Module for a video wall

• US 10,553,148 B2
• Filed: 11/11/2016
• Issued: 02/04/2020
• Est. Priority Date: 11/13/2015
• Status: Active Grant

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Martin, Alexander, Schwarz, Thomas, Singer, Frank, Plossl, Andreas
• Primary Examiner(s): Lam, Vinh T
• Application Number:
  US15/775,574
• Publication Number:
  US 20180322824A1
• Time in Patent Office: 1,180 Days
• CPC Class Codes: G06F 3/1446 display composed of modules, e.g. video walls
• CPC Class Codes: G09G 2300/026 Video wall, i.e. juxtaposition of a plurality of screens to create a display screen of bigger dimensions
• CPC Class Codes: G09G 2300/0426 Layout of electrodes and connections
• CPC Class Codes: G09G 2300/0452 Details of colour pixel setup, e.g. pixel composed of a red, a blue and two green components
• CPC Class Codes: G09G 2330/02 Details of power systems and of start or stop of display operation
• CPC Class Codes: G09G 3/32 semiconductive, e.g. using light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A module for a video wall includes a first light emitting chip of an image pixel connecting to a first power line by a first electrical terminal, the first light emitting chip connects to a third power line by a second electrical terminal, a second light emitting chip of the image pixel connects to a second power line by the first electrical terminal, the second light emitting chip of the image pixel connects to a fourth power line by the second electrical terminal, the first and/or the second power line are/is a surface metallization, including contact sections, a light emitting chip is arranged on a contact section, at least between contact sections of a first and of a second power line an insulation layer is provided on a carrier, the insulation layer includes openings above the contact sections, and the light emitting chips are arranged in the openings.

Claims

1. A module for a video wall comprising a carrier comprising a multiplicity of image pixels, wherein an image pixel is formed by at least one first and one second light emitting chip, each light emitting chip comprises a first and a second electrical terminal, the first light emitting chip of an image pixel connects to a first power line by the first electrical terminal, the first light emitting chip of an image pixel connects to a third power line by the second electrical terminal, the second light emitting chip of the image pixel connects to a second power line by the first electrical terminal, the second light emitting chip of the image pixel connects to a fourth power line by the second electrical terminal, the first power line is in the form of a first surface metallization and the second power line is in the form of a second surface metallization, the first surface metallization comprises a first contact section, the second surface metallization comprises a second contact section, the first light emitting chip is arranged on the first contact section, the second light emitting chip is arranged on the second contact section, at least between the first contact section of the first power line and the second contact section of the second power line an insulation layer is arranged on the carrier, the insulation layer comprises a first opening above the first contact section and a second opening above the second contact section, and the first light emitting chip is arranged in the first opening and the second light emitting chip is arranged in the second opening.

2. The module according to claim 1, wherein the image pixels each comprise a third light emitting chip, the third light emitting chip comprises a first and a second electrical terminal, the third light emitting chip is connected to the first power line by the first electrical terminal, and the third light emitting chip is connected to a fifth power line by the second electrical terminal.

3. The module according to claim 1, wherein the image pixels each comprise a third light emitting chip, the third light emitting chip comprises a first and a second electrical terminal, the third light emitting chip is connected to a sixth power line by the first electrical terminal, and the third light emitting chip is connected to the fifth power line by the second electrical terminal.

4. The module according to claim 1, wherein the first power lines and the second power lines are led in one plane, and the third, fourth and fifth power lines are led in a second plane.

5. The module according to claim 4, wherein the first, the second and the third power lines are led via plated-through holes to a common connecting plane, and a fourth, a fifth and a sixth power line are led via plated-through holes to a common connecting plane.

6. The module according to claim 1, wherein the light emitting chips are arranged in rows, and the first and the second power line are arranged at opposite sides of the rows.

7. The module according to claim 6, wherein plated-through holes are provided between first power lines of two adjacent rows of light emitting chips to lead the first and/or the second and/or the third power line into a common connecting plane.

8. The module according to claim 6, wherein the light emitting chip comprises a stepped configuration on the side facing the contact section such that the light emitting chip does not bear by its entire side on the contact section.

9. The module according to claim 6, wherein, between the light emitting chips of an image pixel, insulation barriers are at least partly arranged on the carrier in order to improve an electrical insulation of the light emitting chips from one another.

10. The module according to claim 6, wherein an electrically conductive contact film is arranged between the contact section and the assigned light emitting chip, said contact film electrically connecting the light emitting chip to the contact section.

11. The module according to claim 8, wherein the light emitting chip is soldered onto the contact section by a solder connection by an AuSn solder connection, and a solidus temperature of the solder connection is above 260°

C.

12. The module according to claim 8, wherein the light emitting chip connects to the contact section with the aid of a friction welding connection, and/or the light emitting chip connects to the contact section with the aid of a soldering.

13. The module according to claim 8, wherein an insulation web is provided between contact sections of a first and of a second power line.

14. The module according to claim 8, wherein the light emitting chip is mechanically secured on a contact section with the aid of an electrically insulating adhesive, and tips of a metallic contact of the light emitting chip penetrate through the adhesive and are in electrical contact with the contact section.

15. The module according to claim 6, wherein at least two light emitting chips are arranged in an opening of the insulation layer.

16. A module for a video wall comprising a carrier comprising a multiplicity of image pixels, wherein an image pixel is formed by at least one first and one second light emitting chip, each light emitting chip comprises a first and a second electrical terminal, the first light emitting chip of an image pixel connects to a first power line by the first electrical terminal, the first light emitting chip of an image pixel connects to a third power line by the second electrical terminal, the second light emitting chip of the image pixel connects to a second power line by the first electrical terminal, the second light emitting chip of the image pixel connects to a fourth power line by the second electrical terminal, the first and/or the second power line are/is in the form of a surface metallization, the surface metallization comprises contact sections, a light emitting chip is arranged on a contact section, at least between contact sections of a first and of a second power line an insulation layer is provided on the carrier, the insulation layer comprises openings above the contact sections, and the light emitting chips are arranged in the openings, wherein the first power lines and the second power lines are led in one plane, and the third, fourth and fifth power lines are led in a second plane, wherein the first, the second and the third power lines are led via plated-through holes to a common connecting plane, and a fourth, a fifth and a sixth power line are led via plated-through holes to a common connecting plane.

17. A module for a video wall comprising a carrier comprising a multiplicity of image pixels, wherein an image pixel is formed by at least one first and one second light emitting chip, each light emitting chip comprises a first and a second electrical terminal, the first light emitting chip of an image pixel connects to a first power line by the first electrical terminal, the first light emitting chip of an image pixel connects to a third power line by the second electrical terminal, the second light emitting chip of the image pixel connects to a second power line by the first electrical terminal, the second light emitting chip of the image pixel connects to a fourth power line by the second electrical terminal, the first power line is in the form of a first surface metallization and the second power line is in the form of a second surface metallization, the first surface metallization comprises a first contact section, the second surface metallization comprises a second contact section, the first light emitting chip is arranged on the first contact section, the second light emitting chip is arranged on the second contact section, at least between the first contact section of the first power line and the second contact section of the second power line an insulation layer is arranged directly on the carrier.