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Method for fabricating stack die package

  • US 10,546,840 B2
  • Filed: 02/22/2017
  • Issued: 01/28/2020
  • Est. Priority Date: 03/14/2013
  • Status: Active Grant
First Claim
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1. A method comprising:

  • coupling a gate and a source of a first die to a lead frame, said first die comprising said gate and said source that are located on a first surface of said first die and a drain that is located on a second surface of said first die that is opposite said first surface, said first die comprising trench gate technology;

    coupling a source of a second die to said drain of said first die, said second die comprising a gate and said source that are located on a first surface of said second die and a drain that is located on a second surface of said second die that is opposite said first surface;

    coupling a first clip to said lead frame and said drain of said second die;

    coupling a second clip to said lead frame and said gate of said second die, said second clip comprising a first platform and a second platform, said first platform coupled to said gate of said second die and said second platform overlaps a portion of said lead frame coupled to said source of said first die;

    performing a molding process comprising covering said first die, second die, first clip, and second clip with a molding material, said molding process comprises using a flexible film so a portion of an upper surface of said first clip is free of said molding material, said molding process further comprises using a molding tool comprising a mold surface capable of contacting said upper surface of said first clip; and

    using a film to prevent said portion of said upper surface of said first clip from being plated during a plating process, said portion of said upper surface of said first clip is exposed in final package.

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