Semiconductor device, method for manufacturing semiconductor device, and electronic appliance having semiconductor device
First Claim
1. A method for manufacturing a semiconductor device comprising:
- forming an oxide semiconductor layer;
forming an insulating layer over the oxide semiconductor layer;
forming a first oxide insulating film over the insulating layer;
removing the first oxide insulating film; and
forming a conductive layer over the insulating layer.
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Accused Products
Abstract
To provide a semiconductor device including an oxide semiconductor layer with high and stable electrical characteristics, the semiconductor device is manufactured by forming a first insulating layer, forming oxide over the first insulating layer and then removing the oxide n times (n is a natural number), forming an oxide semiconductor layer over the first insulating layer, forming a second insulating layer over the oxide semiconductor layer, and forming a conductive layer over the second insulating layer. Alternatively, the semiconductor device is manufactured by forming the oxide semiconductor layer over the first insulating layer, forming the second insulating layer over the oxide semiconductor layer, forming the oxide over the second insulating layer and then removing the oxide n times (n is a natural number), and forming the conductive layer over the second insulating layer.
125 Citations
13 Claims
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1. A method for manufacturing a semiconductor device comprising:
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forming an oxide semiconductor layer; forming an insulating layer over the oxide semiconductor layer; forming a first oxide insulating film over the insulating layer; removing the first oxide insulating film; and forming a conductive layer over the insulating layer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for manufacturing a semiconductor device comprising:
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forming an oxide semiconductor layer over a first insulating layer; forming a source electrode and a drain electrode which are in contact with the oxide semiconductor layer; forming a second insulating layer over the oxide semiconductor layer; forming a first oxide insulating film over the second insulating layer; removing the first oxide insulating film; forming a gate electrode over the second insulating layer; and forming a third insulating layer over the gate electrode, wherein the first oxide insulating film includes aluminum oxide. - View Dependent Claims (9, 10, 11, 12, 13)
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Specification