Board unit

• US 10,555,428 B2
• Filed: 05/10/2017
• Issued: 02/04/2020
• Est. Priority Date: 05/20/2016
• Status: Active Grant

• Current Assignee: Autonetworks Technologies, Ltd. (Sumitomo Corporation), Sumitomo Electric Industries Limited (Sumitomo Corporation), Sumitomo Wiring Systems Limited (Sumitomo Corporation)
• Original Assignee: Autonetworks Technologies, Ltd. (Sumitomo Corporation)
• Inventors: Ikeda, Jun, O, Munsoku
• Primary Examiner(s): Semenenko, Yuriy
• Application Number:
  US16/302,839
• Publication Number:
  US 20190208658A1
• Time in Patent Office: 1,000 Days
• CPC Class Codes: H01R 12/721 cooperating directly with the edge of the rigid printed circuits
• CPC Class Codes: H01R 13/5213 Covers
• CPC Class Codes: H05K 5/0047 having a two-part housing enclosing a PCB
• CPC Class Codes: H05K 5/0069 having connector relating features for connecting the connector pins with the PCB or for mounting the connector body with the housing
• CPC Class Codes: H05K 5/06 Hermetically-sealed casings specially adapted for small components H05K5/0095
• CPC Class Codes: H05K 5/069 Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft

Abstract

The present disclosure provides a board unit including a circuit board, a connector portion mounted on the circuit board, and a case housing the circuit board. The case includes a lower case having an upper opening; an upper cover covers the upper opening, and an opening portion is formed in a side wall of the case, through which the connector portion extends inside and outside the side wall. The upper cover includes an inner circumferential surface that forms at least a portion of the opening portion and a predetermined gap with an outer circumferential surface of the connector portion. A groove portion is formed continuously along the inner circumferential surface, is open in the inner circumferential surface and is in communication with the gap. A size of the gap and a size of the groove portion are configured to form a water film by water droplets entering the case.

Claims

1. Aboard unit comprising:

a circuit board;

a connector portion that is mounted on the circuit board; and

a case that houses the circuit board,

wherein the case includes;

a lower case that has an upper opening;

an upper cover that covers the upper opening of the lower case;

and

an opening portion that is formed in a side wall of the case, and through which the connector portion extends inside and outside the side wall,

the upper cover includes;

an inner circumferential surface that is provided so as to form at least a portion of the opening portion and form a predetermined gap with an outer circumferential surface of the connector portion; and

a groove portion that is formed continuously along the inner circumferential surface, and is open in the inner circumferential surface and is in communication with the gap, and

a size of the gap and a size of the groove portion are set such that a water film is formed in the gap by water droplets entering the case from outside in a state where the groove portion is full of water.

2. The board unit according to claim 1,

wherein an upper recess portion that forms a portion of the opening portion and surrounds an upper side of the outer circumferential surface of the connector portion is formed in a side wall portion of the upper cover,

a lower recess portion that forms another portion of the opening portion and surrounds a lower side of the outer circumferential surface of the connector portion is formed in a side wall portion of the lower case, and

the groove portion is formed in the inner circumferential surface that forms the upper recess portion.