the substrate;

fixing the plurality of LEDs to the substrate;

positioning the substrate within a chamber;

providing an insulator over the substrate;

providing a first electrode electrically connected to at least one of the plurality of LEDs;

providing a light guide layer over the first electrode and the substrate, wherein the light guide layer serves as a planarization layer;

determining that one of the plurality of LEDs is defective; and

electrically isolating the one of the plurality of LEDs.

2. The method of claim 1, wherein in transferring the plurality of LEDs from the carrier substrate to the substrate, transfer heads are placed in contact with the plurality of LEDs.

3. The method of claim 2, wherein a size of one of the transfer heads contacting one of the plurality of LEDs is smaller than a size of the one of the plurality of LEDs contacting the one of the transfer heads.

4. The method of claim 1, wherein in providing the substrate, a contact via provided in the substrate, one of the plurality of LEDs comprises an electrical contact electrically connected to the contact via, and a size of a top portion of the contact via is greater than a size of the electrical contact.

5. The method of claim 1, further comprising:

providing a wavelength conversion layer over the insulator; and

providing a color filter over the wavelength conversion layer, wherein a width of the wavelength conversion layer is smaller than a width of the color filter.

6. The method of claim 1, wherein in fixing the plurality of LEDs to the substrate, a bonding layer is between the substrate and one of the plurality of LEDs.

7. The method of claim 6, wherein in fixing the plurality of LEDs to the substrate, a bonding material is covering sidewalls of the bonding layer.

8. The method of claim 1, wherein a thickness of a portion of the light guide layer overlapping the first electrode is less than a thickness of another portion of the light guide layer not overlapping the first electrode.

9. The method of claim 1, further comprising providing a wavelength conversion layer over the light guide layer.

10. The method of claim 9, further comprising providing a cover over the wavelength conversion layer.

11. The method of claim 1, further comprising providing a metal layer under one of the plurality of sub-pixel locations, wherein a part of the metal layer serves as a portion of a thin-film transistor and another part of the metal layer does not serve as a portion of a thin-film transistor.

12. The method of claim 1, further comprising repair of the one of the plurality of LEDs before the positioning the substrate within a chamber.

13. The method of claim 1, further comprising providing a passivation layer over the one of the plurality of LEDs.

14. A method for manufacturing a display device comprising:

providing a substrate having a plurality of sub-pixel locations;

providing a carrier substrate supporting a plurality of LEDs;

transferring the plurality of LEDs from the carrier substrate to the substrate;

fixing the plurality of LEDs to the substrate;

positioning the substrate within a chamber;

providing an insulator over the substrate;

providing a wavelength conversion layer over the insulator; and

providing a color filter over the wavelength conversion layer, wherein a width of the wavelength conversion layer is smaller than a width of the color filter.

15. A method for manufacturing a display device comprising:

providing a substrate having a plurality of sub-pixel locations;

providing a metal layer under one of the plurality of sub-pixel locations, wherein a part of the metal layer serves as a thin-film transistor and another part of the metal layer does not serve as a thin-film transistor;

providing a carrier substrate supporting a plurality of LEDs;

transferring the plurality of LEDs from the carrier substrate to the substrate;

fixing the plurality of LEDs to the substrate;

positioning the substrate within a chamber; and

providing an insulator over the substrate.