Method for fabricating stack die package
First Claim
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1. A method comprising:
- coupling a gate and a source of a first die to a lead frame, said first die comprising said gate and said source that are located on a first surface of said first die and a drain that is located on a second surface of said first die that is opposite said first surface, said first die comprising trench gate technology;
coupling a source of a second die to said drain of said first die, said second die comprising a gate and said source that are located on a first surface of said second die and a drain that is located on a second surface of said second die that is opposite said first surface;
coupling a first clip to said lead frame and said drain of said second die;
coupling a second clip to said lead frame and said gate of said second die, said second clip comprising a first platform and a second platform, said first platform coupled to said gate of said second die and said second platform overlaps a portion of said lead frame coupled to said source of said first die;
performing a molding process comprising covering said first die, second die, first clip, and second clip with a molding material, said molding process comprises using a flexible film so a portion of an upper surface of said first clip is free of said molding material, said molding process further comprises using a molding tool comprising a mold surface capable of contacting said upper surface of said first clip; and
using a film to prevent said portion of said upper surface of said first clip from being plated during a plating process, said portion of said upper surface of said first clip is exposed in final package.
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Abstract
In one embodiment, a method can include coupling a gate and a source of a first die to a lead frame. The first die can include the gate and the source that are located on a first surface of the first die and a drain that is located on a second surface of the first die that is opposite the first surface. In addition, the method can include coupling a source of a second die to the drain of the first die. The second die can include a gate and the source that are located on a first surface of the second die and a drain that is located on a second surface of the second die that is opposite the first surface.
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Citations
20 Claims
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1. A method comprising:
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coupling a gate and a source of a first die to a lead frame, said first die comprising said gate and said source that are located on a first surface of said first die and a drain that is located on a second surface of said first die that is opposite said first surface, said first die comprising trench gate technology; coupling a source of a second die to said drain of said first die, said second die comprising a gate and said source that are located on a first surface of said second die and a drain that is located on a second surface of said second die that is opposite said first surface; coupling a first clip to said lead frame and said drain of said second die; coupling a second clip to said lead frame and said gate of said second die, said second clip comprising a first platform and a second platform, said first platform coupled to said gate of said second die and said second platform overlaps a portion of said lead frame coupled to said source of said first die; performing a molding process comprising covering said first die, second die, first clip, and second clip with a molding material, said molding process comprises using a flexible film so a portion of an upper surface of said first clip is free of said molding material, said molding process further comprises using a molding tool comprising a mold surface capable of contacting said upper surface of said first clip; and using a film to prevent said portion of said upper surface of said first clip from being plated during a plating process, said portion of said upper surface of said first clip is exposed in final package. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method comprising:
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coupling a gate and a source of a first die to a lead frame with solder paste, said first die comprising said gate and said source that are located on a first surface of said first die and a drain that is located on a second surface of said first die that is opposite said first surface, said first die comprising split gate technology; coupling a source of a second die to said drain of said first die, said second die comprising a gate and said source that are located on a first surface of said second die and a drain that is located on a second surface of said second die that is opposite said first surface; coupling a first clip to said lead frame and said drain of said second die with solder paste; coupling a second clip to said lead frame and said gate of said second die, said second clip comprising a first platform and a second platform, said first platform coupled to said gate of said second die and said second platform overlaps a portion of said lead frame coupled to said source of said first die; performing a molding process comprising covering said first die, second die, first clip, and second clip with a molding material, said molding process comprises using a flexible film so a portion of an upper surface of said first clip is free of said molding material, said molding process further comprises using a molding tool comprising a mold surface capable of contacting said upper surface of said first clip; and using a film to prevent said portion of said upper surface of said first clip from being plated during a plating process, said portion of said upper surface of said first clip is exposed in final package. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A method comprising:
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coupling a gate and a source of a first die to a lead frame, said first die comprising said gate and said source that are located on a first surface of said first die and a drain that is located on a second surface of said first die that is opposite said first surface, said first die comprising split gate technology; coupling a first clip to said lead frame and said drain of said first die; coupling a second clip to said lead frame; coupling a source of a second die to said first clip; coupling a gate of said second die to said second clip, said second die comprising said gate and said source that are located on a first surface of said second die and a drain that is located on a second surface of said second die that is opposite said first surface, said second die comprising split gate technology, said second clip comprising a first platform and a second platform, said first platform coupled to said gate of said second die and said second platform overlaps a portion of said lead frame coupled to said source of said first die; coupling a third clip to said lead frame and said drain of said second die; performing a molding process comprising covering said first die, second die, first clip, second clip, and third clip with a molding material, said molding process comprises using a flexible film so a portion of an upper surface of said third clip is free of said molding material, said molding process further comprises using a molding tool comprising a mold surface capable of contacting said upper surface of said third clip; and using a film to prevent said portion of said upper surface of said third clip from being plated during a plating process, said portion of said upper surface of said third clip is exposed in final package. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification