Reinforced heat-transfer device, heat-transfer system, and method of reinforcing a heat-transfer device

• US 10,551,133 B2
• Filed: 09/19/2013
• Issued: 02/04/2020
• Est. Priority Date: 09/20/2012
• Status: Active Grant

• Current Assignee: Thermal Corporation (Roper Technologies, Inc.)
• Original Assignee: Thermal Corporation (Roper Technologies, Inc.)
• Inventors: Toth, Jerome E., Dore, Leonard N., Grove, Doug, Cornell, Austin
• Primary Examiner(s): Schermerhorn, Jr., Jon T.
• Application Number:
  US14/031,685
• Publication Number:
  US 20140076517A1
• Time in Patent Office: 2,329 Days
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28F 2225/00 Reinforcing means
• CPC Class Codes: F28F 9/007 Auxiliary supports for elements
• CPC Class Codes: H05K 7/20936 Liquid coolant with phase change

Abstract

A heat-transfer device and system for conducting heat from a heat source. The heat-transfer device can include an evaporator having one or more reinforcement elements occupying respective recesses defined in a body of the evaporator, wherein the reinforcement elements are more resistant to deformation under clamp load than the material of the evaporator body, while still having desirable heat conductivity. In some embodiments, the heat-transfer system includes a plurality of serially coupled evaporators for generating a respective vapor; at least one reinforcement element interposed between adjacent evaporators; and a condenser in fluid communication with the evaporator.

Claims

1. A heat-transfer system for conducting heat from a heat source, the heat-transfer system comprising:

a plurality of serially coupled evaporators for generating a respective vapor;

a plurality of reinforcement elements interposed between adjacent evaporators; and

a condenser in fluid communication with at least one of the evaporators;

wherein at least one of the evaporators includes an enclosed vapor chamber defined at least in part by a first wall and a second, oppositely spaced wall, wherein the first wall includes a blind recessed portion that opens to an environment exterior of the evaporator, wherein a first one of the reinforcement elements is coupled to an exterior surface of the first wall and is disposed at least partially within the blind recessed portion, and wherein a second one of the reinforcement elements is coupled to an exterior surface of the second wall.

2. The heat-transfer system of claim 1, wherein the blind recessed portion is a first blind recessed portion, wherein the second wall includes a second blind recessed portion along the exterior surface of the second wall, and wherein the second reinforcement element is disposed at least partially within the second blind recessed portion.

3. The heat transfer device of claim 2, wherein the at least one evaporator has a length and at least one of the first recessed portion and the second recessed portion extends along the entire length of the at least one evaporator.

4. The heat-transfer system of claim 1, wherein the first reinforcement element includes an exterior surface that is substantially flush with a portion of the exterior surface of the first wall when the first reinforcement element is at least partially disposed within the blind recessed portion.

5. The heat-transfer system of claim 1, wherein the first wall has a first material yield strength, the first reinforcement element has a second material yield strength, and the second material yield strength is higher than the first material yield strength.

6. The heat-transfer system of claim 1, wherein the first reinforcement element comprises a first material and the first wall comprises a second material different from the first material, and wherein the first material has a greater hardness than the second material.

7. The heat-transfer system of claim 1, wherein the first reinforcement element is glued, soldered, or brazed to the blind recessed portion.

8. The heat-transfer system of claim 1, wherein the first reinforcement element includes copper.

9. The heat-transfer system of claim 1, further comprising a clamp for compressing the evaporators together, the clamp including two end plates and a coupling member extending between the end plates.

10. The heat-transfer system of claim 1, wherein the first wall is annealed, and wherein the first reinforcement element is not annealed.

11. The heat-transfer system of claim 1, wherein the first wall is a monolithic wall.

12. The heat-transfer system of claim 1, wherein the first one of the reinforcement elements is a monolithic reinforcement element having a surface exposed to the environment exterior of the evaporator.

13. An evaporator for generating a vapor, the evaporator comprising:

a first wall;

a second wall spaced from the first wall;

an enclosed vapor chamber disposed between the first and the second walls;

a first monolithic reinforcement element having a first surface coupled to an exterior surface of the first wall, and a second, opposite surface exposed to an environment exterior of the evaporator; and

a second reinforcement element having an exterior surface coupled to an exterior surface of the second wall,

wherein the first wall is located between the first reinforcement element and the vapor chamber at all points along the first reinforcement element.

14. The evaporator of claim 13, wherein the first reinforcement element includes an exterior surface that is substantially flush with adjacent portions of the first wall.

15. The evaporator of claim 13, wherein the first wall has a first material yield strength, the first reinforcement element has a second material yield strength, and the second material yield strength is higher than the first material yield strength.

16. The evaporator of claim 13, wherein the first reinforcement element comprises a first material and the first wall comprises a second material different from the first material, and wherein the first material has a greater hardness than the second material.

17. The evaporator of claim 13, wherein the first reinforcement element is soldered to the first wall.

18. The evaporator of claim 13, wherein the first reinforcement element includes copper.

19. The evaporator of claim 13, wherein the first and second walls are substantially parallel to each other.

20. The evaporator of claim 13, wherein the first wall is annealed, and wherein the first reinforcement element is not annealed.

21. The heat-transfer system of claim 13, wherein the first wall is a monolithic wall.

22. A heat-transfer system comprising:

a plurality of serially coupled evaporators for generating a respective vapor, the serially coupled evaporators spaced apart from one another along a first direction, at least one of the evaporators including an enclosed vapor chamber defined at least in part by a wall having an exterior surface and a recessed portion, the exterior surface and the recessed portion together formed from one piece of material;

a reinforcement element coupled to the wall in the recessed portion the reinforcement element including an outer surface that extends along a second direction that is different from the first direction and contacts an electronic device, the electronic device disposed adjacent the at least one of the evaporators along the first direction;

a condenser in fluid communication with the at least one of the evaporators, the condenser spaced from the at least one of the evaporators along the second direction; and

a clamp for compressing the evaporators together along the first direction, the clamp including two end plates and a coupling member extending between the end plates.

23. The heat-transfer system of claim 22, wherein the wall has a first material yield strength, the reinforcement element has a second material yield strength, and the second material yield strength is higher than the first material yield strength.

24. The heat-transfer system of claim 22, wherein the reinforcement element comprises a first material and the wall comprises a second material different from the first material, and wherein the first material has a greater hardness than the second material.

25. The heat-transfer system of claim 22, wherein the reinforcement element is disposed between the electronic device and the at least one of the evaporators, and wherein the reinforcement element comprises a first layer adjacent to the electronic device which has a coefficient of thermal expansion that is substantially similar to that of the electronic device, and a second layer adjacent to the at least one of the evaporators which has a coefficient of thermal expansion that is substantially similar to the at least one of the evaporators.

26. The heat-transfer system of claim 22, wherein the wall is annealed, and wherein the reinforcement element is not annealed.

27. The heat-transfer system of claim 22, wherein the wall is a first wall, the exterior surface is a first exterior surface, the recessed portion is a first recessed portion, and the reinforcement element is a first reinforcement element, wherein the at least one of the evaporators includes a second wall spaced from the first wall, wherein the second wall includes a second exterior surface and a second recessed portion, the second exterior surface and the second recessed portion together formed from one piece of material, and wherein a second reinforcement element is coupled to the second wall in the second recessed portion.

28. The heat transfer device of claim 22, wherein the at least one evaporator has a length and the recessed portion extends along the entire length of the at least one evaporator.

29. The heat-transfer system of claim 22, wherein the recessed portion is at least partially defined by a second exterior surface offset from the first exterior surface and a first transition surface extending between the first and second exterior surfaces, wherein the first exterior surface, the second exterior surface, and the transition surface are each surfaces of the same piece of material.

30. The heat-transfer system of claim 29, wherein the second exterior surface and the transition surface are machined surfaces.

31. A heat-transfer system comprising:

a plurality of serially coupled evaporators for generating a respective vapor, the serially coupled evaporators spaced apart from one another along a first direction, at least one of the evaporators including an enclosed vapor chamber defined at least in part by a first wall and a second, oppositely spaced wall;

a plurality of monolithic reinforcement elements interposed between adjacent evaporators, wherein a first one of the monolithic reinforcement elements is coupled to the first wall in a blind recessed portion of the first wall, the blind recessed portion of the first wall and an exterior surface of the first wall being formed from one piece of material, wherein the first wall is disposed between the vapor chamber and the first reinforcement element at all points along the first reinforcement element, wherein a second one of the monolithic reinforcement elements is coupled to the second wall, wherein the first and second reinforcement elements each extend along a second direction different from the first direction;

a condenser in fluid communication with the at least one of the evaporators, the condenser spaced from the at least one of the evaporators along the second direction; and

a clamp for compressing the evaporators together along the first direction, the clamp including two end plates and a coupling member extending between the end plates.

32. The heat-transfer system of claim 31, wherein the vapor chamber includes a wick structure coupled to an interior surface of the first wall.