Nanosheet FET including all-around source/drain contact
First Claim
1. A method of forming a semiconductor device, the method comprising:
- forming at least one semiconductor nanosheet in a channel region of a semiconductor wafer;
covering a first source/drain epitaxy structure formed on first sacrificial region with a first interlayer dielectric (ILD), and covering the second source/drain epitaxy structure formed on a second sacrificial layer with a second ILD; and
replacing the first and second sacrificial regions and a portion of the first and second ILDs with an electrically conductive material to form an all-around source/drain contact that encapsulates the first and second source/drain epitaxy structures.
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Abstract
A semiconductor device includes a semiconductor wafer having one or more suspended nanosheet extending between first and second source/drain regions. A gate structure wraps around the nanosheet stack to define a channel region located between the source/drain regions. The semiconductor device further includes a first all-around source/drain contact formed in the first source/drain region and a second all-around source/drain contact formed in the second source/drain region. The first and second all-around source/drain contacts each include a source/drain epitaxy structure and an electrically conductive external portion that encapsulates the source/drain epitaxy structure.
29 Citations
16 Claims
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1. A method of forming a semiconductor device, the method comprising:
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forming at least one semiconductor nanosheet in a channel region of a semiconductor wafer; covering a first source/drain epitaxy structure formed on first sacrificial region with a first interlayer dielectric (ILD), and covering the second source/drain epitaxy structure formed on a second sacrificial layer with a second ILD; and replacing the first and second sacrificial regions and a portion of the first and second ILDs with an electrically conductive material to form an all-around source/drain contact that encapsulates the first and second source/drain epitaxy structures. - View Dependent Claims (2, 3, 4, 5, 6, 16)
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7. The method of clam 6, further comprising performing the second selective etching process using an etchant that attacks the sacrificial regions while preserving the buried insulator layer such that the source/drain trench does not extend into the channel region.
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8. A method of forming a nanosheet field effect transistor (FET), the method comprising:
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forming, on a semiconductor wafer, a nanosheet stack, and forming a gate structure that wraps around a portion of the nanosheet stack to define a channel region of the nanosheet FET; forming first and second sacrificial regions on the semiconductor substrate, wherein the gate structure is used to self-align the first and second sacrificial regions with respect to sidewalls of the nanosheet stack; growing, from the first sacrificial region, a first source/drain epitaxy structure that contacts a first side of the nanosheet stack, and growing, from the second sacrificial region, a second source/drain epitaxy structure that contacts an opposing second side of the nanosheet stack; and replacing the first and second sacrificial regions with an electrically conductive material to form an all-around source/drain contacts that encapsulate the source/drain epitaxy structures. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15)
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Specification