Light source assembly, back light moudle and display device

• US 10,551,673 B2
• Filed: 05/15/2018
• Issued: 02/04/2020
• Est. Priority Date: 06/16/2017
• Status: Active Grant

• Current Assignee: BOE Technology Group Co., Ltd., Chongqing BOE Optoelectronics Technology Co., Ltd. (BOE Technology Group Co., Ltd.)
• Original Assignee: Chongqing BOE Optoelectronics Technology Co., Ltd. (BOE Technology Group Co., Ltd.)
• Inventors: Tan, Sen, Lei, Sijun, Gao, Liang, Sun, Yansheng, Luo, Wencheng, Fu, Wei, Du, Qihai, Liu, Song, Geng, Yuxu, Ma, Hebing, Shao, Na
• Primary Examiner(s): Raleigh, Donald L
• Application Number:
  US16/334,193
• Publication Number:
  US 20190204686A1
• Time in Patent Office: 630 Days
• CPC Class Codes: G02F 1/1336 Illuminating devices
• CPC Class Codes: G02F 1/133621 providing coloured light G02F1/133617, G02F1/133533 take precedence
• CPC Class Codes: H01S 5/005 Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping H01S5/026, H01S5/18388 take precedence
• CPC Class Codes: H01S 5/0239 Combinations of electrical or optical elements
• CPC Class Codes: H01S 5/4093 Red, green and blue [RGB] generated directly by laser action or by a combination of laser action with nonlinear frequency conversion

Abstract

The present disclosure provides a light source assembly, a backlight module, and a display device. The light source assembly includes: at least one semiconductor laser, at least one beam expander, and a package; the at least one semiconductor laser and the at least one beam expander are in one-to-one correspondence and are all encapsulated in the package; each of the at least one beam expander is disposed on a side of a light emitting surface of a corresponding one of the at least one semiconductor laser; light emitted by each of the at least one semiconductor laser is expanded by a corresponding one of the at least one beam expander and then emitted from the package.

Claims

1. A light source assembly comprising:

at least one semiconductor laser, at least one beam expander, and a package;

wherein the at least one semiconductor laser and the at least one beam expander are in one-to-one correspondence and are all encapsulated in the package;

each of the at least one beam expander is disposed on a side of a light emitting surface of a corresponding one of the at least one semiconductor laser;

light emitted by each of the at least one semiconductor laser is expanded by a corresponding one of the at least one beam expander and then emitted from the package.

2. The light source assembly of claim 1, wherein three semiconductor lasers are encapsulated in the package and are respectively a red light semiconductor laser, a green light semiconductor laser, and a blue light semiconductor laser;

light emitted by the three semiconductor lasers is mixed into white light in the package after being respectively expanded by corresponding beam expanders.

3. The light source assembly of claim 1, wherein the at least one beam expander comprises a concave lens.

4. The light source assembly of claim 3, wherein light generated by the at least one semiconductor laser is oscillated and amplified in a resonant cavity of the least one semiconductor laser and propagates along a plane of an active region of the least one semiconductor laser, and the light emitted by the semiconductor laser is parallel to an optical axis of the concave lens.

5. The light source assembly of claim 1, wherein the package is made of transparent silica gel.

6. The light source assembly of claim 1, wherein the package has a length of 3.8 mm, a width of 1.0 mm, and a height of 0.6 mm, respectively.

7. A backlight module comprising the light source assembly of claim 1.

8. A display device comprising the backlight module of claim 7.

9. The light source assembly of claim 1, wherein only one semiconductor laser is encapsulated in the package and is a white light semiconductor laser.

10. The light source assembly of claim 1, wherein the at least one semiconductor laser comprises:

a first electrode and a second electrode opposite to each other;

a P region and an N region both between the first electrode and the second electrode; and

an active region between the P region and the N region.