Chip electronic component and board having the same
First Claim
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1. A chip electronic component comprising:
- a substrate;
a first internal coil part disposed on one surface of the substrate;
a second internal coil part disposed on the other surface of the substrate opposing one surface thereof;
a via penetrating through the substrate to connect the first and second internal coil parts to each other;
first and second via pads disposed on one surface and another surface of the substrate, respectively, to cover the via; and
a magnetic body enclosing the first and second internal coil parts and containing a magnetic metal powder,wherein the first and second via pads extend in a direction toward portions of the first and second internal coil parts adjacent thereto, and are disposed to be biased toward the first and second internal coil parts,the substrate has a through hole which is disposed in a central portion of the substrate, and the through hole is filled with a magnetic material to form a core part,end portions of the first and second internal coil parts extend to form lead portions exposed to at least one surface of the magnetic body, anda portion of the first or second internal coil part disposed directly adjacent to the respective first or second via pad includes a first side having a recess accommodating the respective first or second via pad, and a second side opposing the first side and having a curvature that remains substantially the same as a curvature of a neighboring area in the first or second internal coil part disposed directly adjacent to the respective first or second via pad.
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Abstract
There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.
45 Citations
13 Claims
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1. A chip electronic component comprising:
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a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; first and second via pads disposed on one surface and another surface of the substrate, respectively, to cover the via; and a magnetic body enclosing the first and second internal coil parts and containing a magnetic metal powder, wherein the first and second via pads extend in a direction toward portions of the first and second internal coil parts adjacent thereto, and are disposed to be biased toward the first and second internal coil parts, the substrate has a through hole which is disposed in a central portion of the substrate, and the through hole is filled with a magnetic material to form a core part, end portions of the first and second internal coil parts extend to form lead portions exposed to at least one surface of the magnetic body, and a portion of the first or second internal coil part disposed directly adjacent to the respective first or second via pad includes a first side having a recess accommodating the respective first or second via pad, and a second side opposing the first side and having a curvature that remains substantially the same as a curvature of a neighboring area in the first or second internal coil part disposed directly adjacent to the respective first or second via pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification